Abstract: A masking film includes an adhesion layer that includes a blend of hydrogenated styrene block copolymer and low density polyethylene. The adhesion layer has an outer adhesion surface configured to contact a substrate. The outer adhesion surface has an average surface roughness Ra of between 100 nm and 350 nm, and an average spacing between peaks Sm of between 20 ?m and 150 ?m. The masking film also includes a release layer on a side of the adhesion layer opposite the outer adhesion surface.

Abstract: A film for use as an interleaf between substrates includes a first side having a first micro-embossed surface and a first formed pattern, a second side having a second micro-embossed surface and a second formed pattern, a basis weight of between about 35 gsm and about 80 gsm, a Low Load Thickness of between about 150 micrometers and 400 micrometers according to the Low Load Thickness Test, and a flexural stiffness of between about 150 grams and about 500 grams according to the Circular Bend Stiffness Test.

Abstract: Films may be used as interleaves between hard and non-compressible surfaces such as surfaces of sheets or plates made of glass, metal, such as steel, polycarbonate, and/or poly(methyl methacrylate). The films may be embossed and/or may include a foamed core layer having a plurality of micro-voids. In particular, the films may include a polyolefin, a basis weight of between about 30 gsm and about 70 gsm, an embossed thickness of between about 150 microns and 800 microns, and a stiffness of between about 150 grams and about 750 grams according to the Circular Bend Stiffness Test.

Abstract: Films may be used as interleaves between hard and non-compressible surfaces such as surfaces of sheets or plates made of glass, metal, such as steel, polycarbonate, and/or poly(methyl methacrylate). The films may be embossed and/or may include a foamed core layer having a plurality of micro-voids. In particular, the films may include a polyolefin, a basis weight of between about 30 gsm and about 70 gsm, an embossed thickness of between about 150 microns and 800 microns, and a stiffness of between about 150 grams and about 750 grams according to the Circular Bend Stiffness Test.

Abstract: A film for use as an interleaf between substrates includes a first side having a first micro-embossed surface and a first formed pattern, a second side having a second micro-embossed surface and a second formed pattern, a basis weight of between about 35 gsm and about 80 gsm, a Low Load Thickness of between about 150 micrometers and 400 micrometers according to the Low Load Thickness Test, and a flexural stiffness of between about 150 grams and about 500 grams according to the Circular Bend Stiffness Test.

Abstract: A masking film includes an adhesion layer that includes a blend of hydrogenated styrene block copolymer and low density polyethylene. The adhesion layer has an outer adhesion surface configured to contact a substrate. The outer adhesion surface has an average surface roughness Ra of between 100 nm and 350 nm, and an average spacing between peaks Sm of between 20 ?m and 150 ?m. The masking film also includes a release layer on a side of the adhesion layer opposite the outer adhesion surface.

Abstract: A method of forming a thermoplastic polymer film includes melting and subjecting a polymer resin material to shear stresses in a range of 250 kPa to 400 kPa to form a refined resin material and forming the thermoplastic polymer film from the refined resin material. The film is substantially free of microgels having a largest dimension greater than 50 microns. The film has a thickness in a range of 15 micron to 80 microns. The film has a microgel count in a range of 0 to 0.2 per mm2 of microgels having the maximum dimension greater than 10 microns.

Abstract: Films may be used as interleaves between hard and non-compressible surfaces such as surfaces of sheets or plates made of glass, metal, such as steel, polycarbonate, and/or poly(methyl methacrylate). The films may be embossed and/or may include a foamed core layer having a plurality of micro-voids. In particular, the films may include a polyolefin, a basis weight of between about 30 gsm and about 70 gsm, an embossed thickness of between about 150 microns and 800 microns, and a stiffness of between about 150 grams and about 750 grams according to the Circular Bend Stiffness Test.

Abstract: An illustrative aspect of the invention provides a film comprising a release layer defining a first outer film surface and an adhesion layer defining a second outer film surface opposite the first outer film surface. The adhesion layer comprises a hydrogenated styrene block copolymer with a styrene content in a range of about 30% to 40% by weight. In some embodiments, the adhesion layer may further comprise low density polyethylene (LDPE). In some embodiments, the adhesion layer may further comprise LDPE and high density polyethylene (HDPE).

Abstract: A method of refining a polymer resin material is provided. The method comprises melting and subjecting the resin material to shear stresses in a range of 250 kPa to 400 kPa to form a refined resin material. The refined resin material may be extruded, solidified and cut into reduced microgel resin pellets, which may be subsequently melted and extruded to form a reduced microgel film.

Abstract: An illustrative aspect of the invention provides a film comprising a release layer defining a first outer film surface and an adhesion layer defining a second outer film surface opposite the first outer film surface. The adhesion layer comprises a hydrogenated styrene block copolymer with a styrene content in a range of about 30% to 40% by weight. In some embodiments, the adhesion layer may further comprise low density polyethylene (LDPE). In some embodiments, the adhesion layer may further comprise LDPE and high density polyethylene (HDPE).