Abstract: Embodiments of this application provide a rear cover of an electronic device, an electronic device, and an air tightness detection system of an electronic device. The electronic device may include a mobile or fixed terminal having waterproof performance such as a mobile phone, a tablet computer, or a notebook computer. The rear cover includes a body portion and a structure layer fixed to a rear surface of the body portion. A smooth detection plane is formed on a rear surface of the structure layer, and a rear end of a balance channel of the rear cover is located within the detection plane, thereby resolving the problem that the material of the rear cover affects air tightness detection on the electronic device.

Abstract: A manufacturing method for low-magnetostrictive oriented silicon steel is provided, wherein the oriented silicon steel comprises a silicon steel substrate and an insulating coating on the surface of the silicon steel substrate. The manufacturing method comprises: performing single-sided laser etching on the silicon steel substrate, wherein the side of the silicon steel substrate, on which single-sided laser etching is performed, is a first surface, and the side opposite to the first surface is a second surface; determining a deflection difference between the first surface and the second surface based on the power of the laser etching, and determining a difference in the amount of the insulating coatings on the first surface and the second surface based on the deflection difference; and forming insulating coatings on the first surface and the second surface.

Abstract: A method is provided for fabricating a metal interconnect structure. The method includes forming a reticle having a metal line pattern region and at least a scattering bar by an optical proximity correction process; and providing a semiconductor substrate having a first dielectric layer and at least one conductive via. The method also includes aligning the reticle with the semiconductor substrate with the conductive via to align the scattering bar next to the conductive via; and forming metal line patterns on the first dielectric layer and a top surface of the conductive via to completely cover the conducive via.

Abstract: A method is provided for fabricating a metal interconnect structure. The method includes forming a reticle having a metal line pattern region and at least a scattering bar by an optical proximity correction process; and providing a semiconductor substrate having a first dielectric layer and at least one conductive via. The method also includes aligning the reticle with the semiconductor substrate with the conductive via to align the scattering bar next to the conductive via; and forming metal line patterns on the first dielectric layer and a top surface of the conductive via to completely cover the conducive via.

Abstract: A method is provided for fabricating a metal interconnect structure. The method includes forming a reticle having a metal line pattern region and at least a scattering bar by an optical proximity correction process; and providing a semiconductor substrate having a first dielectric layer and at least one conductive via. The method also includes aligning the reticle with the semiconductor substrate with the conductive via to align the scattering bar next to the conductive via; and forming metal line patterns on the first dielectric layer and a top surface of the conductive via to completely cover the conducive via.

Abstract: A method is provided for fabricating a metal interconnect structure. The method includes forming a reticle having a metal line pattern region and at least a scattering bar by an optical proximity correction process; and providing a semiconductor substrate having a first dielectric layer and at least one conductive via. The method also includes aligning the reticle with the semiconductor substrate with the conductive via to align the scattering bar next to the conductive via; and forming metal line patterns on the first dielectric layer and a top surface of the conductive via to completely cover the conducive via.