Patents by Inventor Baoyan Duan

Baoyan Duan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9976694
    Abstract: A mounting base for supporting and rotating an instrument about two perpendicular axes is disclosed. The mounting base includes a vertical column; a rotatable platform attached to the column by a revolute joint; a rail around the column; at least one rod, an end of the at least one rod connecting with the revolute joint; at least one sliding mechanism, connecting with the other end of the at least one rod, the sliding mechanism sliding on the rail. The mounting base is light and easily controlled with arbitrary azimuth.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: May 22, 2018
    Assignee: XIDIAN UNIVERSITY
    Inventors: Xuechao Duan, Hong Bao, Baoyan Duan, Shufei Feng, Bi Cheng
  • Publication number: 20180023751
    Abstract: A mounting base for supporting and rotating an instrument about two perpendicular axes is disclosed. The mounting base includes a vertical column; a rotatable platform attached to the column by a revolute joint; a rail around the column at least one rod, an end of the at least one rod connections with the revolute joint; at least one sliding mechanism, connecting with the other end of the at least one rod, the sliding mechanism sliding on the rail. The mounting base is light and easily controlled with arbitrary azimuth.
    Type: Application
    Filed: July 29, 2016
    Publication date: January 25, 2018
    Applicant: Xidian University
    Inventors: Xuechao Duan, Hong Bao, Baoyan Duan, Shufei Feng, Bi Cheng
  • Patent number: 8744824
    Abstract: An optimizing design method for a chassis structure of electronic equipment is disclosed, including: investigating from the point of view of mechanical, electric and thermal three-field coupling, determining the preliminary design size of the chassis, performing a mechanical analysis by using a mechanical analysis software such as ANSYS; converting the mesh model among the three-fields, obtaining the mesh model used for the electromagnetic and thermal analyses; setting the thermal analysis parameters, performing the thermal analysis by using an electromagnetic analysis software such as ICEPAK; determining a resonance frequency of the chassis and an electric parameter of the absorbing material, performing an electromagnetic analysis by using a thermal analysis software such as FEKO; correcting the analysis result by sample testing; determining whether the chassis satisfies the design requirement, if it satisfies the requirement, the optimizing design will be finished, otherwise, modifying the preliminary compu
    Type: Grant
    Filed: September 24, 2009
    Date of Patent: June 3, 2014
    Assignee: Xidian University
    Inventors: Baoyan Duan, Hui Qiao, Peng Li, Shibo Jiang, Boyuan Ma, Ning Han, Lizhi Zeng, Yu He
  • Publication number: 20120016639
    Abstract: An optimizing design method for a chassis structure of electronic equipment is disclosed, including: investigating from the point of view of mechanical, electric and thermal three-field coupling, determining the preliminary design size of the chassis, performing a mechanical analysis by using the software Ansys; converting the mesh model among the three-fields, obtaining the mesh model used for the electromagnetic and thermal analyses; setting the thermal analysis parameters, performing the thermal analysis by using the software IcePak; determining a resonance frequency of the chassis and an electric parameter of the absorbing material, performing an electromagnetic analysis by using the software FeKo; correcting the analysis result by sample testing; determining whether the chassis satisfies the design requirement, if it satisfies the requirement, the optimizing design will be finished, otherwise, modifying the preliminary CAD model, the electromagnetic analysis parameter and the thermal analysis parameter,
    Type: Application
    Filed: September 24, 2009
    Publication date: January 19, 2012
    Applicant: Xidian University
    Inventors: Baoyan Duan, Hui Qiao, Peng Li, Shibo Jiang, Boyuan Ma, Ning Han, Lizhi Zeng, Yu He