Patents by Inventor Bae Tewoo

Bae Tewoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for dividing wafer into individual chips
    Patent number: 10297501
    Abstract: A wafer has a front face that is partitioned by a plurality of streets crossing with each other into a plurality of regions in each of which a device is formed. A surface protective tape is adhered to the front face of the wafer. Then a laser beam having a wavelength transparent to the wafer is irradiated along the streets from a rear face side of the wafer to form a modified layer inside the wafer. Then the wafer is ground from the rear face side to thin the wafer. When the surface protective tape is applied, the surface protective tape is heated. When the modified layer is formed, cracks extend from the modified layer to the front face of the wafer. When ground, the wafer is divided into individual chips with the cracks serving as boundaries.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: May 21, 2019
    Assignee: DISCO CORPORATION
    Inventors: Masamitsu Agari, Bae Tewoo
  • PROCESSING METHOD FOR WAFER
    Publication number: 20180082897
    Abstract: A wafer has a front face that is partitioned by a plurality of streets crossing with each other into a plurality of regions in each of which a device is formed. A surface protective tape is adhered to the front face of the wafer. Then a laser beam having a wavelength transparent to the wafer is irradiated along the streets from a rear face side of the wafer to form a modified layer inside the wafer. Then the wafer is ground from the rear face side to thin the wafer. When the surface protective tape is applied, the surface protective tape is heated. When the modified layer is formed, cracks extend from the modified layer to the front face of the wafer. When ground, the wafer is divided into individual chips with the cracks serving as boundaries.
    Type: Application
    Filed: September 20, 2017
    Publication date: March 22, 2018
    Inventors: Masamitsu Agari, Bae Tewoo