Abstract: Method of forming a plastic element include dispensing a quantity of a liquid precursor material into a first die mold, positioning a carrier tape on the first die mold above the dispensed liquid precursor material, bringing a second die mold into contact with the carrier tape and the first die mold, and applying pressure to the first die mold and the second die mold. The liquid precursor material may include a liquid silicone.

Abstract: A composite optical lens is disclosed. The composite optical lens includes a concave bottom surface adapted to receive light, reflective surface adapted to reflect the received light, and optical surface through which the reflected light leaves the optical lens. The concave bottom surface defines a concave cavity allowing placement of at least a portion of a light emitting device within the concave cavity. The concave bottom surface, the optical surface, or both may have predetermined optical finish to operate on the light such as diffusing or focusing the light. The reflective surface can be coated, designed, or both for total internal reflection effect.

Abstract: A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate is made from thermally conductive but electrically insulating material. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). The lens can be coated with any optical system of chemical that affects the performance of the device. Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink). The reflector plate includes a reflective surface to direct light from the LED in a desired direction.

Abstract: A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate may be made from thermally conductive but electrically insulating material or from a material that is both thermally and electrically conductive. In embodiments wherein the substrate is made from an electrically conductive material, the substrate further includes an electrically insulating, thermally conductive material formed on the electrically conductive material. The substrate has traces for connecting to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad. The lens substantially covers the mounting pad. Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink). The reflector plate includes a reflective surface to direct light from the LED in a desired direction.

Abstract: A light emitting die package and a method of making the light emitting die package are disclosed. The die package includes a stem substrate having grooves, a wire lead attached to the grooves, and a light emitting diode (LED) mounted on the stem substrate. Also coupled to the substrate are a sleeve, a reflector, and a lens. To make the light emitting die package, a long substrate is formed and wire leads are attached to the substrate. Then, the substrate including the attached wire leads is cut to predetermine lengths to form individual stem substrates. To each stem substrate, LED, reflector, and lens are coupled.

Abstract: A light emitting die package and a method of making the light emitting die package are disclosed. The die package includes a stem substrate having grooves, a wire lead attached to the grooves, and a light emitting diode (LED) mounted on the stem substrate. Also coupled to the substrate are a sleeve, a reflector, and a lens. To make the light emitting die package, a long substrate is formed and wire leads attached to the substrate. Then, the substrate including the attached wire leads is cut to predetermine lengths to form individual stem substrates. To each stem substrate, LED, reflector, and lens are coupled.

Abstract: A light emitting die package and a method of making the light emitting die package are disclosed. The die package includes a stem substrate having grooves, a wire lead attached to the grooves, and a light emitting diode (LED) mounted on the stem substrate. Also coupled to the substrate are a sleeve, a reflector, and a lens. To make the light emitting die package, a long substrate is formed and wire leads attached to the substrate. Then, the substrate including the attached wire leads is cut to predetermine lengths to form individual stem substrates. To each stem substrate, LED, reflector, and lens are coupled.

Abstract: Light emitting die package is disclosed. The die package includes a leadframe, a bottom heatsink, a top heatsink, a reflector and a lens. The top and bottom heatsinks are thermally coupled but electrically insulated from the leadframe. The leadframe includes a plurality of leads and defines a mounting pad for mounting LEDS. The top heatsink defines an opening over the mounting pad. The reflector is coupled to the top heatsink at the opening. The lens is placed over the opening defining an enclosed cavity over the mounting pad. At least one light emitting device (LED) is mounted on the mounting pad within the cavity. Encapsulant optically couples the LED to its surrounding surfaces to maximize its optical performance. When energized, the LED generates light and heat. The light is reflected by the reflector and operated on by the lens. The heat is dissipated by the top and the bottom heatsinks.

Abstract: A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate may be made from thermally conductive but electrically insulating material or from a material that is both thermally and electrically conductive. In embodiments wherein the substrate is made from an electrically conductive material, the substrate further includes an electrically insulating, thermally conductive material formed on the electrically conductive material. The substrate has traces for connecting to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad. The lens substantially covers the mounting pad. Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink). The reflector plate includes a reflective surface to direct light from the LED in a desired direction.

Abstract: A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate is made from thermally conductive but electrically insulating material. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). The lens can be coated with any optical system of chemical that affects the performance of the device. Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink). The reflector plate includes a reflective surface to direct light from the LED in a desired direction.