Patents by Inventor Baek KI

Baek KI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240173187
    Abstract: Proposed is an incubator that comprises a body including a bottom plate to lay a baby on an upper portion, a fixed frame connected at a lower portion to a side of the body, an elevation frame connected to the fixed frame and configured to be moved up and down with respect to the fixed frame, a heater configured in conjunction with movement of the elevation frame and being moved up and down with up-down movement of the elevation frame, a hood connected to the elevation frame and configured to open and close a top of the body by moving up and down in conjunction with movement of the elevation frame, and a driving mechanism for moving up and down the elevation frame and the hood, and further comprises a tilting means of tilting the heater at a predetermined angle in conjunction with up-down movement of the elevation frame.
    Type: Application
    Filed: July 5, 2021
    Publication date: May 30, 2024
    Inventors: Dong-Soo JEONG, Baek-Ki HAM
  • Publication number: 20230091711
    Abstract: The present invention relates to an incubator comprising: a main body part which has a space formed therein for accommodating an infant; supports of which the lower portions are connected to one side of the main body part; a hood driving part provided with one or more multi joint link units and pivotably coupled to the supports; a hood which is disposed above the main body part, and opens and closes the main body part by means of the operation of the hood driving part; and a heater which is mounted to the hood driving part and changes position so that a heat radiating part faces away from the main body part when the main body part is closed, and faces the main body part when the main body part is open. Thus, the present invention can be easily converted for use as a warmer.
    Type: Application
    Filed: March 24, 2021
    Publication date: March 23, 2023
    Inventors: Baek-Ki HAM, Dong-Soo JEONG, Jae-Hyeong PARK
  • Patent number: 10607905
    Abstract: A semiconductor package includes a package substrate including at least one through-hole in a chip mounting region, a plurality of wiring patterns at a top surface of the package substrate. The wiring patterns include respective extension portions and respective landing pads. At least some of the landing pads obliquely extend toward the through-hole. Conductive bumps are formed on corresponding landing pads to connect to a semiconductor chip mounted on the chip mounting region of the package substrate. A molding material extends between the top surface of the package substrate and the semiconductor chip and fills the through-hole.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: March 31, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Baek Ki, Tark-Hyun Ko, Kun-Dae Yeom, Yong-Kwan Lee, Keun-Ho Jang
  • Publication number: 20190295909
    Abstract: A semiconductor package includes a package substrate including at least one through-hole in a chip mounting region, a plurality of wiring patterns at a top surface of the package substrate. The wiring patterns include respective extension portions and respective landing pads. At least some of the landing pads obliquely extend toward the through-hole. Conductive bumps are formed on corresponding landing pads to connect to a semiconductor chip mounted on the chip mounting region of the package substrate. A molding material extends between the top surface of the package substrate and the semiconductor chip and fills the through-hole.
    Type: Application
    Filed: June 14, 2019
    Publication date: September 26, 2019
    Inventors: Baek KI, Tark-Hyun KO, Kun-Dae YEOM, Yong-Kwan LEE, Keun-Ho JANG, Sang Jin HYUN
  • Patent number: 10361135
    Abstract: A semiconductor package includes a package substrate including at least one through-hole in a chip mounting region, a plurality of wiring patterns at a top surface of the package substrate. The wiring patterns include respective extension portions and respective landing pads. At least some of the landing pads obliquely extend toward the through-hole. Conductive bumps are formed on corresponding landing pads to connect to a semiconductor chip mounted on the chip mounting region of the package substrate. A molding material extends between the top surface of the package substrate and the semiconductor chip and fills the through-hole.
    Type: Grant
    Filed: July 4, 2017
    Date of Patent: July 23, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Baek Ki, Tark-Hyun Ko, Kun-Dae Yeom, Yong-Kwan Lee, Keun-Ho Jang
  • Publication number: 20180076105
    Abstract: A semiconductor package includes a package substrate including at least one through-hole in a chip mounting region, a plurality of wiring patterns at a top surface of the package substrate. The wiring patterns include respective extension portions and respective landing pads. At least some of the landing pads obliquely extend toward the through-hole. Conductive bumps are formed on corresponding landing pads to connect to a semiconductor chip mounted on the chip mounting region of the package substrate. A molding material extends between the top surface of the package substrate and the semiconductor chip and fills the through-hole.
    Type: Application
    Filed: July 4, 2017
    Publication date: March 15, 2018
    Inventors: Baek KI, Tark-Hyun KO, Kun-Dae YEOM, Yong-Kwan LEE, Keun-Ho JANG
  • Patent number: D544849
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: June 19, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Ho Yang, Baek-Ki Kim
  • Patent number: D547276
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: July 24, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Ho Yang, Baek-Ki Kim
  • Patent number: D551186
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: September 18, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Ho Yang, Baek-Ki Kim
  • Patent number: D555610
    Type: Grant
    Filed: September 29, 2005
    Date of Patent: November 20, 2007
    Inventors: Jun Ho Yang, Baek-ki Kim
  • Patent number: D735151
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: July 28, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sangil Park, Dae Kyung Ahn, Baek Ki Kim, Jinsoo Park, JunWon Bae
  • Patent number: D753620
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: April 12, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sangil Park, Dae Kyung Ahn, Baek Ki Kim, Jinsoo Park, JunWon Bae
  • Patent number: D915371
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: April 6, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang-Sin Cho, In-Shik Kim, Baek-Ki Kim, Jae-Ho Baik
  • Patent number: D975699
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: January 17, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Baek-Ki Kim, Han Kim, Hyun-Keun Son, Bum-Soo Park
  • Patent number: D986233
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: May 16, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Baek-Ki Kim, Han Kim, Hyun-Keun Son, Bum-Soo Park
  • Patent number: D1012074
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: January 23, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Baek-Ki Kim, Bumsoo Park
  • Patent number: D1037236
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: July 30, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Baek-Ki Kim, Bum-Soo Park, Seung-Ho Jang, Yoon-Young Kim
  • Patent number: D1037237
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: July 30, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Baek-Ki Kim, Bum-Soo Park, Seung-Ho Jang, Yoon-Young Kim
  • Patent number: D1040797
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: September 3, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Baek-Ki Kim, Bum-Soo Park, Seung-Ho Jang, Yoon-Young Kim
  • Patent number: D1042429
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: September 17, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Baek-Ki Kim, Bum-Soo Park, Seung-Ho Jang, Yoon-Young Kim