Patents by Inventor Baomin Liu

Baomin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240334824
    Abstract: A receptor material, a synthesis method and use thereof is disclosed. The synthesis method of the receptor material includes: S1, reacting the compound shown in a formula I with LiAlH4 to obtain a compound shown in a formula II; S2, reacting the compound shown in the formula II with 1,10-phenanthroline-5,6-dione to obtain a compound shown in a formula III; S3, reacting the compound shown in the formula III with phosphorus oxychloride and N,N-dimethylformamide to obtain a compound shown in a formula IV; and S4, reacting the compound shown in the formula IV with (5,6-dihalo-3-oxo-2,3-dihydro-1H-inden-1-ylidene)malononitrile. The receptor material provided by the present disclosure can effectively improve the open-circuit voltage and photoelectric conversion efficiency of organic photovoltaics cells including the receptor material. The present disclosure further provides an organic photovoltaic cell including the above receptor material and a method for preparing the organic photovoltaic cell.
    Type: Application
    Filed: April 1, 2024
    Publication date: October 3, 2024
    Applicant: SOUTHERN UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Xingzhu WANG, Zhixin LIU, Baomin XU
  • Publication number: 20240314921
    Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second side opposite the first side. The second cooling plate is fluidically coupled with the first cooling plate.
    Type: Application
    Filed: March 14, 2023
    Publication date: September 19, 2024
    Inventors: Jeff Ku, Baomin Liu, Cora Nien, Min Suet Lim, Tongyan Zhai
  • Publication number: 20240254151
    Abstract: The present application relates to the field of pharmaceutical chemistry, relates to an SOS1 inhibitor containing phosphorus, i.e., a compound of formula (I) and a preparation method therefor, and a pharmaceutical composition containing the compound, and relates to use thereof in the preparation of a drug for treating a disease and/or disorder related to SOS1 or regulated by SOS1.
    Type: Application
    Filed: May 10, 2021
    Publication date: August 1, 2024
    Inventors: Yinsheng Zhang, Baomin Liu, Zhengbang Chen, Jinfa Hu, Yuchen Chen, Kewen Sun, Jinan Wang, Lijuan Zhu
  • Publication number: 20230337406
    Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
    Type: Application
    Filed: December 23, 2020
    Publication date: October 19, 2023
    Inventors: Ritu BAWA, Ruander CARDENAS, Kathiravan D, Jia Yan GO, Chin Kung GOH, Jeff KU, Prakash Kurma RAJU, Baomin LIU, Twan Sing LOO, Mikko MAKINEN, Columbia MISHRA, Juha PAAVOLA, Prasanna PICHUMANI, Daniel RAGLAND, Kannan RAJA, Khai Ern SEE, Javed SHAIKH, Gokul SUBRAMANIAM, George Baoci SUN, Xiyong TIAN, Hua YANG, Mark CARBONE, Vivek PARANJAPE, Nehakausar PINJARI, Hari Shanker THAKUR, Christopher MOORE, Gustavo FRICKE, Justin HUTTULA, Gavin SUNG, Sammi WY LIU, Arnab SEN, Chun-Ting LIU, Jason Y. JIANG, Gerry JUAN, Shih Wei NIEN, Lance LIN, Evan KUKLINSKI
  • Publication number: 20220113092
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first support structure that includes a first heat source, a second support structure that includes a second heat source, and a heat pipe that has a first side and an opposite second side, where the first heat source is coupled to the first side of the heat pipe and the second heat source is coupled to the second side of the heat pipe. In some examples, the heat pipe can be a vapor chamber.
    Type: Application
    Filed: December 22, 2021
    Publication date: April 14, 2022
    Applicant: Intel Corporation
    Inventors: Jeff Ku, Baomin Liu, Cora Nien
  • Publication number: 20210349509
    Abstract: Particular embodiments described herein provide for a device that can include at least one heat source and a vapor chamber, where the vapor chamber is bigger than the at least one heat source and a portion of the vapor chamber is in direct contact with the at least one heat source, where the portion of the vapor chamber in direct contact with the at least one heat source does not include a stiffener. In an example, the device can include a first air mover on a first side of the at least one heat source and a second air mover on an opposite side of the at least one heat source. Exhaust from the first air mover can pass through a vented foot and exhaust from the second air mover can pass through a second vented foot.
    Type: Application
    Filed: July 23, 2021
    Publication date: November 11, 2021
    Applicant: Intel Corporation
    Inventors: James Utz, Baomin Liu, Eduardo Escamilla
  • Patent number: 11073878
    Abstract: Particular embodiments described herein provide for a device that can include at least one heat source and a vapor chamber, where the vapor chamber is bigger than the at least one heat source and a portion of the vapor chamber is in direct contact with the at least one heat source, where the portion of the vapor chamber in direct contact with the at least one heat source does not include a stiffener. In an example, the device can include a first air mover on a first side of the at least one heat source and a second air mover on an opposite side of the at least one heat source. Exhaust from the first air mover can pass through a vented foot and exhaust from the second air mover can pass through a second vented foot.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: July 27, 2021
    Assignee: Intel Corporation
    Inventors: Baomin Liu, Eduardo Escamilla, James Utz
  • Publication number: 20210112679
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a plurality of heat sources on the substrate, a heat spreader that extends over the plurality of heat sources, and a plurality of heat spreader mounting brackets. Each of the plurality of heat spreader mounting brackets are over a corresponding heat source from the plurality of heat sources and the plurality of heat spreaders secure the heat spreader to the substrate without extending through the heat spreader. In some examples, the heat spreader is a vapor chamber and the plurality of heat spreader mounting brackets are soldered to the vapor chamber.
    Type: Application
    Filed: December 22, 2020
    Publication date: April 15, 2021
    Applicant: Intel Corporation
    Inventors: Baomin Liu, Rob W. Sims, Kannan G. Raja, Linden H. McClure, Gopinath Kandasamy
  • Patent number: 10768676
    Abstract: Illustrative examples include a docking system for a foldable electronic device such as a 2-in-1 convertible computer. The docking system may include a housing having an engagement surface to interface with a portion of the foldable electronic device when the foldable electronic device is operably engaged with the docking system. The engagement surface may include a vent opening arranged to direct airflow in between a first portion and a second portion of the plurality of portions, and a separator to maintain separation between the first portion and the second portion when the foldable electronic device is operably engaged with the engagement surface. A blower coupled to the housing may supply airflow through the vent opening.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: September 8, 2020
    Assignee: Intel Corporation
    Inventors: Baomin Liu, Eduardo Escamilla, James Utz
  • Patent number: 10766912
    Abstract: The present invention provides a silicon-containing compound for resistance to hepatitis c virus infection, and in particular provides a compound represented by formula I, or a pharmaceutically acceptable salt, or a tautomer, or a stereoisomer, or a deuterated compound thereof and mixture among them, a preparation process therefor, and a pharmaceutical composition comprising the same. The present application also provides a use of the compound, or a pharmaceutically acceptable salt, or a tautomer, or a stereoisomer, or a deuterated compound thereof and mixture among them, and a pharmaceutical composition comprising the same in treatment of hepatitis c virus infection.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: September 8, 2020
    Assignee: Chia Tai Tianqing Pharmaceutical Group Co., Ltd.
    Inventors: Yinsheng Zhang, Baomin Liu, Yu Huang, Zhengbang Chen, Kuo Gai, Xushi Liu, Xiaojin Wang, Hongjiang Xu
  • Patent number: 10717753
    Abstract: The present invention relates to the field of pharmaceutical chemistry, and relates to a deuterium-modified Brigatinib derivative, preparation method thereof, pharmaceutical composition containing the same and the uses of the deuterium-modified Brigatinib derivative and the pharmaceutical composition thereof in preparing a medicament for treating the disease mediated by anaplastic lymphoma kinase. The deuterium-modified Brigatinib derivative of the present invention has an excellent inhibitory activity on anaplastic lymphoma kinase and has better pharmacodynamic or pharmacokinetic properties relative to Brigatinib.
    Type: Grant
    Filed: November 24, 2016
    Date of Patent: July 21, 2020
    Assignee: Chia Tai Tianqing Pharmaceutical Group Co., Ltd.
    Inventors: Yinsheng Zhang, Baomin Liu, Beibei Yang
  • Publication number: 20200017532
    Abstract: The present invention provides a silicon-containing compound for resistance to hepatitis c virus infection, and in particular provides a compound represented by formula I, or a pharmaceutically acceptable salt, or a tautomer, or a stereoisomer, or a deuterated compound thereof and mixture among them, a preparation process therefor, and a pharmaceutical composition comprising the same. The present application also provides a use of the compound, or a pharmaceutically acceptable salt, or a tautomer, or a stereoisomer, or a deuterated compound thereof and mixture among them, and a pharmaceutical composition comprising the same in treatment of hepatitis c virus infection.
    Type: Application
    Filed: March 22, 2018
    Publication date: January 16, 2020
    Inventors: Yinsheng ZHANG, Baomin LIU, Yu HUANG, Zhengbang CHEN, Kuo GAI, Xushi LIU, Xiaojin WANG, Hongjiang XU
  • Patent number: 10412560
    Abstract: Disclosed is a mobile device. The mobile device may be located proximate a mobile terminal and controlled by the mobile terminal. The mobile device may include a processor and a memory. The memory may store instructions that, when executed by the processor, cause the processor to: determine a mode of operation of the mobile device, determine a thermal profile for the mode of operation of the mobile device, and implement a power profile to achieve the thermal profile.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: September 10, 2019
    Assignee: Intel Corporation
    Inventors: Ralph V. Miele, Eduardo Escamilla, James Utz, James M. Yoder, Tongyan Zhai, Baomin Liu, Meenakshi Gupta, Brian R Peil, Venkat R Gaurav, Drew G Damm, Andrew Larson, Ricky O Branner
  • Publication number: 20190072999
    Abstract: Illustrative examples include a docking system for a foldable electronic device such as a 2-in-1 convertible computer. The docking system may include a housing having an engagement surface to interface with a portion of the foldable electronic device when the foldable electronic device is operably engaged with the docking system. The engagement surface may include a vent opening arranged to direct airflow in between a first portion and a second portion of the plurality of portions, and a separator to maintain separation between the first portion and the second portion when the foldable electronic device is operably engaged with the engagement surface. A blower coupled to the housing may supply airflow through the vent opening.
    Type: Application
    Filed: September 7, 2017
    Publication date: March 7, 2019
    Inventors: Eduardo Escamilla, James Utz, Baomin Liu
  • Publication number: 20190050031
    Abstract: Particular embodiments described herein provide for a device that can include at least one heat source and a vapor chamber, where the vapor chamber is bigger than the at least one heat source and a portion of the vapor chamber is in direct contact with the at least one heat source, where the portion of the vapor chamber in direct contact with the at least one heat source does not include a stiffener. In an example, the device can include a first air mover on a first side of the at least one heat source and a second air mover on an opposite side of the at least one heat source. Exhaust from the first air mover can pass through a vented foot and exhaust from the second air mover can pass through a second vented foot.
    Type: Application
    Filed: April 19, 2018
    Publication date: February 14, 2019
    Applicant: INTEL CORPORATION
    Inventors: James Utz, Baomin Liu, Eduardo Escamilla
  • Publication number: 20180346498
    Abstract: The present invention relates to the field of pharmaceutical chemistry, and relates to a deuterium-modified Brigatinib derivative, preparation method thereof, pharmaceutical composition containing the same and the uses of the deuterium-modified Brigatinib derivative and the pharmaceutical composition thereof in preparing a medicament for treating the disease mediated by anaplastic lymphoma kinase. The deuterium-modified Brigatinib derivative of the present invention has an excellent inhibitory activity on anaplastic lymphoma kinase and has better pharmacodynamic or pharmacokinetic properties relative to Brigatinib.
    Type: Application
    Filed: November 24, 2016
    Publication date: December 6, 2018
    Inventors: Yinsheng ZHANG, Baomin LIU, Beibei YANG
  • Publication number: 20180091987
    Abstract: Disclosed is a mobile device. The mobile device may be located proximate a mobile terminal and controlled by the mobile terminal. The mobile device may include a processor and a memory. The memory may store instructions that, when executed by the processor, cause the processor to: determine a mode of operation of the mobile device, determine a thermal profile for the mode of operation of the mobile device, and implement a power profile to achieve the thermal profile.
    Type: Application
    Filed: September 29, 2016
    Publication date: March 29, 2018
    Inventors: Ralph V. Miele, Eduardo Escamilla, James Utz, James M. Yoder, Tongyan Zhai, Baomin Liu, Meenakshi Gupta, Brian R. Peil, Venkat R. Gaurav, Drew G. Damm, Andrew Larson, Ricky O. Branner, Steven J. Lofland, George H. Daskalakis, James C. Raupp, Michael Ahrens, David Pidwerbecki, Bo Qiu, Stacy L. Yee
  • Publication number: 20160338232
    Abstract: Various EMI shields with thermal management capabilities are disclosed. In one aspect, an EMI shield is provided that includes a thermal spreader plate adapted to be seated on and convey heat from an electromagnetic emissions generating component. The thermal spreader plate has a first material composition and a shield effectiveness that is absorption dominant to electromagnetic waves at a given electromagnetic emissions frequency. The EMI shield also includes a shell to cover and reflect electromagnetic emissions from the electromagnetic emissions generating component. The shell has a second material composition different than the first material composition and a shield effectiveness that is reflection dominant to electromagnetic waves at the given electromagnetic emissions frequency.
    Type: Application
    Filed: July 26, 2016
    Publication date: November 17, 2016
    Inventors: Baomin Liu, Todd W. Steigerwald
  • Patent number: 9483092
    Abstract: An integrated circuit includes a multiple number of processor cores and a system management unit. The multiple number of processor cores each operate at one of a multiple number of performance states. The system management unit is coupled to the multiple number of processor cores, for setting performance states of the multiple number of processor cores. The system management unit boosts a first performance state of a first processor core of the multiple number of processor cores based on both a first temperature calculated from an estimated power consumption, and a second temperature based on a temperature measurement.
    Type: Grant
    Filed: October 14, 2013
    Date of Patent: November 1, 2016
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Samuel Naffziger, Baomin Liu, Maxat Touzelbaev
  • Patent number: 9420734
    Abstract: Various EMI shields with thermal management capabilities are disclosed. In one aspect, an EMI shield is provided that includes a thermal spreader plate adapted to be seated on and convey heat from an electromagnetic emissions generating component. The thermal spreader plate has a first material composition and a shield effectiveness that is absorption dominant to electromagnetic waves at a given electromagnetic emissions frequency. The EMI shield also includes a shell to cover and reflect electromagnetic emissions from the electromagnetic emissions generating component. The shell has a second material composition different than the first material composition and a shield effectiveness that is reflection dominant to electromagnetic waves at the given electromagnetic emissions frequency.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: August 16, 2016
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Baomin Liu, Todd W. Steigerwald