Patents by Inventor Bang-Yun DAI

Bang-Yun DAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Communication device
    Patent number: 11329368
    Abstract: A communication device with an RF (Radio Frequency) node and a detection node includes a first radiation element, a second radiation element, a first inductor, a second inductor, a third inductor, a first capacitor, and a second capacitor. The first radiation element is coupled to a first node. The second radiation element is coupled to a second node. The first inductor is coupled between the RF node and the ground voltage. The first capacitor is coupled between the RF node and the first node. The second inductor is coupled between the first node and the second node. The second capacitor is coupled between the second node and the ground voltage. The third inductor is coupled between the detection node and the second node. An antenna structure and a sensing pad are formed by the first radiation element and the second radiation element.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: May 10, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chun-I Chen, Chun-Yuan Wang, Bang-Yun Dai, Chih-Tsung Tseng, Chung-Ting Hung
  • COMMUNICATION DEVICE
    Publication number: 20210218400
    Abstract: A communication device with an RF (Radio Frequency) node and a detection node includes a first radiation element, a second radiation element, a first inductor, a second inductor, a third inductor, a first capacitor, and a second capacitor. The first radiation element is coupled to a first node. The second radiation element is coupled to a second node. The first inductor is coupled between the RF node and the ground voltage. The first capacitor is coupled between the RF node and the first node. The second inductor is coupled between the first node and the second node. The second capacitor is coupled between the second node and the ground voltage. The third inductor is coupled between the detection node and the second node. An antenna structure and a sensing pad are formed by the first radiation element and the second radiation element.
    Type: Application
    Filed: February 26, 2020
    Publication date: July 15, 2021
    Inventors: Chun-I CHEN, Chun-Yuan WANG, Bang-Yun DAI, Chih-Tsung TSENG, Chung-Ting HUNG