Patents by Inventor Bao Chau L. Nguyen

Bao Chau L. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High performance orthogonal interconnect architecture without midplane
    Patent number: 6462957
    Abstract: An improved electrical interconnection between a first circuit board and a second circuit board is provided. In one embodiment, the first circuit board has a substantially rigid circuit portion having a plurality of circuit layers, including a first signal layer, and a first interconnection portion, including the first signal layer, for mating with a second interconnection portion of the second circuit board. The first circuit board also includes a flexible portion, including the first signal layer, for connecting the substantially rigid circuit portion to the first interconnection portion. The flexible portion allows the first interconnection portion to be oriented substantially perpendicular to the substantially rigid circuit portion such that a mating of the first interconnection portion with the second interconnection portion results in a substantially orthogonal electrical interconnection arrangement between the first circuit board and the second circuit board.
    Type: Grant
    Filed: December 20, 2000
    Date of Patent: October 8, 2002
    Assignee: Nortel Networks Limited
    Inventors: Herman Kwong, Bao Chau L. Nguyen, Van C. Au, Paul A. Senyshyn, Martin R. Handforth, Rolf G. Meier, Delfin Y. Montuno, Ernst A. Munter, Hasler R. Hayes