Patents by Inventor Bangtong Ge

Bangtong Ge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220013656
    Abstract: This application discloses a method for manufacturing a thin film transistor, and a display panel. The method for manufacturing a thin film transistor includes steps of providing a substrate; forming an amorphous silicon thin film layer on the substrate; patterning the amorphous silicon thin film layer to form an amorphous silicon layer; forming a metal seed layer made of a nickel disilicide (NiSi2) material on the amorphous silicon layer; converting the amorphous silicon layer into a polysilicon layer under an induction effect of the metal seed layer and through an annealing treatment; and forming a source and drain layer.
    Type: Application
    Filed: December 5, 2019
    Publication date: January 13, 2022
    Inventor: Bangtong GE
  • Patent number: 11139324
    Abstract: A method of manufacturing array substrate and a display panel, wherein, the method of manufacturing array substrate includes: depositing a gate electrode, a gate insulation layer, a semiconductor layer, a metal layer and a photoresist; forming an non-exposure area, a partial exposure area and a full exposure area through exposure and developing; then, performing a first ashing treatment and a wet etching to form a metal layer recess, and performing a second ashing treatment to etch off residual photoresist which remains in the metal layer recess after the first ashing treatment; and finally performing a dry etching to form a pattern of a channel region.
    Type: Grant
    Filed: May 9, 2020
    Date of Patent: October 5, 2021
    Assignee: HKC CORPORATION LIMITED
    Inventors: Tingting Fu, Bangtong Ge
  • Publication number: 20210074741
    Abstract: This application discloses a display substrate, a method of manufacturing the display substrate, and a display device. The method of manufacturing the display substrate includes a step of: sequentially forming a first structural layer, a second structural layer, a third structural layer, a fourth structural layer, and a fifth structural layer stacked on a substrate, and after the second structural layer is formed and before the third structural layer is formed, further includes the following step: performing plasma cleaning on a surface of the second structural layer.
    Type: Application
    Filed: December 26, 2018
    Publication date: March 11, 2021
    Inventors: Bangtong GE, Tingting FU
  • Publication number: 20200273891
    Abstract: A method of manufacturing array substrate and a display panel, wherein, the method of manufacturing array substrate includes: depositing a gate electrode, a gate insulation layer, a semiconductor layer, a metal layer and a photoresist; forming an non-exposure area, a partial exposure area and a full exposure area through exposure and developing; then, performing a first ashing treatment and a wet etching to form a metal layer recess, and performing a second ashing treatment to etch off residual photoresist which remains in the metal layer recess after the first ashing treatment; and finally performing a dry etching to form a pattern of a channel region.
    Type: Application
    Filed: May 9, 2020
    Publication date: August 27, 2020
    Inventors: Tingting Fu, Bangtong Ge
  • Patent number: 10727256
    Abstract: A method for fabricating an array substrate, after the wet etching process of the source-drain metal layer (17), performs first ashing for the island-like photoresist pattern (19), such that the edge of the island-like photoresist pattern (19) is aligned with the edge of the source-drain metal segment (171).
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: July 28, 2020
    Assignee: HKC CORPORATION LIMITED
    Inventors: Bangtong Ge, Tingting Fu
  • Patent number: 10692900
    Abstract: A method of manufacturing array substrate and a display panel, wherein, the method of manufacturing array substrate includes: depositing a gate electrode, a gate insulation layer, a semiconductor layer, a metal layer and a photoresist; forming an non-exposure area, a partial exposure area and a full exposure area through exposure and developing; then, performing a first ashing treatment and a wet etching to form a metal layer recess, and performing a second ashing treatment to etch off residual photoresist which remains in the metal layer recess after the first ashing treatment; and finally performing a dry etching to form a pattern of a channel region.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: June 23, 2020
    Assignee: HKC CORPORATION LIMITED
    Inventors: Tingting Fu, Bangtong Ge
  • Publication number: 20200185430
    Abstract: A method of manufacturing array substrate and a display panel, wherein, the method of manufacturing array substrate includes: depositing a gate electrode, a gate insulation layer, a semiconductor layer, a metal layer and a photoresist; forming an non-exposure area, a partial exposure area and a full exposure area through exposure and developing; then, performing a first ashing treatment and a wet etching to form a metal layer recess, and performing a second ashing treatment to etch off residual photoresist which remains in the metal layer recess after the first ashing treatment; and finally performing a dry etching to form a pattern of a channel region.
    Type: Application
    Filed: December 7, 2018
    Publication date: June 11, 2020
    Inventors: Tingting Fu, Bangtong Ge
  • Publication number: 20200135767
    Abstract: A method for fabricating an array substrate, after the wet etching process of the source-drain metal layer (17), performs first ashing for the island-like photoresist pattern (19), such that the edge of the island-like photoresist pattern (19) is aligned with the edge of the source-drain metal segment (171).
    Type: Application
    Filed: November 29, 2018
    Publication date: April 30, 2020
    Inventors: Bangtong Ge, Tingting Fu