Abstract: High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline compound semiconductor layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.

Abstract: An apparatus for measuring at least one selected physical condition of an animate subject is disclosed. The apparatus comprises: (a) a light source; (b) a light receiver that receives resultant light from the light source via the subject; and (c) an information processor connected with the light receiver. The processor receives indication of the resultant light from the light receiver and evaluates the indication to effect the measuring. The processor is implemented in a unitary structure with the light source and light detector that is borne upon a single silicon substrate. The apparatus may further comprise a first interface element coupled with the processor to facilitate communication with the light receiver, and a second interface element coupled with the processor that includes communication means for conveying messages to remote loci. The first and second interface elements are implemented in the unitary structure.

Abstract: An apparatus for generating an oscillating reference signal at a reference frequency includes: (a) a light conveying element having a first end and a second end; the light conveying element conveying substantially all light received or reflected at one end to the other end; the light conveying element having a light transmission path intermediate the first end and the second end; the transmission path being related to the reference frequency; (b) a light transmitting element oriented to introduce light into the light conveying element at one end of the light conveying element; and (c) a light receiving element oriented to receive the transmitted light at one end of the light conveying element. The light conveying element, the light transmitting element and the light receiving element are implemented in a monolithic structure arranged on a single substrate.

Abstract: High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. One way to achieve the formation of a compliant substrate includes first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.

Abstract: High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. One way to achieve the formation of a compliant substrate includes first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.

Abstract: A bio-molecule analyzer includes an array of addressable light sources, a photoconductive layer of material having a layer of electrically conductive material on a surface thereof mounted on the array of addressable light sources, and a plurality of test sites on an opposing surface of the photoconductive layer of material defined by the plurality of light sources. A solution containing a plurality of bio-molecules is positioned in electrical contact with the plurality of test sites. An electrical potential is connected between the solution and the layer of electrically conductive material, whereby the array of addressable light sources emit beams of light through a plurality of portions of the photoconductive layer of material to define the test sites and complete electrical circuits between the layer of electrically conductive material and the solution.

Abstract: A projection system for a computer has an electronic slide (94) that is coupled to an electronic image signal (84) from a processor (82) in the computer (50). Projection optics (102) focus an optical image from the electronic slide (94) onto a screen (58).

Abstract: A bio-molecule analyzer including a plurality of test sites on a transparent substrate, each test site having probe molecules attached thereto. An array of addressable light sources are positioned in optical alignment with a corresponding test site. A solution containing sample molecules is positioned in contact with the plurality of test sites. A detector array having a plurality of photodetectors positioned in optical alignment with the array of addressable light sources, one photodetector corresponding to each light source, and a light filter positioned between the detector array and the plurality of test sites for absorbing the light from the light sources and transmitting the light from the test sites to the detector array.

Abstract: An optoelectronic module is disclosed in which an optoelectronic device is precisely aligned with an optical fiber. The optoelectronic module comprises a first member, a second member for supporting an end of the optical fiber in a fixed position relative the first member along an axis, and a third member for mounting at least one optoelectronic device. A plurality of positioning members are adjustably positioned on the first member for supporting the third member to maintain aligned relation of the optoelectronic device with the axis.

Abstract: An optoelectronic package including an interconnect substrate having electronic components and carrying an optical fiber holder. The holder containing an end of an optical fiber and including an end surface in which is formed alignment openings. A flexible substrate having conductive traces, a first end, a second end, and alignment openings formed proximate the first end, interconnects the holder and the electronic components of the interconnect substrate. A photonic unit is mechanically and electrically coupled to the flexible substrate proximate the first end in precise relation to the alignment openings so as to be aligned with the optical fiber by inserting alignment pins extending concurrently through the alignment openings of the flexible substrate and the alignment openings of the optical fiber holder.

Abstract: A method for making an optical interconnect unit is disclosed. A mold (100) with surface (107) having a groove (112) is formed. An optical fiber (117) is placed into the groove (112) of the surface (107). A molding material is applied onto the surface (107) of the mold (100) and onto the optical fiber (117), thereby affixing the optical fiber (117) to the molding material.

Abstract: A method for coupling light from one or more light-emitting devices into corresponding optical fibers includes placing the light-emitting devices on the top surface of a substrate and forming, by photolithographical means, on the top surface of said substrate V-grooves for holding fibers in precise relationship with said light-emitting devices. Additionally, alignment pedestals or posts are formed on said substrate in predetermined relationship to the light emitting devices and alignment V-grooves are photolithographically formed on the top surface of said substrate parallel to said fiber V-grooves. The substrate is cleaved into two sections and said sections are assembled in orthogonal relationship with the section containing the light-emitting devices and alignment posts section being secured to the section containing the fiber and alignment V-grooves so that said posts fit into said alignment V-grooves, thereby aligning the fiber V-grooves with the light-emitting devices.

Abstract: A sequential configuration of log.sub.2 n stages of birefringent elements are set forth. Each stage has a transfer function approximating a square wave, and successive stages have half periods. An input beam with n wavelength components would be demultiplexed into 2, 4 and finally n output beams at the output of the first, second, and log.sub.2 n stages, each output beam containing only one wavelength. Successive stages consist of two polarizing beam splitters between which is located their appropriate length of birefringent element to achieve the desired transfer function.