Patents by Inventor Bairong Sun

Bairong Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacture method for a surface mounted power LED support and its product
    Patent number: 9157610
    Abstract: A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.
    Type: Grant
    Filed: August 25, 2010
    Date of Patent: October 13, 2015
    Assignees: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD., ZHU HAI BONTECH ELECTRONIC TECHNOLOGY CO., LTD.
    Inventors: Binhai Yu, Bairong Sun, Weiping Li, Xunli Xia, Cheng Li, Menghua Long, Lifang Liang
  • Manufacture Method for a Surface Mounted Power LED Support and its Product
    Publication number: 20130121007
    Abstract: A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.
    Type: Application
    Filed: August 25, 2010
    Publication date: May 16, 2013
    Applicants: ZHU HAI BONTECH ELECTRONIC TECHNOLOGY CO., LTD., FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
    Inventors: Binhai Yu, Bairong Sun, Weiping Li, Xunli Xia, Cheng Li, Menghua Long, Lifang Liang