Patents by Inventor Bahram Issari

Bahram Issari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240139821
    Abstract: The present aspects include a system for de-powdering a three-dimensionally (3D) printed structure. The structure comprising a first component holder configured to removably hold the 3D printed structure at an initial orientation with respect to at least one opening to a hollow portion within the 3D printed structure; a fluid system configured control a fluid to at least apply the fluid to the hollow portion or remove the fluid from the hollow portion to remove a powder from the hollow portion; and a movement system configured to move at least the 3D printed structure or the fluid system according to a movement procedure based on a configuration of the hollow portion.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 2, 2024
    Inventors: Michael Thomas KENWORTHY, Bahram ISSARI, Taylor Caitlin DOTY, Konstantin WIPLINGER
  • Patent number: 11840634
    Abstract: Provided herein are stretchable conductive inks consisting of a continuous polymer phase with dispersed silver flakes and a low melting metal or alloy, wherein initial resistivity is measured before elongation and the resistivity of the stretchable conductive ink composition is less than 10 times the initial resistivity at 50% elongation.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: December 12, 2023
    Assignee: HENKEL AG & CO, KGaA
    Inventors: Robert P. Cross, Bahram Issari, Wenhua Zhang, Lynnette M. Hurlburt, Jiangbo Ouyang, Rudolf Oldenzijl, Inge van der Meulen
  • Publication number: 20230241685
    Abstract: Apparatus and methods for removing and/or destroying support structures associated with objects fabricated using additive manufacturing techniques are presented herein. Structural supports may be used during an additive manufacturing process to prevent deformation of a build piece (e.g., three dimensional (3D) printed structure). In some examples, a build piece may be manufactured such that the structural supports are internal to the completed build piece. However, removing the structural supports may reduce the weight of the build piece and reduce the amount of debris trapped within the build piece. Thus, certain aspects of the disclosure are directed to a hose including a bendable and elongated tube member as well as a fracturing member configured to fracture an internal support structure within an additively manufactured part.
    Type: Application
    Filed: January 25, 2023
    Publication date: August 3, 2023
    Inventors: Bahram ISSARI, Michael Thomas KENWORTHY, Taylor Caitlin DOTY
  • Publication number: 20230235763
    Abstract: The present aspects include an assembly having discretized and segmented joint architecture. The assembly comprises a first structure including an outer wall and an inner wall, wherein the outer wall and the inner wall extend from a base of the first structure, and define a groove, and a plurality of connecting walls extending between the outer wall and the inner wall such that the groove is divided into a plurality of groove segments defined by the outer wall, the inner wall, and the plurality of connecting walls. The assembly further comprises a second structure including a plurality of tongue segments which extend into the plurality of groove segments. A first adhesive is inserted into the groove, thereby bonding the plurality of tongue segments within the plurality of groove segments such that the first and second structures are fixed together.
    Type: Application
    Filed: January 25, 2023
    Publication date: July 27, 2023
    Inventors: Bahram ISSARI, Shahan Soghomon KASNAKJIAN, Eric Paul MONTEITH, Lukas Philip CZINGER, Samuel Noah MILLER, Chor Yen YAP, Matthew Cooper KELLER
  • Publication number: 20220339707
    Abstract: Methods for removing support structures in additively manufactured parts are disclosed. A method in accordance with an aspect of the present disclosure comprises inserting a demolition object in a first state into a hollow portion of a 3-D printed part, breaking a support structure within the hollow portion by contact with the demolition object, changing the demolition object into a second state while the demolition object is within the hollow portion of the 3-D printed part, and removing the demolition object from the hollow portion of the 3-D printed part.
    Type: Application
    Filed: April 25, 2022
    Publication date: October 27, 2022
    Inventors: Michael Thomas Kenworthy, Taylor Caitlin Doty, Bahram Issari, Narender Shankar Lakshman, Krzysztof Artysiewicz
  • Publication number: 20220334010
    Abstract: Methods and apparatuses for using a structure as a sensor are disclosed. An apparatus in accordance with an aspect of the present disclosure comprises an additively-manufactured component comprising a channel, a sensor including an connection point, wherein the sensor is arranged in the channel, and an adhesive arranged in the channel, the adhesive coupling the additively-manufactured component to the sensor, such that the connection point is accessible external to the adhesive, the sensor being configured to provide a signal at the connection point, wherein the signal provides information of an applied force on the additively-manufactured component.
    Type: Application
    Filed: April 18, 2022
    Publication date: October 20, 2022
    Inventors: LUKAS PHILIP CZINGER, Matthew Cooper Keller, Bahram Issari
  • Publication number: 20220153918
    Abstract: A resin composition can includes a first isocyanurate component and a first bonding component bonded to the first isocyanurate component. The first bonding component can be configured to bond to a second bonding component that is bonded to a second isocyanurate component. The first bonding component can be configured to bond to the second bonding component based upon an application of an initiator to the resin composition. In this way, the first isocyanurate component can be coupled to the second isocyanurate component. The resin composition can be either in a pre-cured state in which the first isocyanurate component is not coupled to the second isocyanurate component or in a post-cured state in which at least a portion of the first isocyanurate component is coupled to at least a portion of the second isocyanurate component.
    Type: Application
    Filed: November 15, 2021
    Publication date: May 19, 2022
    Inventors: Bahram ISSARI, Lukas Philip CZINGER, Michael Thomas KENWORTHY
  • Publication number: 20220025180
    Abstract: The present disclosure is directed to a process for the preparation of curable, (meth)acrylate functionalized polysiloxanes. In addition, the present disclosure is directed to a curable, (meth)acrylate-functionalized polysiloxane obtained thereby and curable compositions comprising these curable, (meth)acrylate-functionalized polysiloxanes.
    Type: Application
    Filed: October 8, 2021
    Publication date: January 27, 2022
    Inventors: Bahram Issari, Christina Despotopoulou, Johann Klein, Tianzhi Zhang
  • Publication number: 20210332176
    Abstract: Curable compositions that undergo reaction induced phase separation of domains in cured matrix and provide beneficial physical and chemical properties and methods of use of such compositions. Curable compositions that undergo reaction induced phase separation of domains in cured matrix in response to a first set of curing conditions and the domains undergo a second reaction in response to a second set of curing conditions to improve the physical properties of the domains and the cured composition, such as improvements in glass transition temperature and thermal degradation.
    Type: Application
    Filed: July 8, 2021
    Publication date: October 28, 2021
    Inventors: Bahram Issari, Michael Paul Levandoski, Christina Despotopoulou, Tianzhi Zhang, Darel Gustafson, Robert P. Cross
  • Patent number: 10392543
    Abstract: Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: August 27, 2019
    Assignee: Henkel IP & Holding GmbH
    Inventors: Bahram Issari, Wenhua Zhang, John G. Woods, Shengqian Kong, Yayun Liu, Jiangbo Ouyang, Li Kang
  • Publication number: 20190169478
    Abstract: Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200° C., especially above 300° C., yet easy to debond afterwards to allow separation of the top and bottom substrates.
    Type: Application
    Filed: June 5, 2018
    Publication date: June 6, 2019
    Inventors: Shengqian KONG, Yayun LIU, Wenhua ZHANG, Stephen HYNES, John G. WOODS, Jiangbo OUYANG, Chunyu SUN, Bahram ISSARI
  • Patent number: 10280349
    Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: May 7, 2019
    Assignees: Henkel AG & Co. KGaA, Henkel IP & Holding GmbH
    Inventors: Stephen Hynes, Chunyu Sun, Jiangbo Ouyang, John Gregory Woods, Bahram Issari, Shengqian Kong, Yayun Liu, Wenhua Zhang
  • Publication number: 20190071593
    Abstract: Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.
    Type: Application
    Filed: November 2, 2018
    Publication date: March 7, 2019
    Inventors: Bahram Issari, Wenhua Zhang, John G. Woods, Shengqian Kong, Yayun Liu, Jiangbo Ouyang, Li Kang
  • Publication number: 20180355231
    Abstract: Provided herein are debondable adhesive compositions comprising (A) one or more bis-maleimide (BMI), nadimide or itaconimide oligomer(s), (B) at least one ethylenically unsaturated co-monomer (e.g. co-monomers selected from the group consisting of acrylates, methacrylates, vinyl ethers, vinyl esters, styrenic compounds, allyl compounds, polybutadienes, cinnamates, crotonates, and mixtures of any two or more thereof), and (C) a photoinitiator. In another embodiment, the present invention is directed to an assembly of a substrate and a carrier for the substrate in which the debondable adhesive composition temporarily bonds the substrates, and a method for fabricating the assembly. The debondable adhesive compositions maintain their adhesion at temperatures of 300° C. or greater, are easily and cleanly debondable at ambient conditions, permit temporary bonding at high processing conditions, and do not compromise handling or performance of the substrates.
    Type: Application
    Filed: August 3, 2018
    Publication date: December 13, 2018
    Inventors: Alan E. LITKE, Bahram ISSARI, Laxmisha SRIDHAR
  • Publication number: 20120111498
    Abstract: The present invention relates to two-part moisture curing compositions useful for adhesive, sealing, potting and other applications. In particular, the present invention relates to two-part room temperature vulcanizing (RTV) compositions which include in one of the parts a moisture curing organic polymer which is substantially free or does not contain siloxane bonds in its backbone.
    Type: Application
    Filed: January 18, 2012
    Publication date: May 10, 2012
    Applicant: Henkel Corporation
    Inventors: Christopher Verosky, Michael P. Levandoski, Richard Corrao, Chiu-Sing Lin, Bahram Issari
  • Patent number: 8119724
    Abstract: The present invention provides moisture curable polyacrylate compositions, which cured elastomers thereof demonstrate improved resistance to shrinkage when exposed to hydrocarbon fluids such as transmission fluids and oil and fuel based fluids. Such compositions include: a) a moisture curable silyl functionalized polyacrylate; and b) at least one hydrocarbon fluid-absorbing component, wherein the hydrocarbon-fluid absorbing component is present in an amount sufficient to reduce shrinkage of the cured composition when exposed to a hydrocarbon fluid.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: February 21, 2012
    Assignee: Henkel Corporation
    Inventors: Chiu-Sing Lin, Thomas Fay-Oy Lim, Bahram Issari
  • Patent number: 8119746
    Abstract: This application relates to polysiloxane compositions grafted with improved heat curable, moisture curable, or heat/moisture curable groups. In particular, the polysiloxane compositions have reactive groups on the terminal or pendent areas of the siloxane backbone, which once reacted provide improved heat and/or moisture curable polysiloxanes.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: February 21, 2012
    Assignee: Henkel Corporation
    Inventors: Bahram Issari, Michael P. Levandoski, Richard Corrao, Hsien-Kun Chu, Robert P. Cross
  • Patent number: 7951867
    Abstract: The present invention is directed to silicone formulations which are capable of being rapidly cured to tough elastomeric materials through exposure to UV radiation, and optionally through exposure to moisture as well. The cured products demonstrate high resistance to flammability and combustibility.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: May 31, 2011
    Assignee: Henkel Corporation
    Inventor: Bahram Issari
  • Patent number: 7837824
    Abstract: The present invention relates to photoradiation and/or moisture curing silicone compositions and methods for producing and using the same. In particular, the methods of the present invention permit controlled growth of a polymer, and allow for incorporation of pendant functional groups along the length of the polymer.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: November 23, 2010
    Assignee: Henkel Corporation
    Inventors: Bahram Issari, Lester D. Bennington, Robert Cross, John Kerr, Thomas Fay-Oy Lim, Hsien-Kun Chu, Mathias E. Liistro, Jr., Douglas N. Horner
  • Publication number: 20090143554
    Abstract: This application relates to polysiloxane compositions grafted with improved heat curable, moisture curable, or heat/moisture curable groups. In particular, the polysiloxane compositions have reactive groups on the terminal or pendent areas of the siloxane backbone, which once reacted provide improved heat and/or moisture curable polysiloxanes.
    Type: Application
    Filed: November 26, 2008
    Publication date: June 4, 2009
    Applicant: Henkel Corporation
    Inventors: Bahram Issari, Michael P. Levandoski, Richard Corrao, Hsien-Kun Chu, Robert P. Cross