Patents by Inventor Bahman Tavassoli
Bahman Tavassoli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11859915Abstract: Embodiments relate to a system and method for dissipating heat from a heat generating component. The system and method an assembly of a fenestrated housing and a plenum and positioning of the assembly relate to the heat generating component. The plenum accommodates a fluid mover relative to the fenestrated housing. The fenestrations function to support multi-directional fluid flow created by the fluid mover and accommodated by the fenestrations, which function as ports to direct fluid with respect to the heat generating component.Type: GrantFiled: January 31, 2019Date of Patent: January 2, 2024Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
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Patent number: 10955202Abstract: Embodiments relate to a system with a primary body in communication with at least one heat source. A chamber housed within the primary body includes a boundary to separate the heat source from fluid contact and a secondary body housed in the chamber. The secondary body includes a conduit and a cover in communication with the conduit wherein the cover has a fluid flow inlet extending into the conduit and the conduit includes a series of convection ports to exhaust fluid into the chamber. Upon surging through the convection ports, the fluid comes in contact with the plenum of the primary body and dissipates the heat generated from the heat source and transferred to the primary body. An outlet, separate from the inlet, removes the fluid from the chamber.Type: GrantFiled: June 28, 2017Date of Patent: March 23, 2021Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati, Anatoly Pikovsky
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Patent number: 10692798Abstract: Embodiments of the invention related to using the fin length of the heat sink extending from an entrance of the heat sink to an interior sectional wall as the heat transfer element to achieve high thermal performance. The sectional wall(s) of the heat sink function to isolate fluid flow communication between the heat sink sections of fin fields, thereby preventing a flow coupling between the fin fields.Type: GrantFiled: April 9, 2015Date of Patent: June 23, 2020Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
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Publication number: 20180003451Abstract: Embodiments relate to a system with a primary body in communication with at least one heat source. A chamber housed within the primary body includes a boundary to separate the heat source from fluid contact and a secondary body housed in the chamber. The secondary body includes a conduit and a cover in communication with the conduit wherein the cover has a fluid flow inlet extending into the conduit and the conduit includes a series of convection ports to exhaust fluid into the chamber. Upon surging through the convection ports, the fluid comes in contact with the plenum of the primary body and dissipates the heat generated from the heat source and transferred to the primary body. An outlet, separate from the inlet, removes the fluid from the chamber.Type: ApplicationFiled: June 28, 2017Publication date: January 4, 2018Applicant: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati, Anatoly Pikovsky
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Publication number: 20150296662Abstract: Embodiments of the invention related to using the fin length of the heat sink extending from an entrance of the heat sink to an interior sectional wall as the heat transfer element to achieve high thermal performance. The sectional wall(s) of the heat sink function to isolate fluid flow communication between the heat sink sections of fin fields, thereby preventing a flow coupling between the fin fields.Type: ApplicationFiled: April 9, 2015Publication date: October 15, 2015Applicant: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
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Publication number: 20100097760Abstract: An apparatus and a method for impingement cooling. The apparatus may include a plenum having a fluid. The plenum may be configured to contact a plate. A duct may be attached to the plate, wherein the duct may include a hole configured to pass the fluid, such as an air or a gas. A heat source, such as an electric or electronic component, may be located proximate to the hole, such as on a printed circuit board. The hole may be configured to make a contact between the fluid and the heat source. Methods to make the foregoing structure are also described.Type: ApplicationFiled: October 20, 2008Publication date: April 22, 2010Inventors: Kaveh Azar, Bahman Tavassoli Hojati
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Publication number: 20040000393Abstract: A novel plate fin heat exchanger adapted for high and low velocity fluid flows for dissipating heat. The heat exchanger comprises an array of fins being affixed to and in thermal communication with a thermally conductive base, wherein the fins are arranged in a fan tail configuration for minimizing flow bypass, and further providing reduced thermal resistance for fluid passing through the fin field. The fins are affixed to and in thermal communication with the base at an acute angle, such that the effective width of the array of fins exceeds the width of the base. The enlarged effective width of the fin array in comparison to conventional heat exchanger provides an increased volume for fluid flow, thereby allowing a greater volume of fluid to enter the fin field and a greater surface area of plate fins for cooling the fluid passing through the heat exchanger.Type: ApplicationFiled: May 6, 2003Publication date: January 1, 2004Inventor: Bahman Tavassoli
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Publication number: 20020066550Abstract: A novel plate fin heat exchanger adapted for high and low velocity fluid flows for dissipating heat. The heat exchanger comprises an array of fins being affixed to and in thermal communication with a thermally conductive base, wherein the fins are arranged in a fan tail configuration for minimizing flow bypass, and further providing reduced thermal resistance for fluid passing through the fin field. The fins are affixed to and in thermal communication with the base at an acute angle, such that the effective width of the array of fins exceeds the width of the base. The enlarged effective width of the fin array in comparison to conventional heat exchanger provides an increased volume for fluid flow, thereby allowing a greater volume of fluid to enter the fin field and a greater surface area of plate fins for cooling the fluid passing through the heat exchanger.Type: ApplicationFiled: October 29, 2001Publication date: June 6, 2002Inventor: Bahman Tavassoli
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Patent number: 6308771Abstract: A novel plate fin heat exchanger adapted for high and low velocity fluid flows for dissipating heat from a heat generating component. The heat exchanger comprises an array of fins being affixed to and in thermal communication with a thermally conductive base, wherein the fins are arranged in a fan tail configuration for minimizing flow bypass, and further providing reduced thermal resistance for fluid passing through the fin field. The fins are affixed to and in thermal communication with the base at an acute angle, such that the effective width of the array of fins exceeds the width of the base. The enlarged effective width of the fin array in comparison to conventional heat exchanger provides an increased volume for fluid flow, thereby allowing a greater volume of fluid to enter the fin field and a greater surface area of plate fins for cooling the fluid passing through the heat exchanger.Type: GrantFiled: October 29, 1998Date of Patent: October 30, 2001Assignee: Advanced Thermal Solutions, Inc.Inventor: Bahman Tavassoli
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Patent number: D856944Type: GrantFiled: January 31, 2019Date of Patent: August 20, 2019Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati
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Patent number: D856945Type: GrantFiled: January 31, 2019Date of Patent: August 20, 2019Assignee: Advanced Thermal Solutions, Inc.Inventors: Kaveh Azar, Bahman Tavassoli-Hojati