Patents by Inventor Baoquan WU

Baoquan WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200408457
    Abstract: A device for isolating vibrations includes an ion trap, a cryocooler, a primary chamber, a secondary chamber, a vacuum ion pump, a heat exchanger, a sample chamber, a support part, a connector, a heat conduction part, a first platform, a second platform, and a flexible connecting part. The primary chamber, the secondary chamber, and the vacuum ion pump are fixedly disposed on the first platform. The connector is a hollow structure disposed between the primary chamber and the secondary chamber. The primary chamber communicates with the secondary chamber via the hollow structure thereby forming an airtight chamber. The vacuum ion pump is connected to the primary chamber via a five-way flange. The support part is fixed on the second platform. The cryocooler is fixed on the support part. The cryocooler includes a cold head and a machine head. The cold head is suspended in the primary chamber.
    Type: Application
    Filed: June 29, 2020
    Publication date: December 31, 2020
    Inventors: Wei WU, Qingqing QIN, Baoquan OU, Ting CHEN, Yi XIE, Pingxing CHEN
  • Patent number: 10810400
    Abstract: The present application provides a fingerprint identification module and a package structure of a fingerprint identification chip. The fingerprint identification module includes: a fingerprint identification chip and a package structure for packaging the fingerprint identification chip. The package structure leaves a fingerprint sensing region of the fingerprint identification chip exposed, an upper surface of a film layer of the fingerprint sensing region is provided with a protection layer with a predetermined thickness. The protection layer is exposed in the fingerprint sensing region outside the package structure and causes the fingerprint identification chip to have a predefined fingerprint identification distance.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: October 20, 2020
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Baoquan Wu, Wei Long, Yuping Liu
  • Patent number: 10810402
    Abstract: A fingerprint identification apparatus, a method for fabricating a cover and a terminal device are provided. A plurality of optical channels are arranged in the body of the cover, such that the light reflected by an object to be identified is as much as possible linearly transmitted to the photosensitive region in the image identification chip and the intensity of the light received by the image identification chip is maximized. This is favorable to form a clear image, and thus the precision of fingerprint identification of the fingerprint identification apparatus is improved. In addition, in the fingerprint identification apparatus, under the condition of satisfying the signal penetration rate, the cover may be as thick as possible, to further enhance the strength and reliability of the cover.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: October 20, 2020
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Baoquan Wu, Jian Shen, Wei Long
  • Publication number: 20200327299
    Abstract: The present application provides an optical fingerprint apparatus and an electronic device, which could reduce a thickness of the optical fingerprint apparatus. The optical fingerprint apparatus is applied to an electronic device having a display screen and configured to be disposed under the display screen, and the optical fingerprint apparatus comprises: an optical fingerprint chip configured to receive a fingerprint detecting signal, wherein the fingerprint detecting signal is used to detect fingerprint information of a finger; and a filter structure, wherein the filter structure is deposited or sputtered on the optical fingerprint chip.
    Type: Application
    Filed: June 2, 2020
    Publication date: October 15, 2020
    Inventors: Baoquan WU, Dan LI, Jianxiang ZHANG
  • Publication number: 20200327296
    Abstract: An embodiment of the present application discloses an optical fingerprint identification apparatus and an electronic device, which can improve performance of the optical fingerprint identification apparatus. The optical fingerprint identification apparatus includes: a light detection array; a filter layer, disposed above the light detection array, where the filter layer is integrated with the light detection array in a photosensor chip; a first light blocking layer formed above the filter layer, where the first light blocking layer is provided with a plurality of light passing holes; and a first microlens array disposed above the first light blocking layer, where the first microlens array is configured to converge the optical signal to the plurality of light passing holes of the first light blocking layer, and the optical signal is transmitted to the light detection array through the plurality of light passing holes of the first light blocking layer.
    Type: Application
    Filed: November 24, 2019
    Publication date: October 15, 2020
    Inventors: Baoquan WU, Sichao ZHANG, Wei LONG
  • Patent number: 10784298
    Abstract: Embodiments of the present application, pertaining to the technical field of optical devices, provide an optical module and a fabrication method thereof, and a terminal device using the same. The optical module includes a lens and a sensor package. The lens is positioned at an uppermost position of the optical module and attached to a lower position of a terminal screen, and is configured to transmit light passing through the screen; the sensor package includes an optical sensor, where a photosensitive region is arranged on an upper surface of the optical sensor, and the photosensitive region is configured to receive light passing through the lens; and the sensor package further includes an air gap, and the photosensitive region of the optical sensor is configured to receive the light passing through the screen via the air gap.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: September 22, 2020
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Haoxiang Dong, Ya Wei, Wei Long, Baoquan Wu
  • Patent number: 10770413
    Abstract: A chip packaging structure and method, and an electronic device, are provided. The chip packaging structure includes a support, a chip, at least one conductor, and a package for plastic packaging the support, the chip and the conductor. The chip is arranged on an upper surface of the support, a chip pad is formed on the upper surface of the chip, and the chip pad is connected to an external pad of the support by a bonding wire. The conductor is connected to the external pad or a ground pad of the chip pad, and the shortest distance from the conductor to the upper surface of the package is less than the shortest distance from the bonding wire to the upper surface of the package, whereby chip failure caused by static electricity discharge is greatly reduced.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: September 8, 2020
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Baoquan Wu, Xinfei Yu
  • Publication number: 20190326339
    Abstract: Embodiments of the present application, pertaining to the technical field of optical devices, provide an optical module and a fabrication method thereof, and a terminal device using the same. The optical module includes a lens and a sensor package. The lens is positioned at an uppermost position of the optical module and attached to a lower position of a terminal screen, and is configured to transmit light passing through the screen; the sensor package includes an optical sensor, where a photosensitive region is arranged on an upper surface of the optical sensor, and the photosensitive region is configured to receive light passing through the lens; and the sensor package further includes an air gap, and the photosensitive region of the optical sensor is configured to receive the light passing through the screen via the air gap.
    Type: Application
    Filed: June 5, 2019
    Publication date: October 24, 2019
    Inventors: Haoxiang DONG, Ya WEI, Wei LONG, Baoquan WU
  • Patent number: 10350869
    Abstract: The present disclosure discloses a fingerprint identification module and a method for manufacturing the same, and relates to the field of fingerprint identification technologies. The fingerprint identification module is obtained by dicing a board-level module, and includes a fingerprint identification chip, a filling material, a color coating and a cover. The color coating is disposed between the filling material and the cover, and the fingerprint identification chip is inversely attached in a hollow area of the filling material in a vacuum environment. The fingerprint identification module has a simple structure and is easy to manufacture. By using the method, the bubbles between the fingerprint identification chip and the cover are effectively eliminated, and the manufacture efficiency of the fingerprint identification module is improved.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: July 16, 2019
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Baoquan Wu, Wei Long
  • Publication number: 20190081012
    Abstract: A chip packaging structure and method, and an electronic device, are provided. The chip packaging structure includes a support, a chip, at least one conductor, and a package for plastic packaging the support, the chip and the conductor. The chip is arranged on an upper surface of the support, a chip pad is formed on the upper surface of the chip, and the chip pad is connected to an external pad of the support by a bonding wire. The conductor is connected to the external pad or a ground pad of the chip pad, and the shortest distance from the conductor to the upper surface of the package is less than the shortest distance from the bonding wire to the upper surface of the package, whereby chip failure caused by static electricity discharge is greatly reduced.
    Type: Application
    Filed: October 23, 2018
    Publication date: March 14, 2019
    Applicant: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Baoquan WU, Xinfei YU
  • Publication number: 20190026525
    Abstract: An optical fingerprint sensor and a packaging method of an optical fingerprint sensor, where the optical fingerprint sensor includes a package substrate, a sensor chip, an optical cover and a connection unit, and the optical cover is light-transmissive. A lower surface of the sensor chip is adhered to an upper surface of the package substrate by a first adhesive layer, and a lower surface of the optical cover is adhered to an upper surface of the sensor chip by a second adhesive layer, the sensor ship is connected to the package substrate by the connection unit, plastic package is performed on sides of the package substrate, the first adhesive layer, the sensor chip, the second adhesive layer and the optical cover by a plastic package colloid, and the second adhesive layer is light-transmissive.
    Type: Application
    Filed: September 25, 2018
    Publication date: January 24, 2019
    Inventors: Wei LONG, Baoquan WU
  • Publication number: 20190027390
    Abstract: In semiconductor packaging technologies, a secondary packaging method of a TSV chip and a secondary package of a TSV chip are provided. The TSV chip has a forward surface and a counter surface that are opposite to each other, a BGA solder ball is disposed on the counter surface, and the secondary packaging method includes: placing at least one TSV chip on a base on which a stress relief film layer is laid; cladding the TSV chip via a softened molding compound; removing the base after the molding compound is cured, to obtain a secondary package of the TSV chip; and processing a surface of the secondary package to expose the BGA solder ball.
    Type: Application
    Filed: September 24, 2018
    Publication date: January 24, 2019
    Applicant: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Baoquan WU, Wei LONG, Yuping LIU
  • Publication number: 20190019009
    Abstract: A fingerprint identification apparatus, a method for fabricating a cover and a terminal device are provided. A plurality of optical channels are arranged in the body of the cover, such that the light reflected by an object to be identified is as much as possible linearly transmitted to the photosensitive region in the image identification chip and the intensity of the light received by the image identification chip is maximized. This is favorable to form a clear image, and thus the precision of fingerprint identification of the fingerprint identification apparatus is improved. In addition, in the fingerprint identification apparatus, under the condition of satisfying the signal penetration rate, the cover may be as thick as possible, to further enhance the strength and reliability of the cover.
    Type: Application
    Filed: September 19, 2018
    Publication date: January 17, 2019
    Inventors: Baoquan WU, Jian SHEN, Wei LONG
  • Publication number: 20190012516
    Abstract: The present application provides a fingerprint identification module and a package structure of a fingerprint identification chip. The fingerprint identification module includes: a fingerprint identification chip and a package structure for packaging the fingerprint identification chip. The package structure leaves a fingerprint sensing region of the fingerprint identification chip exposed, an upper surface of a film layer of the fingerprint sensing region is provided with a protection layer with a predetermined thickness. The protection layer is exposed in the fingerprint sensing region outside the package structure and causes the fingerprint identification chip to have a predefined fingerprint identification distance.
    Type: Application
    Filed: September 13, 2018
    Publication date: January 10, 2019
    Inventors: Baoquan WU, Wei LONG, Yuping LIU
  • Publication number: 20180102261
    Abstract: A chip packaging structure includes: at least one package, each of the at least one package comprising at least one chip; and an expansion body wrapping the package and being cuttable according to a package size requirement. A chip packaging method includes: fixing at least one package to a lower mold surface via a carrier, and sealing an upper mold for the package; and fully filling a cavity between the carrier and the upper mold with an expansion body by plastic injection molding, the expansion body wrapping the at least one package; and releasing the mold to obtain a size-expanded package, and cutting the package according to a package size need. The present application achieves size-variable chip packaging.
    Type: Application
    Filed: September 6, 2017
    Publication date: April 12, 2018
    Inventors: Wei LONG, Baoquan WU, Xiangying LIU
  • Publication number: 20180015711
    Abstract: The present disclosure discloses a fingerprint identification module and a method for manufacturing the same, and relates to the field of fingerprint identification technologies. The fingerprint identification module is obtained by dicing a board-level module, and includes a fingerprint identification chip, a filling material, a color coating and a cover. The color coating is disposed between the filling material and the cover, and the fingerprint identification chip is inversely attached in a hollow area of the filling material in a vacuum environment. The fingerprint identification module has a simple structure and is easy to manufacture. By using the method, the bubbles between the fingerprint identification chip and the cover are effectively eliminated, and the manufacture efficiency of the fingerprint identification module is improved.
    Type: Application
    Filed: August 11, 2017
    Publication date: January 18, 2018
    Inventors: Baoquan WU, Wei LONG
  • Patent number: 9831216
    Abstract: The present disclosure discloses a chip packaging module, including: a first chip, where a first pad is disposed on a side neighboring to a front surface of the first chip; at least a second chip, where at least one second chip is disposed on a rear side of the first chip, each second chip has a second pad, and wherein the first pad of the first chip is connected to the second pad of the second chip via a redistribution layer. According to the chip packaging module in the present disclosure, a second chip is disposed on a rear side of a first chip, and a first pad is connected to a second pad via a redistribution layer. By means of a redistribution technology on surfaces of multiple chips, a lead of a pad on a front surface of a fingerprint recognition chip is masterly winded to the back for interconnection, so that an induction area on the front surface of the chip can fully contact with a human body.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: November 28, 2017
    Assignee: Shenzhen Goodix Technology Co., Ltd.
    Inventors: Baoquan Wu, Wei Long
  • Publication number: 20170338191
    Abstract: A through silicon via chip and manufacturing method thereof are provided, where the through silicon via chip includes a silicon substrate, the silicon substrate is provided with a via, the via is an oblique via, and a backfill structure layer is disposed in the via. According to the through silicon via chip and manufacturing method thereof, a fingerprint identification sensor and a terminal device, a backfill structure is added in an oblique via to play a supportive role when a force is exerted on a surface of the through silicon via chip, which avoids a fracture of the through silicon via chip, thereby enhancing structural strength of the through silicon via chip.
    Type: Application
    Filed: July 21, 2017
    Publication date: November 23, 2017
    Inventor: Baoquan WU
  • Publication number: 20170092622
    Abstract: The present disclosure discloses a chip packaging module, including: a first chip, where a first pad is disposed on a side neighboring to a front surface of the first chip; at least a second chip, where at least one second chip is disposed on a rear side of the first chip, each second chip has a second pad, and wherein the first pad of the first chip is connected to the second pad of the second chip via a redistribution layer. According to the chip packaging module in the present disclosure, a second chip is disposed on a rear side of a first chip, and a first pad is connected to a second pad via a redistribution layer. By means of a redistribution technology on surfaces of multiple chips, a lead of a pad on a front surface of a fingerprint recognition chip is masterly winded to the back for interconnection, so that an induction area on the front surface of the chip can fully contact with a human body.
    Type: Application
    Filed: December 7, 2016
    Publication date: March 30, 2017
    Inventors: Baoquan WU, Wei LONG