Patents by Inventor Baptiste GOUBAULT DE BRUGIERE

Baptiste GOUBAULT DE BRUGIERE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9368472
    Abstract: The invention relates to a flip-chip assembly process for connecting two microelectronic components (1, 2) to each other. According to the invention, it is possible either to proportion the spacers (24) so that they are smaller than the interconnect bumps (22) or to oversize the latter so that their deformation, after having been plastic during the insertion of connective inserts (12), returns to the elastic regime once assembly contact between components (1,2) has been reached. Thanks to the invention, it is possible to control with great precision the gap between the two components during their assembly, and this without adding any additional steps to their manufacturing or to the assembly process.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: June 14, 2016
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Baptiste Goubault de Brugiere, Alexis Bedoin
  • Patent number: 9166338
    Abstract: A connecting system having a female element including a hollow flared part for receiving and guiding a male element and a hollow mating part for mating with the male element. A part to be mated of the male element has an outside diameter that before the mating is larger than an inside diameter of the mating part of the female element, and the part to be mated of the male element is made of a material that can be strained and has a corrugated transverse cross section, so as to contract when it is plugged into the mating part of the female element, and/or the mating part of the female connection element is made of a material that can be strained and has a corrugated transverse cross section, so as to dilate when the part to be mated of the male element is plugged into it.
    Type: Grant
    Filed: April 8, 2013
    Date of Patent: October 20, 2015
    Assignee: Commissariat A L 'Energie Atomique Et Aux Energies Alternatives
    Inventors: Francois Marion, Baptiste Goubault de Brugiere, Stéphane Lagarrigue, Marion Volpert, Michel Heitzmann
  • Publication number: 20140038355
    Abstract: The invention relates to a flip-chip assembly process for connecting two microelectronic components (1, 2) to each other. According to the invention, it is possible either to proportion the spacers (24) so that they are smaller than the interconnect bumps (22) or to oversize the latter so that their deformation, after having been plastic during the insertion of connective inserts (12), returns to the elastic regime once assembly contact between components (1,2) has been reached. Thanks to the invention, it is possible to control with great precision the gap between the two components during their assembly, and this without adding any additional steps to their manufacturing or to the assembly process.
    Type: Application
    Filed: July 31, 2013
    Publication date: February 6, 2014
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Baptiste Goubault de Brugiere, Alexis Bedoin
  • Publication number: 20130267113
    Abstract: A connecting system having a female element including a hollow flared part for receiving and guiding a male element and a hollow mating part for mating with the male element. A part to be mated of the male element has an outside diameter that before the mating is larger than an inside diameter of the mating part of the female element, and the part to be mated of the male element is made of a material that can be strained and has a corrugated transverse cross section, so as to contract when it is plugged into the mating part of the female element, and/or the mating part of the female connection element is made of a material that can be strained and has a corrugated transverse cross section, so as to dilate when the part to be mated of the male element is plugged into it.
    Type: Application
    Filed: April 8, 2013
    Publication date: October 10, 2013
    Applicant: Commissariat A L'Energie Atomique Et Aux Energies Alternatives
    Inventors: Francois MARION, Baptiste GOUBAULT DE BRUGIERE, Stéphane LAGARRIGUE, Marion VOLPERT, Michel HEITZMANN