Abstract: A semiconductor memory device includes a memory core which receives a specific stress item and a pattern item from an external source, a switch part which provides the power supplied from an external source and a switch control part which controls the switch part. The memory core responds to the specific stress item to be tested for stability, and the switch control part isolates the switch part if the specific stress item is supplied to the memory core two or more times.

Abstract: A semiconductor memory device includes a memory core which receives a specific stress item and a pattern item from an external source, a switch part which provides the power supplied from an external source and a switch control part which controls the switch part. The memory core responds to the specific stress item to be tested for stability, and the switch control part isolates the switch part if the specific stress item is supplied to the memory core two or more times.

Abstract: A memory test circuit comprises a memory which outputs stored data through n-bit data output pins, and a built-in self test (BIST) unit. The BIST unit writes test data in the memory, and by comparing the test data output from the memory with expected data, determines a failure cell address in the memory. The BIST unit generates k preliminary failure signals having failure information indicating whether the test data correspond with the expected data, and outputs the k preliminary failure signals for m cycles of a clock signal, by outputting k/m preliminary failure signals each cycle as first through k/m failure signals. In the memory test circuit and test system, the BIST unit testing a memory and generating a failure signal is disposed in a memory apparatus and a failure analysis circuit analyzing a failure signal output by the BIST unit is disposed in the test apparatus.

Abstract: A memory test circuit and a test system are provided. The memory test circuit comprises a memory which outputs stored data through n-bit data output pins, and a built-in self test (BIST) unit. The BIST unit writes test data in the memory, and by comparing the test data output from the memory with expected data, determines a failure cell address in the memory. The BIST unit generates k preliminary failure signals having failure information indicating whether the test data correspond with the expected data, and outputs the k preliminary failure signals for m cycles of a clock signal, by outputting k/m preliminary failure signals each cycle as first through k/m failure signals. When a test operation is performed, the memory divides the n-bit data output pins into eight groups to make the groups correspond to respective areas in the memory, and when a repair operation is performed, repair is performed in each area of the memory corresponding to the eight groups of the data output pins.