Patents by Inventor Bao-Hua XU

Bao-Hua XU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromagnetic interference (EMI) evaluation system for image sensors
    Patent number: 10753967
    Abstract: An apparatus configured to measure electromagnetic radiation coupled from an image sensor integrated circuit (IC) to a nearby cell phone antenna has an image sensor PCB with the image sensor IC on a first side and image sensor decoupling capacitors disposed on a second side, the image sensor PCB disposed within a shielding box. The apparatus also has an image processor PCB with an image processor IC on a first side and at least one image processor decoupling capacitors, the image processor IC electrically coupled to the image sensor IC. The image processor IC is located outside the shielding box, and the at least one image processor decoupling capacitor is within the shielding box. In embodiments, the decoupling capacitors are shielded with separate, additional, metal covers.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: August 25, 2020
    Assignee: OmniVision Technologies, Inc.
    Inventors: Qianyi Zhao, Xiaojun Zhang, Pan-Xun Jiang, Bao-Hua Xu, Heng Fan
  • ELECTROMAGNETIC INTERFERENCE (EMI) EVALUATION SYSTEM FOR IMAGE SENSORS
    Publication number: 20190162769
    Abstract: An apparatus configured to measure electromagnetic radiation coupled from an image sensor integrated circuit (IC) to a nearby cell phone antenna has an image sensor PCB with the image sensor IC on a first side and image sensor decoupling capacitors disposed on a second side, the image sensor PCB disposed within a shielding box. The apparatus also has an image processor PCB with an image processor IC on a first side and at least one image processor decoupling capacitors, the image processor IC electrically coupled to the image sensor IC. The image processor IC is located outside the shielding box, and the at least one image processor decoupling capacitor is within the shielding box. In embodiments, the decoupling capacitors are shielded with separate, additional, metal covers.
    Type: Application
    Filed: November 27, 2018
    Publication date: May 30, 2019
    Inventors: Qianyi ZHAO, Xiaojun ZHANG, Pan-Xun JIANG, Bao-Hua XU, Heng FAN