Abstract: A method of operating a memory system includes setting a secured area in a volatile memory device of the memory system during a secure mode, writing secure data in the secured area during the secure mode, and when a write command for the secured area is inputted in a normal operation mode, preventing a write operation from occurring and generating an error signal. Accordingly, the secured area is set in the volatile memory device so that the hacking and the data forgery may be prevented.

Abstract: A method of operating a memory system includes setting a secured area in a volatile memory device of the memory system during a secure mode, writing secure data in the secured area during the secure mode, and when a write command for the secured area is inputted in a normal operation mode, preventing a write operation from occurring and generating an error signal. Accordingly, the secured area is set in the volatile memory device so that the hacking and the data forgery may be prevented.

Abstract: A semiconductor module assembly is provided. The semiconductor module assembly includes a motherboard, a socket, and a semiconductor module. The motherboard includes an opening for receiving the semiconductor module, the opening including at least three sides. The socket is disposed in the opening along at least a first side, second side, and third side of the at least three sides. The semiconductor module is disposed in the socket. The semiconductor module includes at least one semiconductor device mounted on a module board. The socket includes at least a first side along the first side of the opening, and a second side along the second side of the opening, and the semiconductor module electrically connects to the motherboard through at least the first and second sides of the socket.

Abstract: A die package includes a substrate, a die mounted on the substrate, and a ZQ resistor disposed in the die package and connected to the substrate and the die. The ZQ resistor may be used to calibrate impedance of the die.

Abstract: A memory module includes a plurality of buses and a plurality of memory chips arranged close to each other along each of the plurality of buses. An N-th memory chip, where N is an integer, of the plurality of memory chips is connected to any one of the plurality of buses, and each of the other memory chips of the plurality of memory chips, except for the N-th memory chip, is connected to the other one of the plurality of buses.

Abstract: A memory module includes a plurality of buses and a plurality of memory chips arranged close to each other along each of the plurality of buses. An N-th memory chip, where N is an integer, of the plurality of memory chips is connected to any one of the plurality of buses, and each of the other memory chips of the plurality of memory chips, except for the N-th memory chip, is connected to the other one of the plurality of buses.