Abstract: A radio-frequency module includes a radio-frequency integrated circuit (RFIC) including a base connection terminal, and a first radio-frequency (RF) connection terminal; a first connection member including a mounting area on which the RFIC is mounted, a base wiring electrically connected to the base connection terminal of the RFIC, and a first RF wiring electrically connected to the first RF connection terminal of the RFIC; a second connection member including a second RF wiring electrically connected to the first RF wiring of the first connection member, and a third RF wiring, at least a portion of the second connection member being more flexible than the first connection member; and a front-end integrated circuit (FEIC) mounted on the second connection member and configured to amplify the first RF signal to generate the first communications signal or amplify the first communications signal to generate the first RF signal.

Abstract: A touch sensing method includes: generating respective oscillation signals having a resonant frequency, the respective oscillation signals being changeable according to a plurality of touch inputs applied to a first touch switch unit and a second touch switch unit, formed in a housing of an electronic device; analyzing the applied plurality of touch inputs, based on a change in the resonant frequency of the generated oscillation signals; and discerning and sensing a type of a touch operation according to a pattern of the plurality of touch inputs, based on results of the analyzing of the applied plurality of touch inputs.

Abstract: A terminal may include: a sensor unit including a microphone configured to acquire a surrounding sound, and a position sensor configured to identify a position of the terminal; a processor configured to learn the position of the terminal and the surrounding sound to identify characteristics of a dangerous sound depending on the position of the terminal, and determine a setting value of a hearing aid depending on the identified characteristics of the dangerous sound; and a communicator configured to transmit the setting value to the hearing aid.

Abstract: A terminal may include: a sensor unit including a microphone configured to acquire a surrounding sound and a position sensor configured to detect a position of the terminal; a processor configured to identify characteristics of a voice of a specific person designated by a user of the terminal through learning, and determine a setting value determining operating characteristics of a hearing aid based on the characteristics of the voice of the specific person; and a communicator configured to transmit the setting value to the hearing aid.

Abstract: A radio-frequency module includes a radio-frequency integrated circuit (RFIC) including a base connection terminal, and a first radio-frequency (RF) connection terminal; a first connection member including a mounting area on which the RFIC is mounted, a base wiring electrically connected to the base connection terminal of the RFIC, and a first RF wiring electrically connected to the first RF connection terminal of the RFIC; a second connection member including a second RF wiring electrically connected to the first RF wiring of the first connection member, and a third RF wiring, at least a portion of the second connection member being more flexible than the first connection member; and a front-end integrated circuit (FEIC) mounted on the second connection member and configured to amplify the first RF signal to generate the first communications signal or amplify the first communications signal to generate the first RF signal.

Abstract: A terminal may include: a sensor unit including a microphone configured to acquire a surrounding sound, and a position sensor configured to identify a position of the terminal; a processor configured to learn the position of the terminal and the surrounding sound to identify characteristics of a dangerous sound depending on the position of the terminal, and determine a setting value of a hearing aid depending on the identified characteristics of the dangerous sound; and a communicator configured to transmit the setting value to the hearing aid.

Abstract: A terminal may include: a sensor unit including a microphone configured to acquire a surrounding sound and a position sensor configured to detect a position of the terminal; a processor configured to identify characteristics of a voice of a specific person designated by a user of the terminal through learning, and determine a setting value determining operating characteristics of a hearing aid based on the characteristics of the voice of the specific person; and a communicator configured to transmit the setting value to the hearing aid.

Abstract: The present disclosure relates to an image sensor device including: a fan-out semiconductor package including a first semiconductor chip having an active surface on which a connection pad is disposed, a first connection member disposed on the active surface and including a redistribution layer electrically connected to the connection pad of the first semiconductor chip, and a sealing material disposed on the first connection member and sealing at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the first connection member and electrically connected to the first connection member; and a third semiconductor chip disposed on the second semiconductor chip and electrically connected to the second semiconductor chip, in which at least one of the second semiconductor chip or the third semiconductor chip may be an image sensor. The present disclosure also relates to an image sensor module including the image sensor device.

Abstract: The present disclosure relates to an image sensor device including: a fan-out semiconductor package including a first semiconductor chip having an active surface on which a connection pad is disposed, a first connection member disposed on the active surface and including a redistribution layer electrically connected to the connection pad of the first semiconductor chip, and a sealing material disposed on the first connection member and sealing at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the first connection member and electrically connected to the first connection member; and a third semiconductor chip disposed on the second semiconductor chip and electrically connected to the second semiconductor chip, in which at least one of the second semiconductor chip or the third semiconductor chip may be an image sensor. The present disclosure also relates to an image sensor module including the image sensor device.