Patents by Inventor Bao-Tong Ma

Bao-Tong Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing circuit board assemblies using surface mount components with finely spaced leads
    Patent number: 6545229
    Abstract: Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.
    Type: Grant
    Filed: August 15, 2000
    Date of Patent: April 8, 2003
    Assignee: International Business Machines Corporation
    Inventors: Bao-Tong Ma, Amit Kumar Sarkhel, Ping Kwong Seto
  • Method for producing circuit board assemblies using surface mount components with finely spaced leads
    Patent number: 6167615
    Abstract: Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.
    Type: Grant
    Filed: April 6, 1998
    Date of Patent: January 2, 2001
    Assignee: International Business Machines Corporation
    Inventors: Bao-Tong Ma, Amit Kumar Sarkhel, Ping Kwong Seto
  • Method for producing circuit board assemblies using surface mount components with finely spaced leads
    Patent number: 5742483
    Abstract: Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.
    Type: Grant
    Filed: April 10, 1996
    Date of Patent: April 21, 1998
    Assignee: International Business Machines Corporation
    Inventors: Bao-Tong Ma, Amit Kumar Sarkhel, Ping Kwong Seto