Abstract: To provide a semiconductor device capable of effectively releasing heat from a semiconductor element, the semiconductor device includes a semiconductor element, a heat sink connected thermally to the semiconductor element and a coolant flow channel formed facing the heat sink. The heat sink is integrally composed of multiple cooling fins projecting toward the coolant flow channel. A linear base of each of the multiple cooling fins inclines relative to a direction in which a coolant is supplied through the coolant flow channel. An inclination of a linear base of each of the cooling fins arranged adjacent to each other in the direction relative to the coolant flow direction is substantially opposite from each other.

Abstract: A power conversion apparatus includes a semiconductor element, a plurality of lead frames, a flow-passage formation body, an insulating portion, a metal joining material, and a resin sealing portion. The plurality of lead frames are electrically connected to the semiconductor element. The flow-passage formation body forms a coolant flow passage in which a coolant flows. The insulating portion is arranged between the lead frame and the flow-passage formation body to provide insulation between the lead frame and the flow-passage formation body. The metal joining material joins the insulating portion and the flow-passage formation body. The resin sealing portion seals the semiconductor element and the lead frames. The semiconductor element and the lead frames are integrated with the flow-passage formation body to form a semiconductor cooling assembly by the resin sealing portion.

Abstract: A power conversion apparatus includes a semiconductor element, a plurality of lead frames, a flow-passage formation body, an insulating portion, a metal joining material, and a resin sealing portion. The plurality of lead frames are electrically connected to the semiconductor element. The flow-passage formation body forms a coolant flow passage in which a coolant flows. The insulating portion is arranged between the lead frame and the flow-passage formation body to provide insulation between the lead frame and the flow-passage formation body. The metal joining material joins the insulating portion and the flow-passage formation body. The resin sealing portion seals the semiconductor element and the lead frames. The semiconductor element and the lead frames are integrated with the flow-passage formation body to form a semiconductor cooling assembly by the resin sealing portion.

Abstract: To provide a semiconductor device capable of effectively releasing heat from a semiconductor element, the semiconductor device includes a semiconductor element, a heat sink connected thermally to the semiconductor element and a coolant flow channel formed facing the heat sink. The heat sink is integrally composed of multiple cooling fins projecting toward the coolant flow channel. A linear base of each of the multiple cooling fins inclines relative to a direction in which a coolant is supplied through the coolant flow channel. An inclination of a linear base of each of the cooling fins arranged adjacent to each other in the direction relative to the coolant flow direction is substantially opposite from each other.

Abstract: A method of producing a reactor equipped with a core in which a coil is disposed, comprises: preparing one of a vessel and a casing; preparing a positioning member with fins; putting a magnetic powder/resin mixture in the one of the vessel and the casing; stirring the magnetic powder/resin mixture within the one of the vessel and the casing using the fins of the positioning member; arranging a coil and the positioning member within the magnetic powder/resin mixture; and solidifying the magnetic powder/resin mixture to make the core including the positioning member and the fins.

Abstract: The exemplary embodiment provides a method of manufacturing a molded article including a component insert-molded in a molding material mixed with solid powder. The method includes an injecting step of injecting the molding material and the solid powder into a molding die, an agitating step of agitating the molding material and the solid powder within the molding die to disperse the solid powder in the molding material, and an embedding step of pressing and embedding the component into the agitated mixture of the molding material and the solid powder while vibrating at least one of the component and the molding die.

Abstract: The method of manufacturing a molded article including a component insert-molded in a molding material mixed with solid powder includes an injecting step of injecting the molding material and the solid powder into a molding die, an agitating step of agitating the molding material and the solid powder within the molding die to disperse the solid powder in the molding material, and an embedding step of pressing and embedding the component into an agitated mixture of the molding material and the solid powder.

Abstract: A reactor which may be employed in an inverter for automotive vehicles. The reactor includes a coil, a core, a casing, and a positioning member. The core is made of a solidified magnetic powder/resin mixture and has the coil embedded therein. The positioning member is disposed in the casing to position the coil relative to the casing and equipped with fins configured to stir the magnetic powder/resin mixture before solidified. Specifically, the positioning member is designed to perform two functions: one is to fix the location of the coil within the casing, and the other is to stir the magnetic powder/resin mixture through the fins, thus eliminating the need for removing a portion of the magnetic powder/resin mixture adhered to the fins, which leads to improved productivity of the reactor.

Abstract: The method of manufacturing a molded article including a component insert-molded in a molding material mixed with solid powder includes an injecting step of injecting the molding material and the solid powder into a molding die, an agitating step of agitating the molding material and the solid powder within the molding die to disperse the solid powder in the molding material, and an embedding step of pressing and embedding the component into an agitated mixture of the molding material and the solid powder.

Abstract: The exemplary embodiment provides a method of manufacturing a molded article including a component insert-molded in a molding material mixed with solid powder. The method includes an injecting step of injecting the molding material and the solid powder into a molding die, an agitating step of agitating the molding material and the solid powder within the molding die to disperse the solid powder in the molding material, and an embedding step of pressing and embedding the component into the agitated mixture of the molding material and the solid powder while vibrating at least one of the component and the molding die.