Patents by Inventor Balu Pathangey

Balu Pathangey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for mitigating surface imperfections on die backside film using fluorocarbon material
    Patent number: 10546823
    Abstract: Described is an apparatus which comprises: a die having a first side and a second side opposite to the first side; a die backside film (DBF) or die attach film (DAF) disposed over the first side of the die; and a fluorocarbon layer disposed over the DBF or DAF. Described is a method which comprises: applying a die backside film (DBF) over a first side of a die, wherein the die has a second side which metal bumps; and applying a plasma polymerization process to treat the DBF with a fluorocarbon plasma.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: January 28, 2020
    Assignee: Intel Corporation
    Inventors: Balu Pathangey, Mihir A. Oka, Andrew Proctor
  • APPARATUS AND METHOD FOR MITIGATING SURFACE IMPERFECTIONS ON DIE BACKSIDE FILM
    Publication number: 20190067213
    Abstract: Described is an apparatus which comprises: a die having a first side and a second side opposite to the first side; a die backside film (DBF) or die attach film (DAF) disposed over the first side of the die; and a fluorocarbon layer disposed over the DBF or DAF. Described is a method which comprises: applying a die backside film (DBF) over a first side of a die, wherein the die has a second side which metal bumps; and applying a plasma polymerization process to treat the DBF with a fluorocarbon plasma.
    Type: Application
    Filed: November 13, 2015
    Publication date: February 28, 2019
    Applicant: INTEL CORPORATION
    Inventors: Balu Pathangey, Mihir A. Oka, Andrew Proctor
  • Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing same
    Patent number: 7309453
    Abstract: A coolant capable of enhancing corrosion inhibition includes a potassium formate solution having a first concentration of a polyphosphate salt and a second concentration of dicyandiamide. In one embodiment, such a coolant may provide corrosion inhibition that is especially effective for silicon and aluminum, among other materials. The corrosion protection may be enhanced for certain materials by adding benzotriazole in a third concentration to the potassium formate solution.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: December 18, 2007
    Assignee: Intel Corporation
    Inventors: Je-Young Chang, Choong-Un Kim, Balu Pathangey, Paul J. Gwin, Mark E. Luke, Ravi Prasher
  • COOLANT CAPABLE OF ENHANCING CORROSION INHIBITION, SYSTEM CONTAINING SAME, AND METHOD OF MANUFACTURING SAME
    Publication number: 20070262286
    Abstract: A coolant capable of enhancing corrosion inhibition includes a potassium formate solution having a first concentration of a polyphosphate salt and a second concentration of dicyandiamide. In one embodiment, such a coolant may provide corrosion inhibition that is especially effective for silicon and aluminum, among other materials. The corrosion protection may be enhanced for certain materials by adding benzotriazole in a third concentration to the potassium formate solution.
    Type: Application
    Filed: May 12, 2006
    Publication date: November 15, 2007
    Inventors: Je-Young Chang, Choong-Un Kim, Balu Pathangey, Paul Gwin, Mark Luke, Ravi Prasher
  • Method of etching a metallic film on a substrate
    Patent number: 7204935
    Abstract: A method of etching a metallic film on a substrate. This method operates to inject an oxidizing agent through the use of a carrier gas to etch a source metal in the presence of a reducing agent such that the rate of etching can be controlled by controlling the flow rate of the carrier gas, the substrate temperature, the pulse widths of the oxidizing and reducing agents, and the number of etching phases.
    Type: Grant
    Filed: May 4, 2004
    Date of Patent: April 17, 2007
    Assignee: Oregon Health & Science University
    Inventors: Rajendra Solanki, Balu Pathangey
  • Method of depositing a metallic film on a substrate
    Publication number: 20040200414
    Abstract: The present invention relates to a method of depositing a metallic film on a substrate. This method uses a carrier gas to deposit a source metal in the presence of a reducing agent such that the rate of deposition can be controlled by controlling the flow rate of the carrier gas, the substrate temperature, the pulse widths of the metal source and reducing agents, and the number of deposition phases.
    Type: Application
    Filed: May 4, 2004
    Publication date: October 14, 2004
    Inventors: Rajendra Solanki, Balu Pathangey
  • Method of depositing a metallic film on a substrate
    Publication number: 20030064153
    Abstract: The present invention relates to a method of depositing a metallic film on a substrate. This method uses a carrier gas to deposit a source metal in the presence of a reducing agent such that the rate of deposition can be controlled by controlling the flow rate of the carrier gas, the substrate temperature, the pulse widths of the metal source and reducing agents, and the number of deposition phases.
    Type: Application
    Filed: February 22, 2002
    Publication date: April 3, 2003
    Inventors: Rajendra Solanki, Balu Pathangey
  • Method of depositing a metallic film on a substrate
    Publication number: 20020039622
    Abstract: The present invention relates to a method of depositing a metallic film on a substrate. This method uses a carrier gas to deposit a source metal in the presence of an aqueous reducing agent such that the rate of deposition can be controlled by controlling the flow rate of the carrier gas.
    Type: Application
    Filed: October 1, 2001
    Publication date: April 4, 2002
    Inventors: Rajendra Solanki, Balu Pathangey