Abstract: A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving section (32) and two heat-discharging sections (34). The second heat pipe includes an evaporating portion (42) and two condensing portions (44). The condensing portions of the second heat pipe extend into the fins and are disposed adjacent to opposite ends of each of the fins. One heat-discharging section extends in the fins and is disposed between the condensing portions, thus allowing heat absorbed from the base to be evenly distributed throughout the fins by the heat-discharging sections and the condensing portions.

Abstract: A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving section (32) and two heat-discharging sections (34). The second heat pipe includes an evaporating portion (42) and two condensing portions (44). The condensing portions of the second heat pipe extend into the fins and are disposed adjacent to opposite ends of each of the fins. One heat-discharging section extends in the fins and is disposed between the condensing portions, thus allowing heat absorbed from the base to be evenly distributed throughout the fins by the heat-discharging sections and the condensing portions.

Abstract: A heat dissipation device includes a heat sink including a base for contacting with an electronic device, a fin set having a plurality of fins, and a heat pipe having a first section thermally attached to the base and a second section extending through the fin set. Each of the fins has an airflow guiding structure in a passage formed between two neighboring fins. A fan is attached to a front of the heat sink. An airflow provided by the fan flows into the passage and is then directed by the airflow guiding structure to joints of the second section of the heat pipe with the fins where more heat from the electronic device is accumulated. The guiding structure includes two guiding sidewalls extending in a diverging manner from the fan toward a rear of the heat sink.

Abstract: A heat dissipating device of the present invention includes a heat sink (20) and two locking devices (10) for securing the heat sink. The heat sink includes a base (22) for contacting an electronic component. Each locking device includes a spring member, a post (12) and a sleeve (18). The spring member elastically rests on the base. The post extends through the sleeve. The post has one end engaging with the spring member, and an opposite end thereof extending beyond the sleeve for locking the combination. The sleeve has one end tightly grasping the post, and an opposite end thereof preventing the locking device from departing from the heat sink.

Abstract: A heat dissipation assembly includes a heat sink, a retention module and a clip for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating device. The retention module includes a bottom wall and a first sidewall defining a slot therein and extending from the bottom wall. The clip includes a connecting portion pivotably connected to the retention module. The heat sink rests on the bottom wall of the retention module with an end thereof fitting in the slot, and an opposite end thereof being pressed by the clip. The clip can be in a released position that the clip is pivotable, so that the heat sink is removable from the retention module, and a locked position that the clip presses the heat sink. Thus, the heat sink can be secured to the heat generating device expediently.

Abstract: A computer system includes a casing, a motherboard, a CPU mounted on the motherboard and a cooling device. The casing includes a pair of parallel panels. Air inlets and air outlets are respectively defined in the parallel panels and oriented toward each other. The motherboard is parallelly positioned between the parallel panels. The cooling device has a base portion contacting the CPU, a heat dissipation portion defining a plurality of channels communicating with the air outlets, at least one heat pipe thermally connecting the heat dissipation portion to the base portion, and a fan communicating with the air inlets and the channels.

Abstract: A heat dissipation device includes a heat sink, a retention module and a clip having two clipping portions for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating electronic device. The base defines two flutes in two opposite sides thereof respectively. Each of the flutes is located at a middle of a corresponding one of the two opposite sides. The retention module is located around the electronic device and includes a bottom wall for supporting the heat sink. Each clipping portion is rotatablely connected to the retention module and includes a pressing portion which is rotatablely received in the flute of the base and presses the base to the bottom wall of the retention module when the clip is rotated to a position locked to the retention module.

Abstract: A computer chassis compatible with an ATX motherboard and a BTX motherboard, includes a motherboard holder (100) for mounting an ATX motherboard or a BTX motherboard thereon, a first back panel (200) designed for the ATX motherboard, and a second back panel (300) designed for the BTX motherboard. A side panel (840) is located opposite the motherboard holder, defining a plurality of vents (842) in a lower portion of the side panel. The motherboard holder, the first and second back panels are available in two arrangements to make the computer chassis in accordance with the preferred embodiment of the present invention to be adapted to the ATX motherboard or the BTX motherboard.

Abstract: A computer system includes a casing, a motherboard, a CPU mounted on the motherboard and a cooling device. The casing includes a pair of parallel panels. Air inlets and air outlets are respectively defined in the parallel panels and oriented toward each other. The motherboard is parallelly positioned between the parallel panels. The cooling device has a base portion contacting the CPU, a heat dissipation portion defining a plurality of channels communicating with the air outlets, at least one heat pipe thermally connecting the heat dissipation portion to the base portion, and a fan communicating with the air inlets and the channels.

Abstract: A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (12) arranged side by side. Each fin plate includes a main body (14). First and second flanges (16, 18) extend perpendicularly from opposite edges of the main body of each fin plate. A pair of spaced first bridge-shaped tabs (20) extends perpendicularly from the first flange toward the second flange. A pair of spaced second bridge-shaped tabs (24) extends perpendicularly from the second flange toward the first flange. Projections (28) are stamped from the main body opposing to the first and second bridge-shaped tabs. The tabs of each fin plate are interlocked with the projections of an adjacent fin plate. In this manner, all the fin plates are assembled together. The heat-dissipating fin assembly is thus formed.

Abstract: A heat dissipation device includes a heat sink, a retention module and a clip having two clipping portions for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating electronic device. The base defines two flutes in two opposite sides thereof respectively. Each of the flutes is located at a middle of a corresponding one of the two opposite sides. The retention module is located around the electronic device and includes a bottom wall for supporting the heat sink. Each clipping portion is rotatablely connected to the retention module and includes a pressing portion which is rotatablely received in the flute of the base and presses the base to the bottom wall of the retention module when the clip is rotated to a position locked to the retention module.

Abstract: A heat dissipating device assembly for an electronic components (70), includes a heat sink (10) for contacting the electronic component, and a locking device (20) and a back plate unit (40) for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module (28) located around the electronic component for supporting the heat sink thereon, and a clip (30) pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.

Abstract: A heat dissipating device of the present invention includes a heat sink (20) and two locking devices (10) for securing the heat sink. The heat sink includes a base (22) for contacting an electronic component. Each locking device includes a spring member, a post (12) and a sleeve (18). The spring member elastically rests on the base. The post extends through the sleeve. The post has one end engaging with the spring member, and an opposite end thereof extending beyond the sleeve for locking the combination. The sleeve has one end tightly grasping the post, and an opposite end thereof preventing the locking device from departing from the heat sink.

Abstract: A heat dissipation assembly includes a heat sink, a retention module and a clip for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating device. The retention module includes a bottom wall and a first sidewall defining a slot therein and extending from the bottom wall. The clip includes a connecting portion pivotably connected to the retention module. The heat sink rests on the bottom wall of the retention module with an end thereof fitting in the slot, and an opposite end thereof being pressed by the clip. The clip can be in a released position that the clip is pivotable, so that the heat sink is removable from the retention module, and a locked position that the clip presses the heat sink. Thus, the heat sink can be secured to the heat generating device expediently.

Abstract: A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (12) arranged side by side. Each fin plate includes a main body (14). First and second flanges (16, 18) extend perpendicularly from opposite edges of the main body of each fin plate. A pair of spaced first bridge-shaped tabs (20) extends perpendicularly from the first flange toward the second flange. A pair of spaced second bridge-shaped tabs (24) extends perpendicularly from the second flange toward the first flange. Projections (28) are stamped from the main body opposing to the first and second bridge-shaped tabs. The tabs of each fin plate are interlocked with the projections of an adjacent fin plate. In this manner, all the fin plates are assembled together. The heat-dissipating fin assembly is thus formed.

Abstract: A heat dissipating device assembly for an electronic components (70), includes a heat sink (10) for contacting the electronic component, and a locking device (20) and a back plate unit (40) for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module (28) located around the electronic component for supporting the heat sink thereon, and a clip (30) pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.