Abstract: Systems and methods for removing an oxide layer in an additive manufacturing process are provided. A direct write machine may be used to create wire bonds for semiconductors. The direct write machine may deposit a conductive print material between bond pads to create interconnections. The bond pads may comprise aluminum and an aluminum oxide layer on an outer surface. The presence of an aluminum oxide layer may decrease the electrical connection between the wire bond and the aluminum substrate. To remove the aluminum oxide layer, an abrasive tool is provided to ultrasonically abrade the aluminum oxide layer while the conductive print material is being deposited. The conductive print material may include abrasive additives materials to further aid in abrading the aluminum oxide layer.

Abstract: Systems and methods for removing an oxide layer in an additive manufacturing process are provided. A direct write machine may be used to create wire bonds for semiconductors. The direct write machine may deposit a conductive print material between bond pads to create interconnections. The bond pads may comprise aluminum and an aluminum oxide layer on an outer surface. The presence of an aluminum oxide layer may decrease the electrical connection between the wire bond and the aluminum substrate. To remove the aluminum oxide layer, an abrasive tool is provided to ultrasonically abrade the aluminum oxide layer while the conductive print material is being deposited. The conductive print material may include abrasive additives materials to further aid in abrading the aluminum oxide layer.