Patents by Inventor Baofeng SI

Baofeng SI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230305248
    Abstract: An optical module includes an upper shell, a lower shell, an optical engine, an optical port bracket, and an optical fiber adapter. The lower shell is covered with the upper shell and forms an accommodating cavity with the upper shell. The optical engine is disposed in the accommodating cavity. The optical port bracket is disposed on a bottom surface of the lower shell. The optical fiber adapter is connected to the optical engine and the optical port bracket. The upper shell includes first limiting members. The lower shell includes a first limiting boss. The optical port bracket includes a plurality of side walls and second limiting bosses, and two opposite side walls among the plurality of side walls are fixedly connected to the first limiting members. The second limiting bosses are disposed on two opposite side walls of the plurality of side walls.
    Type: Application
    Filed: May 31, 2023
    Publication date: September 28, 2023
    Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Jinlei CHEN, Yantao ZHU, Yaxun CHI, Baofeng SI
  • Patent number: 11681111
    Abstract: The present disclosure describes embodiments of a connector and an optical module, pertaining to the technical field of optoelectronic devices. The connector includes a substrate provided with a through-hole passing through the substrate from a first board surface to a second board surface thereof. The second board surface faces opposite from the first board surface. The first board surface is provided with a first groove and a second groove, and the first groove and the second groove respectively are configured to adapt to different optical fiber splices.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: June 20, 2023
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Jinlei Chen, Yinlong Liu, Baofeng Si
  • Publication number: 20220413238
    Abstract: An optical module includes a shell, an elastic sleeve and a conductive fiber sheet. The shell has a groove disposed on an outer wall thereof. The elastic sleeve includes a metal frame and a plurality of metal elastic pieces. The metal frame is sleeved in the groove, and the metal frame is fixedly connected to the shell. The plurality of metal elastic pieces are disposed on an edge of the metal frame and extend to an outside of the metal frame. The conductive fiber sheet is disposed between the shell and the elastic sleeve for connecting the shell and the elastic sleeve.
    Type: Application
    Filed: August 29, 2022
    Publication date: December 29, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Jinlei CHEN, Yantao ZHU, Hongchao PAN, Baofeng SI, Wei CUI
  • Publication number: 20220390692
    Abstract: An optical module includes a shell, a circuit board, a display light and a light guide pipe. The circuit board is disposed in the shell. The display light is disposed on the circuit board, and is configured to emit light of different colors. The light guide pipe is disposed between the shell and the circuit board. An input end of the light guide pipe is arranged to correspond to the display light, an output end of the light guide pipe is configured to transmit light emitted by the display light to an outside of the optical module. The shell includes a groove. The output end of the light guide pipe is fixed in the groove, so that the shell is fixed with the light guide pipe.
    Type: Application
    Filed: August 16, 2022
    Publication date: December 8, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Liu YANG, Jinlei CHEN, Qiang ZHANG, Shihai YANG, Wei CUI, Baofeng SI, Yuqing HONG, Hongchao PAN, Hua ZHANG
  • Publication number: 20220163741
    Abstract: An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly and a claw assembly. The lens assembly includes a lens base and a connecting part. The lens base covers the at least one of the light-transmitting chip or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The connecting part includes at least one positioning slot disposed on a surface of the connecting part facing away from the lens base. The claw assembly includes a claw and a through hole. The claw includes at least one positioning protrusion disposed on a surface of the claw facing the connecting part. The through hole is configured to be connected to an optical fiber outside the optical module.
    Type: Application
    Filed: February 14, 2022
    Publication date: May 26, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Wei CUI, Baofeng SI, Xuxia LIU, Hongchao PAN, Qian SHAO, Sigeng YANG, Peng HE, Chengshuang LUO, Fenglai WANG
  • Publication number: 20220099902
    Abstract: An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly, an optical fiber ferrule assembly and a fixing plate. The circuit board is disposed in the shell. The light-transmitting chip and/or the light-receiving chip is disposed on the circuit board. The lens assembly is disposed on the circuit board, covers the light-transmitting chip and/or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The optical fiber ferrule assembly is connected to the lens assembly, and is configured to transmit an optical signal incident into the optical fiber ferrule assembly. The fixing plate is configured to fix the optical fiber ferrule assembly to the lens assembly.
    Type: Application
    Filed: December 10, 2021
    Publication date: March 31, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Wei CUI, Xuxia LIU, Baofeng SI, Xiaolei MA, Sigeng YANG
  • Publication number: 20200278505
    Abstract: The present disclosure describes embodiments of a connector and an optical module, pertaining to the technical field of optoelectronic devices. The connector includes a substrate provided with a through-hole passing through the substrate from a first board surface to a second board surface thereof. The second board surface faces opposite from the first board surface. The first board surface is provided with a first groove and a second groove, and the first groove and the second groove respectively are configured to adapt to different optical fiber splices.
    Type: Application
    Filed: May 21, 2020
    Publication date: September 3, 2020
    Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Jinlei CHEN, Yinlong LIU, Baofeng SI
  • Patent number: 10711979
    Abstract: An optical module comprising an upper portion of the housing with a bottom and two sides, a lower portion of the housing with a bottom and two sides, an electric component and an electroconductive sheet is provided. The two sides of the upper portion may be inserted between the two sides of the lower portion to form a relatively closed cavity for accommodating the electric component. A first convex block provided on the sides of the upper portion may be inserted into a gap which is formed between a second convex block and a third convex block provided on the sides of the lower portion. Thus, the first convex block, the second convex block and the third convex block may clamp the electroconductive sheet, thereby dividing the gap at the junction of the upper portion and the lower portion into a plurality of tiny gaps.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: July 14, 2020
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES, LTD.
    Inventors: Jinlei Chen, Yinlong Liu, Baofeng Si
  • Publication number: 20190391349
    Abstract: An optical module includes a base, an optical fiber adapter having a chuck, an optical subassembly coupled with the optical fiber adapter and a first support over the base and connected with the chuck. The first support includes an insulating material. The first support is configured to support the optical fiber adapter to electrically isolate the base from the optical fiber adapter.
    Type: Application
    Filed: June 27, 2019
    Publication date: December 26, 2019
    Inventors: Jinlei CHEN, Ruijuan ZHOU, Yinlong LIU, Baofeng SI
  • Publication number: 20180283658
    Abstract: An optical module comprising an upper portion of the housing with a bottom and two sides, a lower portion of the housing with a bottom and two sides, an electric component and an electroconductive sheet is provided. The two sides of the upper portion may be inserted between the two sides of the lower portion to form a relatively closed cavity for accommodating the electric component. A first convex block provided on the sides of the upper portion may be inserted into a gap which is formed between a second convex block and a third convex block provided on the sides of the lower portion. Thus, the first convex block, the second convex block and the third convex block may clamp the electroconductive sheet, thereby dividing the gap at the junction of the upper portion and the lower portion into a plurality of tiny gaps.
    Type: Application
    Filed: March 5, 2018
    Publication date: October 4, 2018
    Applicants: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.
    Inventors: Jinlei CHEN, Yinlong LIU, Baofeng SI