Abstract: A laser cutting apparatus and a method for dicing a wafer. The laser cutting apparatus is used to cut a substrate retained on a support table and includes a laser. The substrate is disposed between the laser and the support table. The laser is adapted to emit first and second laser radiations so that the first laser radiation and the second radiation act on the substrate at different locations, a difference T between the time at which the second laser radiation acts on the substrate at the location and the time at which the first laser radiation acts on the substrate at the location is longer than or equal to 0. The first laser radiation is used to cut the substrate, and the second laser radiation is used to clear byproducts produced from the cutting of the substrate by the first laser radiation.

Abstract: A dual-pedal driven scooter includes a frame having a front end and a rear end. Front wheels and a rear wheel that are connected to the frame at the front end and the rear end, respectively. A transmission mechanism is configured to drive the rear wheel to thereby drive the scooter. A pedal is configured to drive the scooter wherein. The transmission mechanism is provided with a transmission rope that links the pedal and the rear wheel. The pedal is fixedly connected to the transmission rope to thereby drive the rear wheel by pulling the transmission rope.

Abstract: The present disclosure provides an overlay mark, an overlay error measurement method for a wafer, and a wafer stacking method. The overlay mark includes a first overlay mark disposed on a first layer, and a second overlay mark disposed on a second layer. The first layer and the second layer are stacked. The first overlay mark includes at least one first overlay sub-mark, and each of the at least one first overlay sub-mark is circular in shape. The second overlay mark includes a second overlay sub-mark, and the second overlay sub-mark is in a center-symmetrical shape including a plurality of linear graphics.

Abstract: A method for stacking multi-layer wafers, and a system for stacking multi-layer wafers. The method includes bonding a wafer to a carrier wafer; a first feature pattern being defined in the wafer; acquiring overlay deviation values of different positions of the first feature pattern relative to the carrier wafer; fitting the overlay deviation values corresponding to the different positions and obtaining an actual deviation value of the wafer; and compensating an exposure process of the wafer based on the actual deviation value. In this way, an occurrence of the wafer failing to be exposed and being scrapped due to an alignment accuracy between the wafer and the carrier wafer being lower may be reduced.

Abstract: A dual-pedal driven scooter includes a frame having a front end and a rear end. Front wheels and a rear wheel that are connected to the frame at the front end and the rear end, respectively. A transmission mechanism is configured to drive the rear wheel to thereby drive the scooter. A pedal is configured to drive the scooter wherein. The transmission mechanism is provided with a transmission rope that links the pedal and the rear wheel. The pedal is fixedly connected to the transmission rope to thereby drive the rear wheel by pulling the transmission rope.

Abstract: A dual pedal driven scooter includes a frame with a front end and a rear end; a front wheel and a rear wheel connected to the frame at the front end and the rear end, respectively; a driving mechanism configured to drive the rear wheel to in turn drive the scooter; and a pedal configured to drive the scooter; wherein the driving mechanism has a driving linkage that links the pedal and the rear wheel, and the pedal is fixedly connected with the driving linkage so as to drive the rear wheel by pulling the driving linkage. The invention is more comfortable and safe to use, and not only is suitable for both playing and fitness but also suitable for a short-distance walk.

Abstract: A one-way bearing, including: an outer race fixed around an inner supporting bracket, wherein the combination of the outer race and the inner supporting bracket defines a plurality of cavities between the outer race and the inner supporting bracket; and a rolling member provided in each of the plurality of cavities, wherein the rolling member is arrange to rotate and move within each of the plurality of cavities; wherein a blocking structure is provided at each of the plurality of cavities so as to block the rolling member within each of the plurality of cavities from entering an adjacent cavity.

Abstract: A dual pedal driven scooter includes a frame with a front end and a rear end; a front wheel and a rear wheel connected to the frame at the front end and the rear end, respectively; a driving mechanism configured to drive the rear wheel to in turn drive the scooter; and a pedal configured to drive the scooter; wherein the driving mechanism has a driving linkage that links the pedal and the rear wheel, and the pedal is fixedly connected with the driving linkage so as to drive the rear wheel by pulling the driving linkage. The invention is more comfortable and safe to use, and not only is suitable for both playing and fitness but also suitable for a short-distance walk.

Abstract: A one-way bearing, including: an outer race fixed around an inner supporting bracket, wherein the combination of the outer race and the inner supporting bracket defines a plurality of cavities between the outer race and the inner supporting bracket; and a rolling member provided in each of the plurality of cavities, wherein the rolling member is arrange to rotate and move within each of the plurality of cavities; wherein a blocking structure is provided at each of the plurality of cavities so as to block the rolling member within each of the plurality of cavities from entering an adjacent cavity.