Abstract: A thermal print head and method of creating the same, in which a metal film and a cooling compound are inserted between a resistance substrate and a cooling board. This construction can prevent the formation of air bubbles in the cooling compound between the resistance substrate and the cooling compound. This construction can also reduce local heat accumulation and thereby reduce uneven priming contrast since even if an air bubble is formed it will have a thickness less than the thickness of a double-sided tape that acts as an adhesive between the resistance substrate and the cooling board. In addition, a clearer image can be obtained even in the hi-speed priming because the metal film having a thermal conductivity higher than that of the cooling compound is inserted inside the cooling compound. This increases the overall thermal conductivity between the resistance substrate and the cooling board and thus improves heat dissipation within the system.

Abstract: A thermal print head includes a boat on which the substrate, driving IC and printed circuit board are mounted, the boat being mounted on a heat sink which material and shape are changeable according to the mechanical change of the system.

Abstract: There is disclosed a high resolution thermal printing device including a 128-bit uni-directional integrated circuit, which is specially ordered, instead of a general integrated circuit. The electrical connection of the device is achieved by wedge wire bonding employing wedges. The integrated circuit has a plurality of power source connecting pads which are aligned on the central portion the integrated circuit in parallel with the transverse direction thereof.