Abstract: Inter-alia, a method for manufacturing a three-dimensional light emitting appliance is disclosed, said method comprising: providing a first data model of a three-dimensional area; arranging a plurality of spots for light emitting devices on the three-dimensional area of the first data model, wherein the plurality of spots is substantially evenly distributed over at least a part of the three-dimensional area; transforming the first data model of the three-dimensional area comprising the spots into a substantially two-dimensional and flat second data model, wherein the position of the spots on the second data model is derived; manufacturing a printed circuit board in accordance with the second data model and arranging pads of the printed circuit board on the spots of the second data model; equipping the pads of the printed circuit board with light emitting devices; and bringing the printed circuit board into the shape of the three-dimensional area.

Abstract: A lighting device according to the invention comprises at least one semiconductor layer; at least one light emission surface comprising an array of high luminance areas configured to emit light at a first local luminance level and low luminance areas configured to emit no light or to emit light at a second local luminance level lower than the first local luminance level; a plurality of semiconductor light emitting devices formed in the semiconductor layer to define the plurality of high luminance areas; wherein the high luminance areas and the low luminance areas are arranged in accordance with a predefined light emission profile of the light emission surface.

Abstract: The invention describes a circuit assembly comprising a circuit board with a metal core, a pattern of conductive tracks, and a dielectric layer between the metal core and the conductive tracks; at least one circuit component mounted to the circuit board by means of solder interconnects, wherein a solder interconnect is formed between a contact pad of the circuit component and a conductive track; characterized in that the metal core comprises at least one cavity, wherein a cavity is arranged in the vicinity of a solder interconnect. The invention further describes a circuit board for such a circuit assembly, and a method of manufacturing such a circuit assembly.

Abstract: The invention describes a flexible lighting strip comprising a multitude of light-emitting diodes arranged in at least two groups. Each group comprises at least two light-emitting diodes arranged in an electrical series connection. The at least two groups are arranged in parallel to an anode track and a cathode track. The at least two groups are arranged in a longitudinal arrangement such that a last light-emitting diode of a first group is arranged next to a first light-emitting diode of a second group. The anode track and the cathode track each consist of a wire line having substantially circular wires that are bent to receive compressive and/or tensile stress. The electrical circuit provides a third wire line having a substantially circular wire as a center line arranged between the outer lines. At least one light-emitting diode of every group is mounted on an interposer which contracts all three wire lines.

Abstract: A lighting device according to the invention comprises at least one semiconductor layer; at least one light emission surface comprising an array of high luminance areas configured to emit light at a first local luminance level and low luminance areas configured to emit no light or to emit light at a second local luminance level lower than the first local luminance level; a plurality of semiconductor light emitting devices formed in the semiconductor layer to define the plurality of high luminance areas; wherein the high luminance areas and the low luminance areas are arranged in accordance with a predefined light emission profile of the light emission surface.

Abstract: The invention refers to a lighting device. The object to provide a lighting device in particular with flexible properties, wherein the mechanical robustness with respect to thermomechanical stresses is improved, is solved in that the lighting device comprises: at least one light-emitting element, wherein the at least one light-emitting element is arranged on connection elements for an electronic connection to the at least one light-emitting element, at least one encapsulating material surrounding at least part of the connection elements, wherein at least one connection element comprises at least one spring section. The invention further refers to a method for producing a lighting device and a use of a lighting device.

Abstract: A lighting device according to the invention comprises at least one semiconductor layer; at least one light emission surface comprising an array of high luminance areas configured to emit light at a first local luminance level and low luminance areas configured to emit no light or to emit light at a second local luminance level lower than the first local luminance level; a plurality of semiconductor light emitting devices formed in the semiconductor layer to define the plurality of high luminance areas; wherein the high luminance areas and the low luminance areas are arranged in accordance with a predefined light emission profile of the light emission surface.

Abstract: Inter-alia, a method for manufacturing a three-dimensional light emitting appliance is disclosed, said method comprising: providing a first data model of a three-dimensional area; arranging a plurality of spots for light emitting devices on the three-dimensional area of the first data model, wherein the plurality of spots is substantially evenly distributed over at least a part of the three-dimensional area; transforming the first data model of the three-dimensional area comprising the spots into a substantially two-dimensional and flat second data model, wherein the position of the spots on the second data model is derived; manufacturing a printed circuit board in accordance with the second data model and arranging pads of the printed circuit board on the spots of the second data model; equipping the pads of the printed circuit board with light emitting devices; and bringing the printed circuit board into the shape of the three-dimensional area.

Abstract: The invention describes a circuit assembly comprising a circuit board with a metal core, a pattern of conductive tracks, and a dielectric layer between the metal core and the conductive tracks; at least one circuit component mounted to the circuit board by means of solder interconnects, wherein a solder interconnect is formed between a contact pad of the circuit component and a conductive track; characterized in that the metal core comprises at least one cavity, wherein a cavity is arranged in the vicinity of a solder interconnect. The invention further describes a circuit board for such a circuit assembly, and a method of manufacturing such a circuit assembly.

Abstract: The invention describes a flexible lighting strip comprising a multitude of light-emitting diodes arranged in at least two groups. Each group comprises at least two light-emitting diodes arranged in an electrical series connection. The at least two groups are arranged in parallel to an anode track and a cathode track. The at least two groups are arranged in a longitudinal arrangement such that a last light-emitting diode of a first group is arranged next to a first light-emitting diode of a second group. The anode track and the cathode track each consist of a wire line having substantially circular wires that are bent to receive compressive and/or tensile stress. The electrical circuit provides a third wire line having a substantially circular wire as a center line arranged between the outer lines. At least one light-emitting diode of every group is mounted on an interposer which contracts all three wire lines.

Abstract: The invention refers to a lighting device. The object to provide a lighting device in particular with flexible properties, wherein the mechanical robustness with respect to thermomechanical stresses is improved, is solved in that the lighting device comprises: at least one light-emitting element, wherein the at least one light-emitting element is arranged on connection elements for an electronic connection to the at least one light-emitting element, at least one encapsulating material surrounding at least part of the connection elements, wherein at least one connection element comprises at least one spring section. The invention further refers to a method for producing a lighting device and a use of a lighting device.