Patents by Inventor Bao T. Hwang

Bao T. Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low cost shallow trench isolation using non-conformal dielectric material
    Publication number: 20010036709
    Abstract: A method is provided for planarizing a structure such as a shallow trench isolation region on a semiconductor substrate. A semiconductor substrate is provided having raised and lowered regions with substantially vertical and horizontal surfaces. The lowered regions may correspond to trench regions. Filler material such as non-conformal high density plasma oxide may be deposited over the horizontal surfaces to at least a thickness equal to a predetermined height so as to provide raised and lowered regions of the filler material. The raised regions of the filler material may then be selectively removed without removing the filler material in the lowered regions.
    Type: Application
    Filed: June 20, 2001
    Publication date: November 1, 2001
    Inventors: John W. Andrews, Bao T. Hwang, Howard S. Landis, Shaw-Ning Mei, James M. Tyler, Edward J. Vishnesky
  • Low cost shallow trench isolation using non-conformal dielectric material
    Patent number: 6270353
    Abstract: A method is provided for planarizing a structure such as a shallow trench isolation region on a semiconductor substrate. A semiconductor substrate is provided having raised and lowered regions with substantially vertical and horizontal surfaces. The lowered regions may correspond to trench regions. Filler material such as non-conformal high density plasma oxide may be deposited over the horizontal surfaces to at least a thickness equal to a predetermined height so as to provide raised and lowered regions of the filler material. The raised regions of the filler material may then be selectively removed without removing the filler material in the lowered regions.
    Type: Grant
    Filed: June 7, 1999
    Date of Patent: August 7, 2001
    Assignee: International Business Machines Corporation
    Inventors: John W. Andrews, Bao T. Hwang, Howard S. Landis, Shaw-Ning Mei, James M. Tyler, Edward J. Vishnesky
  • Pacifier
    Patent number: D328647
    Type: Grant
    Filed: April 16, 1990
    Date of Patent: August 11, 1992
    Assignee: Lewis Woolf Griptight Limited
    Inventor: Bao T. Hwang