Patents by Inventor Baowei REN

Baowei REN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method for back drilling hole in PCB and PCB
    Patent number: 9756734
    Abstract: A method for manufacturing a back drilling hole in a printed circuit board (PCB) and PCB are provided. The method for manufacturing the back drilling hole comprises: forming a through hole in the PCB (1); forming a metal layer (12) with prescribed thickness on an inner wall of the through hole; filling resin in the through hole which has been formed with the metal layer (12); performing back drilling machining on the through hole which has been filled with the resin; removing metal scraps remained in the through hole. The manufacturing method protects the hole wall copper by filling the hole with the resin, so that acid corrosion process only removes the remained metal scraps after back drilling of the small hole, does not affect on the hole copper of the resin protecting portion.
    Type: Grant
    Filed: November 28, 2013
    Date of Patent: September 5, 2017
    Assignees: PEKING UNIVERSITY FOUNDER GROUP CO., LTD., ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC CO., LTD., FOUNDER INFORMATION INDUSTRY HOLDINGS CO., LTD.
    Inventors: Xianren Chen, Baowei Ren
  • MANUFACTURING METHOD FOR BACK DRILLING HOLE IN PCB AND PCB
    Publication number: 20160150653
    Abstract: A method for manufacturing a back drilling hole in a printed circuit board (PCB) and PCB are provided. The method for manufacturing the back drilling hole comprises: forming a through hole in the PCB (1); forming a metal layer (12) with prescribed thickness on an inner wall of the through hole; filling resin in the through hole which has been formed with the metal layer (12); performing back drilling machining on the through hole which has been filled with the resin; removing metal scraps remained in the through hole. The manufacturing method protects the hole wall copper by filling the hole with the resin, so that acid corrosion process only removes the remained metal scraps after back drilling of the small hole, does not affect on the hole copper of the resin protecting portion, and the manufacturing process is simple.
    Type: Application
    Filed: November 28, 2013
    Publication date: May 26, 2016
    Inventors: Xiaren CHEN, Baowei REN