Abstract: In an embodiment, a modular space transformer for use in a probe card assembly includes a bottom plate, a guide plate, and a top plate. The guide plate is configured for mounting in a cut-out of the bottom plate. The guide plate has a first surface and a second surface and additionally has a first plurality of spaced electrical connections disposed in a plurality of apertures formed through the guide plate for providing electrical connections between a plurality of test probe contacts and a plurality of guide plate contacts. The top plate has a plurality of spaced electrical contacts disposed through the top plate with at least one of the plurality of guide plate contacts electrically connected to at least one of the plurality of spaced electrical contacts.

Abstract: An approach for assembling and repairing probe assemblies using laser welding includes aligning a beam element to a post element on a probe substrate. The beam element is positioned in contact with the post element on the probe substrate. The beam element is then attached to the post element on the probe substrate by laser welding the beam element to the post element on the probe substrate. The approach may include the use of a vacuum capillary pickup tool to align and position the beam element. The vacuum capillary pickup tool may also operate in conjunction with a laser beam delivery system for guiding the laser beam to the correct location for welding and also to assist in removing gases and debris attributable to the laser welding process. The approach allows probe elements to be connected directly to a probe substrate without requiring an intermediate layer.

Abstract: A probe test card assembly for testing a device under test includes interposer probes to connect a printed circuit board to a substrate. The probe test card assembly includes a printed circuit board, a substrate and a substrate holder. A plurality of test probes is connected to the substrate for making electrical contact with the device under test. A plurality of interposer probes is attached to the substrate for providing electrical connections between the substrate and the printed circuit board. The substrate holder holds the substrate in position with respect to the printed circuit board so that the interposer probes contact the printed circuit board. The interposer probes may be arranged in interposer probe groups to facilitate maintenance and replacement of the interposer probes. Hardstop elements may also be used to protect the interposer probes.

Abstract: A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.

Abstract: A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.

Abstract: A probe card is provided including a first substrate, a second substrate, and a plurality of conductive wires extending between the first substrate and the second substrate. The conductive wires are fixed (a) at a first end to a contact of the first substrate, and (b) at a second end to a contact of the second substrate.

Abstract: In an embodiment, a modular space transformer for use in a probe card assembly includes a bottom plate, a guide plate, and a top plate. The guide plate is configured for mounting in a cut-out of the bottom plate. The guide plate has a first surface and a second surface and additionally has a first plurality of spaced electrical connections disposed in a plurality of apertures formed through the guide plate for providing electrical connections between a plurality of test probe contacts and a plurality of guide plate contacts. The top plate has a plurality of spaced electrical contacts disposed through the top plate with at least one of the plurality of guide plate contacts electrically connected to at least one of the plurality of spaced electrical contacts.

Abstract: A probe test card assembly for testing of a device under test includes a printed circuit board (PCB), a space transformer, a probe head structure and a flexible interconnect structure. The space transformer has a first plurality of electrical contacts disposed thereon for providing electrical connections with a plurality of contacts disposed on the PCB and a second plurality of electrical contacts disposed thereon for making contact with a plurality of test probes. Each test probe from the plurality of test probes has a first end for making electrical contact with a device under test and a second end for making electrical contact with one of the electrical contacts from the second plurality of electrical contacts on the space transformer. The flexible interconnect structure provides electrical connections between the first plurality of electrical contacts on the space transformer and the plurality of electrical contacts on the PCB.

Abstract: A probe test card assembly for testing of a device under test includes a printed circuit board, a substrate and a substrate support structure. The substrate support structure holds the substrate in position with respect to the printed circuit board. The substrate support structure may include one or more alignment members, one or more hard stop members and/or a support plate attached to the printed circuit board for positioning the substrate with respect to the printed circuit board. The one or more alignment members may extend through the printed circuit board and be connected to the one or more printed circuit board stiffener members. The probe test card assembly may also employ a proximity detection feature to indicate when the substrate is in a particular position with respect to the printed circuit board.

Abstract: An approach is provided for fabricating cantilever probes. The approach generally includes using various techniques to secure a cantilever probe in a manner to allow a tip to be created on the cantilever probe. For example, embodiments of the invention include attaching the cantilever probe to a carrier structure by clamping the cantilever probe to the carrier structure, bonding the cantilever probe to the carrier structure via a post feature on the cantilever probe, or applying a material on the carrier structure and substantially around and in contact with the cantilever probe to affix the cantilever probe to the carrier structure. A probe tip can then be formed on the cantilever probe while the cantilever probe is attached or affixed to the carrier structure. The cantilever probe can then be removed and bonded to a probe substrate.

Abstract: A probe card assembly is provided. The probe card assembly includes a substrate layer defining a plurality of apertures and a plurality of probes. Each of the probes has a base and a tip. The base of each probe is configured to be at least partially inserted within one of the plurality of apertures.

Abstract: A method for fabricating beams for a probe card includes dividing a large beam panel into smaller sub-panels before attaching the beams to corresponding posts on a substrate. Each sub-panel may have a sufficient number of beams to test several devices under test. The beam sub-panels may be aligned to the space transformer using alignment fiducials on the beam sub-panels that correspond to opposing alignment features formed in the space transformer or other substrate. Special tie-bars may be formed between: (1) rows, for example, of beams and the frame/frame splines (i.e., quadrant tie-bars); and (2) adjacent beams within any such rows on the beam panel (i.e., beam tie-bars). The approach may also include the use of tip tie-bars and/or tail tie-bars.

Abstract: A method of processing a probe element includes (a) providing a probe element comprising a first conductive material, and (b) coating only a tip portion of the probe element with a second conductive material.

Abstract: An approach for fabricating cantilever probes for a probe card assembly includes forming posts on conductive traces on a substrate. A beam panel having beam elements formed therein is aligned to the substrate so that the beam elements are in contact with the plurality of posts. Each beam element is in contact with a post at a portion of the beam element so that both a first end portion and a second end portion overhang the post element. Each beam element is also attached to the beam panel by the first end portion. The beam elements are bonded to the plurality of posts. The first end portion of each beam element is cut, for example using an electrode, laser ablation or by dicing, to release the beam element from the beam panel. The beam panel is then removed, leaving the beam elements attached to the posts.

Abstract: A probe test card assembly for testing of a device under test includes a printed circuit board, a substrate and a substrate support structure. The substrate support structure holds the substrate in position with respect to the printed circuit board. The substrate support structure may include one or more alignment members, one or more hard stop members and/or a support plate attached to the printed circuit board for positioning the substrate with respect to the printed circuit board. The one or more alignment members may extend through the printed circuit board and be connected to the one or more printed circuit board stiffener members. The probe test card assembly may also employ a proximity detection feature to indicate when the substrate is in a particular position with respect to the printed circuit board.

Abstract: A method and apparatus for performing automated alignment of probes of a probe card is provided. The desired horizontal location for a probe is compared with the actual horizontal position for the probe to determine a horizontal correction distance and a horizontal correction direction to correct a horizontal alignment for the probe. A first tool automatically corrects the horizontal alignment for the probe based on the horizontal correction distance and the horizontal correction direction. Upon determining that an actual vertical position of the probe is closer to the probe card than a desired vertical position, a second tool automatically changes the actual vertical position of the probe to the desired vertical position. Upon determining that the actual vertical position of the probe is farther from the probe card than the desired vertical position, a third tool automatically changes the actual vertical position of the probe to the desired vertical position.

Abstract: A probe test card assembly for testing a device under test includes interposer probes to connect a printed circuit board to a substrate. The probe test card assembly includes a printed circuit board, a substrate and a substrate holder. A plurality of test probes is connected to the substrate for making electrical contact with the device under test. A plurality of interposer probes is attached to the substrate for providing electrical connections between the substrate and the printed circuit board. The substrate holder holds the substrate in position with respect to the printed circuit board so that the interposer probes contact the printed circuit board. The interposer probes may be arranged in interposer probe groups to facilitate maintenance and replacement of the interposer probes. Hardstop elements may also be used to protect the interposer probes.

Abstract: A probe card assembly includes a substrate and a plurality of probes bonded to a surface of the substrate. The probe card assembly also includes a reinforcing layer provided on the surface of the substrate. The reinforcing layer is in contact with a lower portion of each of the probes, where a remaining portion of each of the probes is free from the reinforcing layer. The reinforcing layer may be a composite reinforcing layer that includes multiple layers of material to achieve a particular result. According to one embodiment of the invention, the reinforcing layer includes a powder layer disposed on the substrate and an adhesive layer formed on the powder layer. The composite reinforcing layer may be compliant to allow the probes to flex and move as intended, without limiting deflection capability. The composite reinforcing layer may be removable to allow access to probes for repair.

Abstract: A probe card assembly for providing electrical interconnection between a semiconductor device to be tested and a test system is provided. The probe card assembly includes a plurality of probes supported by a support substrate, each of the plurality of probes including an end portion extending away from the support substrate. The end portion is configured to be electrically connected to a semiconductor device to be tested. The probe card assembly also includes a dielectric sheet positioned between the support substrate and the end portion of the plurality of probes such that the probes extend through apertures defined by the dielectric sheet.

Abstract: An approach for assembling and repairing probe assemblies using laser welding includes aligning a beam element to a post element on a probe substrate. The beam element is positioned in contact with the post element on the probe substrate. The beam element is then attached to the post element on the probe substrate by laser welding the beam element to the post element on the probe substrate. The approach may include the use of a vacuum capillary pickup tool to align and position the beam element. The vacuum capillary pickup tool may also operate in conjunction with a laser beam delivery system for guiding the laser beam to the correct location for welding and also to assist in removing gases and debris attributable to the laser welding process. The approach allows probe elements to be connected directly to a probe substrate without requiring an intermediate layer.