Patents by Inventor Balasubramanian Sivagnanam

Balasubramanian Sivagnanam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7462942
    Abstract: A die, comprising a substrate and one or more pillar structures formed over the substrate in a pattern and the method of forming the die.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: December 9, 2008
    Assignee: Advanpack Solutions Pte Ltd
    Inventors: Kim Hwee Tan, Ch'ng Han Shen, Rosemarie Tagapulot, Yin Yen Bong, Ma L. Nang Htoi, Lim Tiong Soon, Shikui Lui, Balasubramanian Sivagnanam
  • Publication number: 20080248610
    Abstract: The present invention provides a thermal bonding process for chip packaging. In accordance with an aspect of the invention, there is provided an approach to solve the problems caused by the different CTEs between the die and the substrate. It discloses an improved thermal bonding process for forming pillar-shaped interconnection, which controls the thermal expansion of the semiconductor die and the substrate by applying differential heating temperature to the two, thereby minimizing the misalignment between the die and the substrate, overcoming the stresses imposed on the interconnection and allowing more reliable and accurate packaging.
    Type: Application
    Filed: April 3, 2007
    Publication date: October 9, 2008
    Applicant: Advanpack Solutions Pte Ltd
    Inventors: Hwee Seng Chew, Chee Kian Ong, Balasubramanian Sivagnanam
  • Publication number: 20050077624
    Abstract: A die, comprising a substrate and one or more pillar structures formed over the substrate in a pattern and the method of forming the die.
    Type: Application
    Filed: October 9, 2003
    Publication date: April 14, 2005
    Inventors: Kim Tan, Ch'ng Shen, Rosemarie Tagapulot, Yin Bong, Ma Htoi, Lim Soon, Liu Shikui, Balasubramanian Sivagnanam