Patents by Inventor Barbara Simoni
Barbara Simoni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11274036Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.Type: GrantFiled: March 11, 2020Date of Patent: March 15, 2022Assignee: STMicroelectronics S.r.l.Inventors: Giorgio Allegato, Barbara Simoni, Carlo Valzasina, Lorenzo Corso
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Publication number: 20200385260Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.Type: ApplicationFiled: March 11, 2020Publication date: December 10, 2020Inventors: Giorgio ALLEGATO, Barbara SIMONI, Carlo VALZASINA, Lorenzo CORSO
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Patent number: 10611629Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.Type: GrantFiled: June 29, 2017Date of Patent: April 7, 2020Assignee: STMICROELECTRONICS S.R.L.Inventors: Giorgio Allegato, Barbara Simoni, Carlo Valzasina, Lorenzo Corso
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Patent number: 10598690Abstract: A microelectromechanical device includes: a supporting structure; two sensing masses, movable with respect to the supporting structure according to a first axis and a respective second axis; a driving device for maintaining the sensing masses in oscillation along the first axis in phase opposition; sensing units for supplying sensing signals indicative of displacements respectively of the sensing masses according to the respective second axis; processing components for combining the sensing signals so as to: in a first sensing mode, amplify effects on the sensing signals of concordant displacements and attenuate effects of discordant displacements of the sensing masses; and in a second sensing mode, amplify effects on the sensing signals of discordant displacements and attenuate effects of concordant displacements of the sensing masses.Type: GrantFiled: December 9, 2015Date of Patent: March 24, 2020Assignee: STMicroelectronics S.r.l.Inventors: Barbara Simoni, Carlo Valzasina
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Publication number: 20180045515Abstract: A micromechanical sensor core for an inertial sensor, having a movable seismic mass, a defined number of anchor elements, by which the seismic mass is fastened on a substrate, a defined number of stop devices fastened on the substrate for stopping the seismic mass, a first springy stop element, a second springy stop element and a solid stop element being developed on the stop device. The stop elements are designed in such a way that the seismic mass is able to strike in succession against the first springy stop element, the second springy stop element and the solid stop element.Type: ApplicationFiled: August 8, 2017Publication date: February 15, 2018Inventors: Barbara Simoni, Christian Hoeppner, Denis Gugel, Guenther-Nino-Carlo Ullrich, Sebastian Guenther, Timm Hoehr, Johannes Seelhorst
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Publication number: 20170297906Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.Type: ApplicationFiled: June 29, 2017Publication date: October 19, 2017Inventors: Giorgio ALLEGATO, Barbara SIMONI, Carlo VALZASINA, Lorenzo CORSO
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Patent number: 9718675Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.Type: GrantFiled: December 16, 2015Date of Patent: August 1, 2017Assignee: STMICROELECTRONICS S.R.L.Inventors: Giorgio Allegato, Barbara Simoni, Carlo Valzasina, Lorenzo Corso
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Patent number: 9517930Abstract: Various embodiments of the invention reduce stiction in a wide range of MEMS devices and increase device reliability without negatively impacting performance. In certain embodiments, stiction recover is accomplished by applying electrostatic forces to electrodes via optimized voltage signals that generate a restoring force that aids in overcoming stiction forces between electrodes. The voltage signals used within a stiction recovery procedure may be static or a dynamic, and may be applied directly to existing electrodes within a MEMS device, thereby, eliminating the need for additional components. In some embodiments, the voltage is estimated or calibrated and swept through a range of frequencies that contains one or more resonant frequencies of the mechanical structure that comprises the parts to be detached.Type: GrantFiled: January 29, 2014Date of Patent: December 13, 2016Assignee: Hanking Electronics, Ltd.Inventors: Gabriele Cazzaniga, Luca Coronato, Barbara Simoni, Luciano Prandi
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Patent number: 9452922Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.Type: GrantFiled: June 19, 2013Date of Patent: September 27, 2016Assignee: STMICROELECTRONICS S.R.L.Inventors: Giorgio Allegato, Barbara Simoni, Carlo Valzasina, Lorenzo Corso
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Patent number: 9383382Abstract: A microelectromechanical sensor that in one embodiment includes a supporting structure, having a substrate and electrode structures anchored to the substrate; and a sensing mass, movable with respect to the supporting structure so that a distance between the sensing mass and the substrate is variable. The sensing mass is provided with movable electrodes capacitively coupled to the electrode structures. Each electrode structure comprises a first fixed electrode and a second fixed electrode mutually insulated by a dielectric region and arranged in succession in a direction substantially perpendicular to a face of the substrate.Type: GrantFiled: February 27, 2013Date of Patent: July 5, 2016Assignee: STMICROELECTRONICS S.R.L.Inventors: Barbara Simoni, Carlo Valzasina
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Patent number: 9354246Abstract: A MEMS resonant accelerometer is disclosed, having: a proof mass coupled to a first anchoring region via a first elastic element so as to be free to move along a sensing axis in response to an external acceleration; and a first resonant element mechanically coupled to the proof mass through the first elastic element so as to be subject to a first axial stress when the proof mass moves along the sensing axis and thus to a first variation of a resonant frequency. The MEMS resonant accelerometer is further provided with a second resonant element mechanically coupled to the proof mass through a second elastic element so as to be subject to a second axial stress when the proof mass moves along the sensing axis, substantially opposite to the first axial stress, and thus to a second variation of a resonant frequency, opposite to the first variation.Type: GrantFiled: July 26, 2013Date of Patent: May 31, 2016Assignee: STMicroelectronics S.r.l.Inventors: Barbara Simoni, Claudia Comi, Alberto Corigliano
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Publication number: 20160145096Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.Type: ApplicationFiled: December 16, 2015Publication date: May 26, 2016Inventors: Giorgio ALLEGATO, Barbara SIMONI, Carlo VALZASINA, Lorenzo CORSO
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Publication number: 20160091528Abstract: A microelectromechanical device includes: a supporting structure; two sensing masses, movable with respect to the supporting structure according to a first axis and a respective second axis; a driving device for maintaining the sensing masses in oscillation along the first axis in phase opposition; sensing units for supplying sensing signals indicative of displacements respectively of the sensing masses according to the respective second axis; processing components for combining the sensing signals so as to: in a first sensing mode, amplify effects on the sensing signals of concordant displacements and attenuate effects of discordant displacements of the sensing masses; and in a second sensing mode, amplify effects on the sensing signals of discordant displacements and attenuate effects of concordant displacements of the sensing masses.Type: ApplicationFiled: December 9, 2015Publication date: March 31, 2016Inventors: Barbara SIMONI, Carlo VALZASINA
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Patent number: 9234913Abstract: A microelectromechanical device includes: a supporting structure; two sensing masses, movable with respect to the supporting structure according to a first axis and a respective second axis; a driving device for maintaining the sensing masses in oscillation along the first axis in phase opposition; sensing units for supplying sensing signals indicative of displacements respectively of the sensing masses according to the respective second axis; processing components for combining the sensing signals so as to: in a first sensing mode, amplify effects on the sensing signals of concordant displacements and attenuate effects of discordant displacements of the sensing masses; and in a second sensing mode, amplify effects on the sensing signals of discordant displacements and attenuate effects of concordant displacements of the sensing masses.Type: GrantFiled: September 12, 2012Date of Patent: January 12, 2016Assignee: STMICROELECTRONICS S.R.L.Inventors: Barbara Simoni, Carlo Valzasina
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Publication number: 20150362522Abstract: A MEMS resonant accelerometer is disclosed, having: a proof mass coupled to a first anchoring region via a first elastic element so as to be free to move along a sensing axis in response to an external acceleration; and a first resonant element mechanically coupled to the proof mass through the first elastic element so as to be subject to a first axial stress when the proof mass moves along the sensing axis and thus to a first variation of a resonant frequency. The MEMS resonant accelerometer is further provided with a second resonant element mechanically coupled to the proof mass through a second elastic element so as to be subject to a second axial stress when the proof mass moves along the sensing axis, substantially opposite to the first axial stress, and thus to a second variation of a resonant frequency, opposite to the first variation.Type: ApplicationFiled: July 26, 2013Publication date: December 17, 2015Applicants: Politecnico Di Milano, STMicroelectronics S.r.l.Inventors: Barbara Simoni, Claudia Comi, Alberto Corigliano
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Patent number: 9207254Abstract: The invention relates to a microelectro-mechanical structure (MEMS), and more particularly, to systems, devices and methods of compensating effect of thermo-mechanical stress on a micro-machined accelerometer by incorporating and adjusting elastic elements to couple corresponding sensing electrodes. The sensing electrodes comprise moveable electrodes and stationary electrodes that are respectively coupled on a proof mass and a substrate. At least one elastic element is incorporated into a coupling structure that couples two stationary electrodes or couples a stationary electrode to at least one anchor. More than one elastic element may be incorporated. The number, locations, configurations and geometries of the elastic elements are adjusted to compensate an output offset and a sensitivity drift that are induced by the thermo-mechanical stress accumulated in the MEMS device.Type: GrantFiled: February 19, 2013Date of Patent: December 8, 2015Assignee: Maxim Integrated Products, Inc.Inventors: Barbara Simoni, Luca Coronato, Gabriele Cazzaniga
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Patent number: 9176157Abstract: The invention relates to a microelectromechanical structure, and more particularly, to systems, devices and methods of compensating the effect of the thermo-mechanical stress by incorporating and adjusting elastic elements that are used to couple a moveable proof mass to anchors. The proof mass responds to acceleration by displacing and tilting with respect to a moveable mass rotational axis. The thermo-mechanical stress is accumulated in the structure during the courses of manufacturing, packaging and assembly or over the structure's lifetime. The stress causes a displacement on the proof mass. A plurality of elastic elements is coupled to support the proof mass. Geometry and configuration of these elastic elements are adjusted to reduce the displacement caused by the thermo-mechanical stress.Type: GrantFiled: December 5, 2012Date of Patent: November 3, 2015Assignee: Maxim Integrated Products, Inc.Inventors: Barbara Simoni, Luca Coronato, Gabriele Cazzaniga
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Patent number: 9134337Abstract: The present invention relates to a microelectromechanical structure, and more particularly, to systems, devices and methods of incorporating z-axis out-of-plane stoppers that are controlled to protect the structure from both mechanical shock and electrostatic disturbance. The z-axis out-of plane stoppers include shock stoppers and balance stoppers. The shock stoppers are arranged on a cap substrate that is used to package the structure. These shock stoppers are further aligned to a proof mass in the structure to reduce the impact of the mechanical shock. The balance stoppers are placed underneath the proof mass, and electrically coupled to a balance voltage, such that electrostatic force and torque imposed by the shock stoppers is balanced by that force and torque generated by the balance stoppers. This structure is less susceptible to mechanical shock, and shows a negligible offset that may be induced by electrostatic disturbance caused by the shock stoppers.Type: GrantFiled: December 17, 2012Date of Patent: September 15, 2015Assignee: Maxim Integrated Products, Inc.Inventors: Barbara Simoni, Luca Coronato, Gabriele Cazzaniga
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Publication number: 20150002982Abstract: Various embodiments of the invention reduce stiction in a wide range of MEMS devices and increase device reliability without negatively impacting performance. In certain embodiments, stiction recover is accomplished by applying electrostatic forces to electrodes via optimized voltage signals that generate a restoring force that aids in overcoming stiction forces between electrodes. The voltage signals used within a stiction recovery procedure may be static or a dynamic, and may be applied directly to existing electrodes within a MEMS device, thereby, eliminating the need for additional components. In some embodiments, the voltage is estimated or calibrated and swept through a range of frequencies that contains one or more resonant frequencies of the mechanical structure that comprises the parts to be detached.Type: ApplicationFiled: October 7, 2013Publication date: January 1, 2015Inventors: Gabriele CAZZANIGA, Luca CORONATO, Barbara SIMONI, Luciano PRANDI
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Patent number: 8863575Abstract: A micromechanical structure for a MEMS structure is provided with: a substrate; a single inertial mass having a main extension in a plane and arranged suspended above the substrate; and a frame element, elastically coupled to the inertial mass by coupling elastic elements and to anchorages, which are fixed with respect to the substrate by anchorage elastic elements. The coupling elastic elements and the anchorage elastic elements are configured so as to enable a first inertial movement of the inertial mass in response to a first external acceleration acting in a direction lying in the plane and also a second inertial movement of the inertial mass in response to a second external acceleration acting in a direction transverse to the plane.Type: GrantFiled: June 15, 2011Date of Patent: October 21, 2014Assignee: STMicroelectronics S.R.L.Inventors: Attilio Frangi, Biagio De Masi, Barbara Simoni