Patents by Inventor Balarabe N. Mohammed
Balarabe N. Mohammed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10222810Abstract: Methods and apparatus for in-situ calibration of a flow controller are provided herein. In some embodiments, a method of flowing a gas includes providing a flow controller configured to provide a first gas at a first value of a flow rate based on a calculated first relationship determined by using a standard gas; determining an actual first relationship between the flow rate and the setpoint for the first gas from a plurality of values of the flow rate of the first gas determined at a corresponding plurality of values of the setpoint of the flow controller, wherein each of the plurality of values of the flow rate is determined from flowing the first gas through the flow controller at corresponding ones of the plurality of values for the setpoint; and flowing the first gas at the first value of the flow rate based on the actual first relationship.Type: GrantFiled: August 28, 2017Date of Patent: March 5, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Balarabe N. Mohammed, John W. Lane, Mariusch J. Gregor, Dan Joseph Healy
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Publication number: 20180024573Abstract: Methods and apparatus for in-situ calibration of a flow controller are provided herein. In some embodiments, a method of flowing a gas includes providing a flow controller configured to provide a first gas at a first value of a flow rate based on a calculated first relationship determined by using a standard gas; determining an actual first relationship between the flow rate and the setpoint for the first gas from a plurality of values of the flow rate of the first gas determined at a corresponding plurality of values of the setpoint of the flow controller, wherein each of the plurality of values of the flow rate is determined from flowing the first gas through the flow controller at corresponding ones of the plurality of values for the setpoint; and flowing the first gas at the first value of the flow rate based on the actual first relationship.Type: ApplicationFiled: August 28, 2017Publication date: January 25, 2018Inventors: BALARABE N. MOHAMMED, JOHN W. LANE, MARIUSCH J. GREGOR, DAN JOSEPH HEALY
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Patent number: 9772629Abstract: Methods and apparatus for in-situ calibration of a flow controller are provided herein. In some embodiments, a method of flowing a gas includes providing a flow controller configured to provide a first gas at a first value of a flow rate based on a calculated first relationship determined by using a standard gas; determining an actual first relationship between the flow rate and the setpoint for the first gas from a plurality of values of the flow rate of the first gas determined at a corresponding plurality of values of the setpoint of the flow controller, wherein each of the plurality of values of the flow rate is determined from flowing the first gas through the flow controller at corresponding ones of the plurality of values for the setpoint; and flowing the first gas at the first value of the flow rate based on the actual first relationship.Type: GrantFiled: September 26, 2012Date of Patent: September 26, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Balarabe N. Mohammed, John W. Lane, Mariusch J. Gregor, Dan Joseph Healy
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Patent number: 9644796Abstract: Methods and apparatus for in-situ calibration of a flow controller are provided herein. In some embodiments, a method of flowing a gas includes providing a flow controller configured to provide a first gas at a first value of a flow rate based on a calculated first relationship determined by using a standard gas; determining an actual first relationship between the flow rate and the setpoint for the first gas from a plurality of values of the flow rate of the first gas determined at a corresponding plurality of values of the setpoint of the flow controller, wherein each of the plurality of values of the flow rate is determined from flowing the first gas through the flow controller at corresponding ones of the plurality of values for the setpoint; and flowing the first gas at the first value of the flow rate based on the actual first relationship.Type: GrantFiled: September 26, 2012Date of Patent: May 9, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Balarabe N. Mohammed, John W. Lane, Mariusch J. Gregor, Dan Joseph Healy
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Patent number: 8020750Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and may be partially integrated or fully integrated into a processing chamber which also includes diffusion bonded layers.Type: GrantFiled: October 24, 2006Date of Patent: September 20, 2011Assignee: Applied Materials, Inc.Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
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Patent number: 8017028Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.Type: GrantFiled: October 14, 2008Date of Patent: September 13, 2011Assignee: Applied Materials, Inc.Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
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Patent number: 7984891Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.Type: GrantFiled: April 20, 2007Date of Patent: July 26, 2011Assignee: Applied Materials, Inc.Inventors: Mark Crockett, John W. Lane, Michael J. DeChellis, Chris Melcer, Erica R. Porras, Aneesh Khullar, Balarabe N. Mohammed
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Patent number: 7850786Abstract: Described is a space-conserving integrated fluid delivery system particularly useful for gas distribution in semiconductor processing equipment. The system includes integrated fluid flow network architecture, and may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded. Subsequent to diffusion bonding, a stainless steel diffusion bonded part may advantageously be treated to enhance corrosion resistance using a series of steps designed to bring more chromium to the surface of the steel.Type: GrantFiled: October 17, 2006Date of Patent: December 14, 2010Assignee: Applied Materials, Inc.Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
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Patent number: 7559527Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.Type: GrantFiled: April 19, 2007Date of Patent: July 14, 2009Assignee: Applied Materials, Inc.Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
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Publication number: 20090039057Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.Type: ApplicationFiled: October 14, 2008Publication date: February 12, 2009Inventors: Mark Crockett, John W. Lane, Micahel J. DeChellis, Chris Melcer, Erica R. Porras, Aneesh Khullar, Balarabe N. Mohammed
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Patent number: 7459003Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention pertains to a diffusion bonded integrated fluid flow network architecture, which includes, in addition to a layered substrate containing fluid flow channels, an in-line filter and may include various fluid handling and monitoring components. The integrated fluid delivery system that is formed from a layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.Type: GrantFiled: October 3, 2006Date of Patent: December 2, 2008Assignee: Applied Materials, Inc.Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
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Patent number: 7448276Abstract: A diffusion bonded space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The disclosure includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. A capacitive dual electrode pressure sensor which is integrated into a multilayered substrate is described. The pressure sensor may be used as a gage relative to atmospheric pressure if desired for a particular application.Type: GrantFiled: August 23, 2006Date of Patent: November 11, 2008Assignee: Applied Materials, Inc.Inventors: Mark Crockett, John W. Lane, Micahel DeChellis, Chris Melcer, Erica Porras, Aneesh Khullar, Balarabe N. Mohammed
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Publication number: 20040119038Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.Type: ApplicationFiled: July 12, 2003Publication date: June 24, 2004Applicant: Applied Materials, Inc.Inventors: Mark Crockett, John W. Lane, Michael J. DeChellis, Chris Melcer, Erica R. Porras, Aneesh Khullar, Balarabe N. Mohammed