Patents by Inventor Bae Soon Son

Bae Soon Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140131081
    Abstract: Disclosed herein is a printed circuit board, including: a base substrate on which a connection pad is formed; a dam spaced apart from one side of the connection pad; and a protective layer formed to surround the dam.
    Type: Application
    Filed: March 14, 2013
    Publication date: May 15, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Jin Cho, Se Kyung Lee, Bae Soon Son, Suk Jin Ham