Abstract: A pluggable network interface device includes a printed circuit board (“PCB”) and a housing configured to receive a heat transfer plate selected from a set of swappable heat transfer plates. An upper surface of the housing includes a set of modular plate receiving features. When in an assembled state, the upper surface of the housing is attached via the set of modular plate receiving features to one heat transfer plate of a set of heat transfer plates. The overall height of the pluggable network interface module in the assembled state is greater than a first assembly height dimension measured from a base surface of the housing to the upper surface of the housing. The set of modular plate receiving features are configured to engage with any heat transfer plate in the set of swappable heat transfer plates that are associated with different module types.

Abstract: Assemblies, systems, and methods are provided for dissipating heat from a receptacle assembly for holding a transceiver and attaching to a PCB. The receptacle assembly has a body defining a first end, a second end, a top surface extending between the first end and the second end, and a bottom surface extending between the first end and the second end opposite the top surface. A thermal dissipation device is disposed on the bottom surface, and the thermal dissipation device is configured to dissipate heat from the receptacle assembly to an external environment via the bottom surface. The thermal dissipation device may include at least one conductive element and at least one dissipation element and may interact with other cooling features of the PCB.

Abstract: A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.

Abstract: A network interface device may include: a frame having: a first frame end, a second frame end, a top frame surface, a bottom frame surface, a first lateral frame surface and a second lateral frame surface, wherein the top frame surface includes a longitudinal frame indent extending along a portion of the top frame surface and between the first lateral frame surface and the second lateral frame surface; and heat dissipating members protruding from the longitudinal frame indent of the top frame surface.

Abstract: A pluggable network interface device includes a printed circuit board (“PCB”), a housing, and a heatsink. The heatsink includes a first surface and a second surface, disposed opposite the first surface, that is maintained in direct contact with a surface of a heat-generating circuit of the PCB. The housing includes an outer shell defining an exterior of the housing, a receiving cavity disposed inside the outer shell, and an aperture extending through a first side of the outer shell from the exterior of the housing into the receiving cavity. A portion of the PCB and the second surface of the heatsink are disposed inside the receiving cavity while a portion of the heatsink extends from within the receiving cavity through the aperture arranging the first surface of the heatsink adjacent the exterior of the housing.

Abstract: A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.

Abstract: A pluggable network interface device includes a printed circuit board (“PCB”) and a housing configured to receive a heat transfer plate selected from a set of swappable heat transfer plates. An upper surface of the housing includes a set of modular plate receiving features. When in an assembled state, the upper surface of the housing is attached via the set of modular plate receiving features to one heat transfer plate of a set of heat transfer plates. The overall height of the pluggable network interface module in the assembled state is greater than a first assembly height dimension measured from a base surface of the housing to the upper surface of the housing. The set of modular plate receiving features are configured to engage with any heat transfer plate in the set of swappable heat transfer plates that are associated with different module types.

Abstract: A pluggable network interface device includes a printed circuit board (“PCB”), a housing, and a heatsink. The heatsink includes a first surface and a second surface, disposed opposite the first surface, that is maintained in direct contact with a surface of a heat-generating circuit of the PCB. The housing includes an outer shell defining an exterior of the housing, a receiving cavity disposed inside the outer shell, and an aperture extending through a first side of the outer shell from the exterior of the housing into the receiving cavity. A portion of the PCB and the second surface of the heatsink are disposed inside the receiving cavity while a portion of the heatsink extends from within the receiving cavity through the aperture arranging the first surface of the heatsink adjacent the exterior of the housing.

Abstract: A network interface device may include: a frame having: a first frame end, a second frame end, a top frame surface, a bottom frame surface, a first lateral frame surface and a second lateral frame surface, wherein the top frame surface includes a longitudinal frame indent extending along a portion of the top frame surface and between the first lateral frame surface and the second lateral frame surface; and heat dissipating members protruding from the longitudinal frame indent of the top frame surface.