Abstract: A method and a system for applying hot melt adhesive powder onto a non-metallic surface are disclosed. The hot melt adhesive powder is sprayed out from a spray head while being charged with electrostatic charges, and then the charged hot melt adhesive powder will be attached to the whole surface of a non-metallic component by electrostatic force, or only attached to a desired area of the non-metallic component by pre-coating the desired area with conductive liquid. By spraying the hot melt adhesive in the form of powder, there is no need to heat the adhesive in advance. When the surface of the non-metallic component is 3-dimensional, the charged adhesive powder can be introduced onto the surface of the to-be-bonded component and attached to the desired surface without the omni-directional spraying operation. Excessive powder will be easily blown or brushed away and will be recycled.