Patents by Inventor Bala Krishna Sela

Bala Krishna Sela has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220241847
    Abstract: A mold package for forming a cast device such as an engine block is described. The mold package includes a profiled chill and a mold core assembly that is disposed on the profiled chill. The mold core assembly defines a plurality of bulkheads of the engine block. The profiled chill includes a first chill portion having a second chill portion and a plurality of third chill portions arranged thereon, wherein the second chill portion is a semicylindrical element. The third chill portions are arranged to be adjacent to the plurality of bulkheads of the engine block.
    Type: Application
    Filed: February 1, 2021
    Publication date: August 4, 2022
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Tiruttani Munikamal, Bala Krishna Sela, Qigui Wang, Scott A. Kavanagh, Guy Celli, Lokesh Choudhary