Abstract: A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.

Abstract: A light-emitting device includes a board, a light-emitting diode chip disposed on the board, a molding part disposed on the board and covering the light-emitting diode chip, and a lens cap disposed on the board that is coupled with the substrate thereon and covering the molding part. An air gap is disposed between the lens cap and the molding part.

Abstract: A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each including a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, in which at least one of the first and second lead frames include three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip disposed on the top surface of the first or second lead frame, and the top surfaces of the first and second lead frames are substantially flat.

Abstract: A light-emitting diode (LED) includes a substrate, a semiconductor stacked structure disposed on the substrate, the semiconductor stacked structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, a wavelength converting layer configured to convert a wavelength of light emitted from the semiconductor stacked structure, the wavelength converting layer covering side surfaces of the substrate and the semiconductor stacked structure, and a distributed Bragg reflector (DBR) configured to reflect at least a portion of light wavelength-converted by the wavelength converting layer, in which at least a portion of the DBR is covered with a metal layer configured to reflect light transmitted through the DBR.

Abstract: Disclosed is an underwater exploration system using a multi-joint underwater robot having a novel complex movement concept in which the multi-joint underwater robot moves through walking or swimming with multi-joint legs closely to a seafloor, differently from a conventional underwater robot to obtain a thrust through a propeller scheme. The underwater exploration system includes the multi-joint underwater robot having the complex movement function according, a depressor, and a mother ship to store data of an underwater state transmitted from the multi-joint underwater robot and to monitor and control a movement direction of the multi-joint underwater robot. The depressor is connected to the mother ship through a primary cable, the multi-joint underwater robot is connected to the depressor through a second cable, and resistance force of the primary cable is applied to the depressor without being transmitted to the multi-joint underwater robot.

Abstract: A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each comprising a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, at least one of the first and second lead frames comprise three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip arranged on the first surface of the first or second lead frame, a resin part disposed in the fixing space to support the first and second lead frames, and the first and second lead frames exposed to the outside through bottom surface.

Abstract: A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.

Abstract: An exemplary embodiment of the present invention discloses a light-emitting diode (LED) chip including a semiconductor stacked structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, a first electrode disposed on the semiconductor stacked structure, a wavelength converting layer disposed on the semiconductor stacked structure, and a transparent resin disposed on the wavelength converting layer.

Abstract: Disclosed is a hexapod walking robot having a robot arm combined with a leg and a plurality of joints. The hexapod walking robot having a robot arm combined with a leg and a plurality of joints includes a robot body; a plurality of legs installed to the robot body such that the legs have various degrees of freedom; and at least one grip unit installed to at least one of the legs such that at least one grip unit is foldable.

Abstract: A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.

Abstract: A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each comprising a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, at least one of the first and second lead frames comprise three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip arranged on the first surface of the first or second lead frame, a resin part disposed in the fixing space to support the first and second lead frames, and the first and second lead frames exposed to the outside through bottom surface.

Abstract: A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.

Abstract: A light-emitting device includes a first lead frame and a second lead frame spaced apart from each other, the first and second lead frames each including a first portion, and a second portion disposed on the first portion, a light-emitting diode chip disposed on the second portion of the first or second lead frame, and a resin at least partially covering the first and second lead frames. The first and second portions of the first lead frame have different planar shapes from each other, the first and second portions of the second lead frame have different planar shapes from each other, and the second portion of the first or second lead frame includes a first fixing element. A first space is disposed between the first portion of the first lead frame and the first portion of the second lead frame, and the first fixing element is disposed on the first space.

Abstract: A light-emitting device includes a board, a light-emitting diode chip disposed on the board, a molding part disposed on the board and covering the light-emitting diode chip, and a lens cap disposed on the board that is coupled with the substrate thereon and covering the molding part. An air gap is disposed between the lens cap and the molding part.

Abstract: A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.

Abstract: Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.

Abstract: A light emitting module including a lens is provided. The light emitting module includes a light emitting diode chip, and a lens. The lens according to an embodiment includes a lower surface having a concave portion, and an upper surface from which light incident on the concave portion is emitted. The upper surface of the lens includes a concave surface positioned in a central axis thereof. The concave portion of the lower surface includes at least one of a surface perpendicular to the central axis and a downwardly convex surface. At least one of the surface perpendicular to the central axis and the downwardly convex surface is positioned in a region narrower than an entrance region of the concave portion.

Abstract: A light-emitting device includes a first lead frame and a second lead frame spaced apart from each other, the first and second lead frames each including a first portion, and a second portion disposed on the first portion, a light-emitting diode chip disposed on the second portion of the first or second lead frame, and a resin at least partially covering the first and second lead frames. The first and second portions of the first lead frame have different planar shapes from each other, the first and second portions of the second lead frame have different planar shapes from each other, and the second portion of the first or second lead frame includes a first fixing element. A first space is disposed between the first portion of the first lead frame and the first portion of the second lead frame, and the first fixing element is disposed on the first space.

Abstract: A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.

Abstract: A lens including an upper surface having a curved portion having a changing curvature in a direction extending away from a central axis of the lens, and a lower surface having a concave portion disposed on the central axis of the lens. The concave portion of the lower surface includes an entrance disposed on a lower region of the concave portion and configured to receive light emitted from a light-emitting diode chip, and an upper end surface disposed on an upper region of the concave portion. The concave portion includes a width that narrows in a direction extending away from the entrance. The upper end surface is nonplanar.