Patents by Inventor Barbara Schmidt

Barbara Schmidt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6974885
    Abstract: The method of isolating an anhydrous etidronate disodium particulate includes preparing a liquid-liquid dispersion consisting of an aqueous-organic phase and an etidronate-disodium-salt-containing aqueous phase; adjusting a temperature of the liquid-liquid dispersion to between 0 and 30° C. and intensely agitating so that a coarse-particle fraction precipitates from the liquid-liquid dispersion, then drawing off a fine-particle suspension and allowing a fine-particle fraction to precipitate from it and filtering and drying the coarse particle fraction. In a preferred embodiment the fine-particle fraction is separated from the fine-particle suspension for recycling The resulting anhydrous etidronate disodium particulate has a grain size of from about 0.1 to 1 mm and a bulk density of 0.4 to 0.6 g/cm2 with good properties for pharmaceutical applications.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: December 13, 2005
    Assignee: Schering AG
    Inventors: Detlef Grawe, Barbara Schmidt, Harald Raethe
  • Publication number: 20050196952
    Abstract: A method for producing a semiconductor structure including preparing a semiconductor substrate, and generating a lower first, a middle second and an upper third masking layer on a surface of the semiconductor substrate. The method further includes forming at least one first window in the upper third masking layer, structuring the middle second masking layer using the first window for transferring the first window, structuring the lower first masking layer using the first window for transferring the first window, and enlarging the first window to form a second window. The method for further includes restructuring the middle second masking layer using the second window for transferring the second window, structuring the semiconductor substrate, using the structured lower third masking layer, restructuring the lower first masking layer using the second window, and restructuring the semiconductor substrate using the restructured lower third masking layer.
    Type: Application
    Filed: February 25, 2005
    Publication date: September 8, 2005
    Applicant: Infineon Technologies AG
    Inventors: Oliver Genz, Markus Kirchhoff, Stefan Machill, Alexander Reb, Barbara Schmidt, Momtchil Stavrev, Maik Stegeman, Stephan Wege
  • Patent number: 6939805
    Abstract: To fabricate a trench capacitor in a substrate, a trench is formed in the substrate. The trench has an upper region and a lower region. In the trench, first of all nanocrystallites and/or a seed layer for nanocrystallites are deposited in the upper region and the lower region. Then, the nanocrystallites and/or the seed layer are removed from the upper region of the trench by means of an etching process. The etching parameters of the etching process are selected in such a way that the seed layer and/or the nanocrystallites which are uncovered in the upper region and the lower region are removed only from the upper region. Consequently, an expensive mask layer can be avoided in the lower region of the trench.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: September 6, 2005
    Assignee: Infineon Technologies AG
    Inventors: Jörn Lützen, Barbara Schmidt, Stefan Rongen, Martin Schrems, Daniel Köhler
  • Publication number: 20040200574
    Abstract: A method for controlling a process for fabricating integrated devices on a substrate. The method includes ex-situ and in-situ measurements of pre-etch and post-etch dimensions for structures formed on the substrate and uses the results of the measurements to adjust process recipes and to control the operational status of etch and external substrate processing equipment. In one exemplary application, the method is used during a multi-pass process for fabricating a capacitive structure of a trench capacitor.
    Type: Application
    Filed: March 19, 2004
    Publication date: October 14, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Matthew F. Davis, Lei Lian, Barbara Schmidt
  • Publication number: 20040024245
    Abstract: The invention relates to the isolation of etidronate disodium whereby
    Type: Application
    Filed: June 26, 2003
    Publication date: February 5, 2004
    Inventors: Detlef Grawe, Barbara Schmidt, Harald Raethe
  • Publication number: 20030064591
    Abstract: To fabricate a trench capacitor in a substrate, a trench is formed in the substrate. The trench has an upper region and a lower region. In the trench, first of all nanocrystallites and/or a seed layer for nanocrystallites are deposited in the upper region and the lower region. Then, the nanocrystallites and/or the seed layer are removed from the upper region of the trench by means of an etching process. The etching parameters of the etching process are selected in such a way that the seed layer and/or the nanocrystallites which are uncovered in the upper region and the lower region are removed only from the upper region. Consequently, an expensive mask layer can be avoided in the lower region of the trench.
    Type: Application
    Filed: September 24, 2002
    Publication date: April 3, 2003
    Inventors: Jorn Lutzen, Barbara Schmidt, Stefan Rongen, Martin Schrems, Daniel Kohler