Patents by Inventor Bai CHEN
Bai CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240192928Abstract: A computing device is provided, including a processor configured to execute a visual scripting program. The processor is further configured to display a graphical user interface (GUI) of the visual scripting program, which is configured to display a plurality of nodes that are connectable by graphical wires that represent dataflow between the nodes. The GUI includes a selectable reroute node icon that enables connection of one node of the plurality of nodes to one or more other nodes of the plurality of nodes via one of the graphical wires. The selectable reroute node icon includes a left end and a right end, in which each end includes a selectable region that has a width that is at least one third of a total width of the selectable reroute node icon, and the left and right side selectable regions together occupy at least 35% of a total area of the icon.Type: ApplicationFiled: December 8, 2022Publication date: June 13, 2024Inventors: Guan-Bai CHEN, Runze ZHANG
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Publication number: 20240164853Abstract: Devices, systems, methods, and computer program products for performing medical procedures are disclosed herein. In some embodiments, a system for planning a medical procedure is configured to receive a three-dimensional (3D) model of an anatomic region of a patient. The 3D model can include a set of linked structures and at least one isolated structure spaced apart from the linked structure. The system can output a graphical representation of the linked structures and the at least one isolated structure, and can receive operator input indicating a set of locations on the graphical representation. The set of locations can represent a connection between the at least one isolated structure and the linked structures. Based on the operator input, the system can generate a bridge structure connecting the at least one isolated structure to the linked structures.Type: ApplicationFiled: April 5, 2022Publication date: May 23, 2024Inventors: Bai Wang, Joy Janku, Sida Li, Shiyang Chen, Hui Zhang
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Publication number: 20240151768Abstract: Disclosed are a signal processing method and an abnormal sound detection system. First, a neural network model is trained, including: (a) randomly selecting a plurality of sample signals from a training database to obtain a combined signal, wherein the training database includes the first sample set belonging to the first classification label and the second sample set belonging to the second classification label, and the number of selected sample signals conforms to the preset number; repeating the said step to obtain a plurality of combined signals and using the combined signals to train the neural network model. Then, a sound signal received from a sound receiving apparatus is inputted to the trained neural network model to output a probability value, and a corresponding notification signal is outputted based on the probability value.Type: ApplicationFiled: September 12, 2023Publication date: May 9, 2024Applicant: GlobalWafers Co., Ltd.Inventors: Yue-Dong Chen, You-Siang Chen, Chun-Yu Chang, Mingsian Bai, Yu-Lun Deng
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Patent number: 11975979Abstract: A method for growing bulk boron arsenide (BA) crystals, the method comprising utilizing a seeded chemical vapor transport (CVT) growth mechanism to produce single BAs crystals which are used for further CVT growth, wherein a sparsity of nucleation centers is controlled during the further CVT growth. Also disclosed are bulk BAs crystals produced via the method.Type: GrantFiled: June 20, 2019Date of Patent: May 7, 2024Assignee: UNIVERSITY OF HOUSTON SYSTEMInventors: Zhifeng Ren, Fei Tian, Gang Chen, Bai Song, Ke Chen, Li Shi, Xi Chen, Sean Sullivan, David Broido, Navaneetha Krishnan Ravichandran
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Publication number: 20240136275Abstract: A semiconductor package structure includes a capacitor substrate and a first semiconductor die. The capacitor substrate has a first surface and a second surface opposite the first surface and includes a first redistribution structure, a second redistribution structure, a through via, and a first capacitor structure. The first redistribution structure is disposed on the first surface. The second redistribution structure is disposed on the second surface. The through via electrically couples the first redistribution structure to the second redistribution structure. The first capacitor structure is disposed between the first redistribution structure and the second redistribution structure and is electrically coupled to the second redistribution structure. The first semiconductor die is disposed over the capacitor substrate and is electrically coupled to the first capacitor structure through the second redistribution structure.Type: ApplicationFiled: September 21, 2023Publication date: April 25, 2024Inventors: Shi-Bai CHEN, Wei-Chih CHEN
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Publication number: 20240105571Abstract: Embodiments disclosed herein include glass cores and methods of forming glass cores. In an embodiment, a core for an electronic package comprises a substrate with a first surface and a second surface opposite from the first surface, where the substrate comprises glass, In an embodiment, a via opening is provided through the substrate, and a diffusion layer is along the first surface, the second surface, and the via opening.Type: ApplicationFiled: September 27, 2022Publication date: March 28, 2024Inventors: Brandon C. MARIN, Haobo CHEN, Bai NIE, Srinivas V. PIETAMBARAM, Gang DUAN, Jeremy D. ECTON, Suddhasattwa NAD
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Publication number: 20240105575Abstract: Embodiments disclosed herein include package substrates and methods of forming package substrates. In an embodiment, the package substrate comprises a core, and a pad over the core, where the pad has a first width. In an embodiment, a surface finish is over the pad, where the surface finish has a second width that is substantially equal to the first width. In an embodiment, the package substrate further comprises a solder resist over the pad, where the solder resist comprises an opening that exposes a portion of the surface finish. In an embodiment, the opening has a third width that is smaller than the second width.Type: ApplicationFiled: September 26, 2022Publication date: March 28, 2024Inventors: Jason M. GAMBA, Haifa HARIRI, Kristof DARMAWIKARTA, Srinivas V. PIETAMBARAM, Hiroki TANAKA, Kyle MCELHINNY, Xiaoying GUO, Steve S. CHO, Ali LEHAF, Haobo CHEN, Bai NIE, Numair AHMED
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Publication number: 20240088052Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: Bai NIE, Gang DUAN, Srinivas PIETAMBARAM, Jesse JONES, Yosuke KANAOKA, Hongxia FENG, Dingying XU, Rahul MANEPALLI, Sameer PAITAL, Kristof DARMAWIKARTA, Yonggang LI, Meizi JIAO, Chong ZHANG, Matthew TINGEY, Jung Kyu HAN, Haobo CHEN
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Patent number: 11923312Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.Type: GrantFiled: March 27, 2019Date of Patent: March 5, 2024Assignee: Intel CorporationInventors: Bai Nie, Gang Duan, Srinivas Pietambaram, Jesse Jones, Yosuke Kanaoka, Hongxia Feng, Dingying Xu, Rahul Manepalli, Sameer Paital, Kristof Darmawikarta, Yonggang Li, Meizi Jiao, Chong Zhang, Matthew Tingey, Jung Kyu Han, Haobo Chen
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Publication number: 20240071848Abstract: Embodiments disclosed herein include package substrates. In an embodiment, the package substrate comprises a core, where the core comprises glass. In an embodiment, a first layer is under the core, a second layer is over the core, and a via is through the core, the first layer, and the second layer. In an embodiment a width of the via through the core is equal to a width of the via through the first layer and the second layer. In an embodiment, the package substrate further comprises a first pad under the via, and a second pad over the via.Type: ApplicationFiled: August 25, 2022Publication date: February 29, 2024Inventors: Bohan SHAN, Haobo CHEN, Brandon C. MARIN, Srinivas V. PIETAMBARAM, Bai NIE, Gang DUAN, Kyle ARRINGTON, Ziyin LIN, Hongxia FENG, Yiqun BAI, Xiaoying GUO, Dingying David XU, Jeremy D. ECTON, Kristof DARMAWIKARTA, Suddhasattwa NAD
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Patent number: 11917214Abstract: A method for live streaming recommended content from a content request includes live streaming a first content from a first user side, activating a live reaction at the first user side, and providing the content request at a second user side when the live reaction is enabled. The method also includes determining a second content, sending the content request indicating the second content, and receiving a confirmation at the second user side indicating the content request being sent. The method further includes receiving, at the first user side, the content request sent from the second user side, approving the content request at the first user side, and after the content request is approved, live streaming from the first user side, the second content corresponding to the content request.Type: GrantFiled: October 20, 2022Date of Patent: February 27, 2024Assignee: LEMON INC.Inventors: Weston Bell-Geddes, August Yadon, Yu Qin, Guan-Bai Chen
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Publication number: 20240038648Abstract: A semiconductor package includes a partitioned package substrate that is composed of multiple discrete substrates arranged in a side-by-side manner. The discrete substrates include a central substrate and peripheral substrates surrounding the central substrate. At least one integrated circuit die is mounted on a first surface of the partitioned package substrate. A plurality of solder balls is mounted on a second surface of the partitioned package substrate opposite to the first surface.Type: ApplicationFiled: June 29, 2023Publication date: February 1, 2024Applicant: MEDIATEK INC.Inventors: Wei-Chih Chen, Shi-Bai Chen
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Publication number: 20240038647Abstract: A semiconductor package includes a partitioned package substrate composed of substrate parts arranged in a side-by-side manner; an integrated circuit die mounted on a first surface of the partitioned package substrate; and solder balls mounted on a second surface of the partitioned package substrate opposite to the first surface.Type: ApplicationFiled: June 29, 2023Publication date: February 1, 2024Applicant: MEDIATEK INC.Inventors: Wei-Chih Chen, Shi-Bai Chen
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Publication number: 20230191590Abstract: A wearable cable-driven robotic arm system includes a wearing mechanism, two robotic arms located on two sides of the wearing mechanism, cable driving devices, a load trolley, and a motor controller, where the cable driving devices are divided into driving portions and driven portions, heavy objects, such as electric motors, of the driving portions are arranged in the load trolley, thereby reducing loads born by the wearable robotic arms, the load trolley can travel with a person by means of sleeves or can be controlled by the motor controller to move by means of signals measured by following modules, the driven portions are combined with the robotic arms, and are double-cable driven, thereby reducing weight of the robotic arms, and a brain-computer interface module is used for controlling the driving devices, thereby controlling the robotic arms more accurately.Type: ApplicationFiled: January 28, 2021Publication date: June 22, 2023Inventors: Yaoyao WANG, Hao FU, Bai CHEN
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Publication number: 20220137671Abstract: Example wood panel assemblies that are disposed on electronic devices are disclosed. In an example, an electronic device includes a palm rest, and a trackpad disposed on the palm rest. In addition, the electronic device includes a wood panel assembly mounted on top of the palm rest and the trackpad. The wood panel assembly includes a wood veneer panel including a top surface and a bottom surface. The bottom surface covers the palm rest and the trackpad. In addition, the wood panel assembly includes a fabric material secured along the bottom surface.Type: ApplicationFiled: July 15, 2019Publication date: May 5, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Marcus Townsend, Sandie Ning-Ning Cheng, Guan-Bai Chen
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Patent number: 11119988Abstract: An aspect of performing logical validation on loaded data in a database includes a rule engine configured to, in response to an addition or update of a new rule for logical validation, determine a delta rule that includes a delta part of the new rule with respect to existing rules. An aspect also includes an object container containing object instances that have been validated using the existing rules. The object instance contains only data related to the existing rules and extracted from the database. An aspect further includes a validation engine configured to, upon determining that the delta rule relates to extra data other than the data contained in the object instance, extract the extra data from a database and add it to corresponding object instances, and use at least a part of the new rule to perform logical validation on the relevant object instances in the object container.Type: GrantFiled: May 17, 2019Date of Patent: September 14, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bai Chen Deng, An Chao Song, Feng Cheng Sun, Jing Sun, Lin Xu
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Patent number: 10910320Abstract: A shielded metal-oxide-metal (MOM) capacitor includes a substrate, a lower shielding plate disposed on the substrate and in parallel with a major surface of the substrate, an upper shielding plate situated above the lower shielding plate and in parallel with the lower shielding plate, and a middle plate sandwiched between the lower shielding plate and the upper shielding plate. The middle plate includes two parallel first connecting bars extending along a first direction, a plurality of first fingers extending between the two parallel first connecting bars along a second direction, and an electrode strip spaced apart from and surrounded by the two parallel first connecting bars and the first fingers.Type: GrantFiled: September 12, 2018Date of Patent: February 2, 2021Assignee: MEDIATEK INC.Inventor: Shi-Bai Chen
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Publication number: 20200286967Abstract: A display device is provided. The display device includes a self-emissive layer and a color filter layer. The self-emissive layer includes a plurality of self-emissive units and a plurality of first non-visible light generating units which is respectively disposed among the self-emissive units. The color filter layer is disposed on the self-emissive layer, and includes a shading matrix. The first non-visible light generating units and the shading matrix respectively have a first projection area and a second projection area on a projection plane parallel to the color filter layer. The first projection area and the second projection area at least partially overlap, and the shading matrix at least partially permits the passing through of the first non-visible light generated by the first non-visible light generating units.Type: ApplicationFiled: December 4, 2019Publication date: September 10, 2020Inventors: TING-YI KUO, KUEI-BAI CHEN
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Patent number: 10750013Abstract: A method, system, and computer program product, include receiving a request for registration from a service provider, upon the service receiver having authorized the request for registration, registering characteristic information of the service call in a user device of a service receiver, and upon a lapse of time, deregistering the characteristic information from the user device.Type: GrantFiled: January 2, 2019Date of Patent: August 18, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Keke Cai, Bai Chen Deng, Dongxu Duan, Zhong Su, Li Zhang, Xiaolu Zhang, Shiwan Zhao
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Patent number: 10503030Abstract: A pixel structure includes a substrate, a scan line disposed on the substrate, and a common electrode and a data line both disposed on a side of the pixel electrode. The substrate includes a sub pixel, which includes a pixel electrode and an active element. The common electrode includes a first connection segment connecting a first segment and a second segment. The data line includes a second connection segment connecting a first section and a second section. The first segment and the second segment, as well as the first section and the second section, extend in a first direction and are alternately arranged in a second direction. The first direction intersects with the second direction. The first connection segment mutually intersects with the second connection segment. The pixel electrode overlaps with a part of the common electrode and a part of the data line in a perpendicular projection direction.Type: GrantFiled: October 5, 2018Date of Patent: December 10, 2019Assignee: AU OPTRONICS CORPORATIONInventors: Wei-Hsun Liu, Kuei-Bai Chen