Patents by Inventor Barbara Charlet

Barbara Charlet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8153503
    Abstract: The invention relates to a method for protecting the interior of at least one cavity (4) having a portion of interest (5) and opening onto a face of a microstructured element (1), consisting of depositing, on said face, a nonconformal layer (6) of a protective material, in which said nonconformal layer closes off the cavity without covering the portion of interest. The invention also relates to a method for producing a device comprising such a microstructured element.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: April 10, 2012
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Barbara Charlet, Hélène Le Poche, Yveline Gobil
  • Publication number: 20090263920
    Abstract: The invention relates to a method for protecting the interior of at least one cavity (4) having a portion of interest (5) and opening onto a face of a microstructured element (1), consisting of depositing, on said face, a nonconformal layer (6) of a protective material, in which said nonconformal layer closes off the cavity without covering the portion of interest. The invention also relates to a method for producing a device comprising such a microstructured element.
    Type: Application
    Filed: April 3, 2007
    Publication date: October 22, 2009
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE
    Inventors: Barbara Charlet, Helene Le Poche, Yveline Gobil
  • Patent number: 5105761
    Abstract: The apparatus comprises a tight treatment enclosure (10), means (20,22) for the axial production of a carrier gas plasma, a solid plate (30) serving as an obstacle to the plasma and located perpendicular to the enclosure axis and downstream of the plasma production means, plasma diffusion means (40) located downstream of the obstacle plate, several non-ionized vector gas supply tubes (50) issuing axially into the enclosure beneath the diffusion means and all located in the same plane around the enclosure axis, a substrate carrier (56) positioned downstream of the vector gas supply tubes and perpendicular to the axis and annular pumping means (66,16) for the gaseous medium contained in the enclosure and positioned downstream of the substrate carrier.
    Type: Grant
    Filed: October 15, 1990
    Date of Patent: April 21, 1992
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Barbara Charlet, Louise Peccoud, Thierry Sindzingre
  • Patent number: 5047115
    Abstract: The invention relates to a process for etching a substrate with the aid of a gas plasma produced either by ultra-high frequency waves, or by ultra-high frequency and radio-frequency waves.In this process, the gaseous medium used for the formation of the plasma comprises at least one non-carbon-containing fluorinating gas such as SF.sub.6, at least one rare gas such as Ar and at least one non-carbon-containing oxidizing gas such as oxygen, as well as optionally another gas such as nitrogen.The invention is more particularly usable in the microelectronics field.
    Type: Grant
    Filed: November 15, 1989
    Date of Patent: September 10, 1991
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Barbara Charlet, Louise Peccoud