Patents by Inventor Bairo Masaaki

Bairo Masaaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid-state image pickup device with a wiring becoming a light receiving surface, method of manufacturing the same, and electronic apparatus
    Patent number: 8440954
    Abstract: Disclosed herein is a solid-state image pickup device, including: a plurality of pixels each composed of a photoelectric conversion element formed in a semiconductor substrate for generating and accumulating signal electric charges corresponding to a light quantity of incident light, and an electric charge reading portion formed on a front surface side of the semiconductor substrate for reading out the signal electric charges generated and accumulated in the photoelectric conversion element; a wiring for a substrate potential formed on a back surface side, becoming a light receiving surface, of the semiconductor substrate for supplying a desired voltage to the semiconductor substrate; and a back surface side contact portion through which the wiring for a substrate potential and the semiconductor substrate are electrically connected to each other.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: May 14, 2013
    Assignee: Sony Corporation
    Inventor: Bairo Masaaki
  • SOLID-STATE IMAGE PICKUP DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
    Publication number: 20110139962
    Abstract: Disclosed herein is a solid-state image pickup device, including: a plurality of pixels each composed of a photoelectric conversion element formed in a semiconductor substrate for generating and accumulating signal electric charges corresponding to a light quantity of incident light, and an electric charge reading portion formed on a front surface side of the semiconductor substrate for reading out the signal electric charges generated and accumulated in the photoelectric conversion element; a wiring for a substrate potential formed on a back surface side, becoming a light receiving surface, of the semiconductor substrate for supplying a desired voltage to the semiconductor substrate; and a back surface side contact portion through which the wiring for a substrate potential and the semiconductor substrate are electrically connected to each other.
    Type: Application
    Filed: December 1, 2010
    Publication date: June 16, 2011
    Applicant: SONY CORPORATION
    Inventor: Bairo Masaaki