Abstract: Proposed is an incubator that comprises a body including a bottom plate to lay a baby on an upper portion, a fixed frame connected at a lower portion to a side of the body, an elevation frame connected to the fixed frame and configured to be moved up and down with respect to the fixed frame, a heater configured in conjunction with movement of the elevation frame and being moved up and down with up-down movement of the elevation frame, a hood connected to the elevation frame and configured to open and close a top of the body by moving up and down in conjunction with movement of the elevation frame, and a driving mechanism for moving up and down the elevation frame and the hood, and further comprises a tilting means of tilting the heater at a predetermined angle in conjunction with up-down movement of the elevation frame.

Abstract: The present invention relates to an incubator comprising: a main body part which has a space formed therein for accommodating an infant; supports of which the lower portions are connected to one side of the main body part; a hood driving part provided with one or more multi joint link units and pivotably coupled to the supports; a hood which is disposed above the main body part, and opens and closes the main body part by means of the operation of the hood driving part; and a heater which is mounted to the hood driving part and changes position so that a heat radiating part faces away from the main body part when the main body part is closed, and faces the main body part when the main body part is open. Thus, the present invention can be easily converted for use as a warmer.

Abstract: A semiconductor package includes a package substrate including at least one through-hole in a chip mounting region, a plurality of wiring patterns at a top surface of the package substrate. The wiring patterns include respective extension portions and respective landing pads. At least some of the landing pads obliquely extend toward the through-hole. Conductive bumps are formed on corresponding landing pads to connect to a semiconductor chip mounted on the chip mounting region of the package substrate. A molding material extends between the top surface of the package substrate and the semiconductor chip and fills the through-hole.

Abstract: A semiconductor package includes a package substrate including at least one through-hole in a chip mounting region, a plurality of wiring patterns at a top surface of the package substrate. The wiring patterns include respective extension portions and respective landing pads. At least some of the landing pads obliquely extend toward the through-hole. Conductive bumps are formed on corresponding landing pads to connect to a semiconductor chip mounted on the chip mounting region of the package substrate. A molding material extends between the top surface of the package substrate and the semiconductor chip and fills the through-hole.

Abstract: A semiconductor package includes a package substrate including at least one through-hole in a chip mounting region, a plurality of wiring patterns at a top surface of the package substrate. The wiring patterns include respective extension portions and respective landing pads. At least some of the landing pads obliquely extend toward the through-hole. Conductive bumps are formed on corresponding landing pads to connect to a semiconductor chip mounted on the chip mounting region of the package substrate. A molding material extends between the top surface of the package substrate and the semiconductor chip and fills the through-hole.

Abstract: A semiconductor package includes a package substrate including at least one through-hole in a chip mounting region, a plurality of wiring patterns at a top surface of the package substrate. The wiring patterns include respective extension portions and respective landing pads. At least some of the landing pads obliquely extend toward the through-hole. Conductive bumps are formed on corresponding landing pads to connect to a semiconductor chip mounted on the chip mounting region of the package substrate. A molding material extends between the top surface of the package substrate and the semiconductor chip and fills the through-hole.