Abstract: The present invention relates to a time-division duplex (TDD) antenna apparatus which can reduce signal loss, and thereby minimize the noise figure (NF) of a system and extend uplink coverage of the system, by separating a transmitter circuit from a receiver circuit of the antenna apparatus, and disposing a low noise amplifier (LNA) of the receiver circuit between a reception antenna and a reception filter of the receiver. A time-division duplex antenna apparatus according to an embodiment of the present invention includes: a transmitter which includes at least one transmission antenna module and transmits a downlink signal through a first path; a receiver which includes at least one reception antenna module and receives an uplink signal through a second path that is separated from the first path without any overlapping portions thereof; and a controller which controls the transmitter and the receiver in a time-division duplex manner.

Abstract: A three-dimensional image display device includes: a display panel assembly including a display panel including pixels which alternately displays first and second images, and a data driver which transmits data voltages to the pixels; a backlight unit which provides light to the display panel assembly; and a shutter member including first and second shutters, where the backlight unit emits the light during light emitting periods, the light emitting periods includes first light emitting periods, during which the first image is displayed, and second light emitting periods, during which the second image is displayed, the first light emitting periods and the second light emitting periods alternate, and the first shutter is opened during at least two open periods, which are between neighboring second light emitting periods of the second light emitting periods and temporally spaced apart from each other.

Abstract: A three-dimensional image display device includes: a display panel assembly including a display panel including pixels which alternately displays first and second images, and a data driver which transmits data voltages to the pixels; a backlight unit which provides light to the display panel assembly; and a shutter member including first and second shutters, where the backlight unit emits the light during light emitting periods, the light emitting periods includes first light emitting periods, during which the first image is displayed, and second light emitting periods, during which the second image is displayed, the first light emitting periods and the second light emitting periods alternate, and the first shutter is opened during at least two open periods, which are between neighboring second light emitting periods of the second light emitting periods and temporally spaced apart from each other.

Abstract: A thermal print head and method of creating the same, in which a metal film and a cooling compound are inserted between a resistance substrate and a cooling board. This construction can prevent the formation of air bubbles in the cooling compound between the resistance substrate and the cooling compound. This construction can also reduce local heat accumulation and thereby reduce uneven priming contrast since even if an air bubble is formed it will have a thickness less than the thickness of a double-sided tape that acts as an adhesive between the resistance substrate and the cooling board. In addition, a clearer image can be obtained even in the hi-speed priming because the metal film having a thermal conductivity higher than that of the cooling compound is inserted inside the cooling compound. This increases the overall thermal conductivity between the resistance substrate and the cooling board and thus improves heat dissipation within the system.

Abstract: A thermal print head includes a boat on which the substrate, driving IC and printed circuit board are mounted, the boat being mounted on a heat sink which material and shape are changeable according to the mechanical change of the system.

Abstract: There is disclosed a high resolution thermal printing device including a 128-bit uni-directional integrated circuit, which is specially ordered, instead of a general integrated circuit. The electrical connection of the device is achieved by wedge wire bonding employing wedges. The integrated circuit has a plurality of power source connecting pads which are aligned on the central portion the integrated circuit in parallel with the transverse direction thereof.