Patents by Inventor Bardia Pezeshki

Bardia Pezeshki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMBEDDING LEDS WITH WAVEGUIDES
    Publication number: 20210356662
    Abstract: A microLED may be used to generate light for intra-chip or inter-chip communications. The microLED, or an active layer of the microLED, may be embedded in a waveguide. The waveguide may include a lens.
    Type: Application
    Filed: May 18, 2021
    Publication date: November 18, 2021
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • STACKED TRANSCEIVER ARCHITECTURE
    Publication number: 20210349272
    Abstract: An optical transceiver may include a circuit board, lasers, and a PLC including optical multiplexers and demultiplexers. The PLC may be coupled to fiber optic lines at a forward edge of the PLC, with a rear edge of the PLC receiving light for transmission generated by the lasers. Light received at the forward edge of the PLC may be demultiplexed into data channels and routed to a top surface of the PLC for optoelectronic conversion by photodetectors. In some embodiments each data channel is routed into a corresponding plurality of waveguides, with each of the corresponding plurality of waveguides providing light to the same photodetector. In some embodiments at least some receive side electronic circuitry, other than photodetectors, is stacked on top of the PLC.
    Type: Application
    Filed: December 17, 2020
    Publication date: November 11, 2021
    Inventors: Bardia Pezeshki, Hindrik Bulthuis, Ramsey Selim, Andrew Grant, Lucas Soldano, Owen Shea, Josef Wendland, Jamie Stokes, Suresh Rangarajan, Josh Oen, Ron Zhang, Rob Kalman, Drew Lundsten
  • PARALLEL OPTICAL COMMUNICATION CHANNELS USING MICROLEDS
    Publication number: 20210320721
    Abstract: Coupling of light from large angular distribution microLEDs into smaller angular acceptance distribution of transmission channels is performed using optical elements.
    Type: Application
    Filed: April 13, 2021
    Publication date: October 14, 2021
    Inventors: Robert T. Weverka, Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • OPTICALLY-ENHANCED MULTICHIP PACKAGING
    Publication number: 20210320718
    Abstract: Optical chip-to-chip interconnects may use microLEDs as light sources. The interconnected chips may be on a same substrate. A pair of endpoint chips may each have associated optical transceiver subsystems, with transceiver circuitry in transceiver chips. Optical communications may be provided between the optical transceiver subsystems, with the optical transceiver subsystems in communication with their associated endpoint chips by way of metal layers in the substrate.
    Type: Application
    Filed: April 13, 2021
    Publication date: October 14, 2021
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • COUPLING MICROLEDS TO OPTICAL COMMUNICATION CHANNELS
    Publication number: 20210318503
    Abstract: Light from one or more microLEDs may be coupled into multiple waveguide cores. Parabolic reflectors, truncated parabolic reflectors, and encapsulants may be used to increase fraction of emitted light coupled into the waveguide cores.
    Type: Application
    Filed: April 13, 2021
    Publication date: October 14, 2021
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • INTERCONNECT NETWORKS USING MICROLED-BASED OPTICAL LINKS
    Publication number: 20210320726
    Abstract: Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.
    Type: Application
    Filed: April 13, 2021
    Publication date: October 14, 2021
    Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
  • LED ARRAY FOR IN-PLANE OPTICAL INTERCONNECTS
    Publication number: 20210296292
    Abstract: An LED array on a sapphire substrate may be mounted on a silicon interconnect chip, with LEDs of the array inserted into holes of waveguides on the silicon interconnect chip. The sapphire substrate and the silicon interconnect chip may both have microbumps for carrying electrical signals to or from the LEDs, and the sapphire substrate and silicon interconnect chip may be bonded together using the microbumps. The LEDs may be configured to preferentially emit light in a lateral direction, for increased coupling of light into the waveguides.
    Type: Application
    Filed: March 17, 2021
    Publication date: September 23, 2021
    Inventors: Michael Krames, Bardia Pezeshki, Robert Kalman, Cameron Danesh
  • SYSTEMS USING MICROLED-BASED INTERCONNECTS
    Publication number: 20210208346
    Abstract: Optical interconnect topologies may be provided using microLEDs. The topologies may interconnect ICs. The optical interconnect topologies may be used in some instances in place of electrical busses.
    Type: Application
    Filed: January 8, 2021
    Publication date: July 8, 2021
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • PACKAGING FOR MICROLEDS FOR CHIP TO CHIP COMMUNICATION
    Publication number: 20210208337
    Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.
    Type: Application
    Filed: January 8, 2021
    Publication date: July 8, 2021
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • OPTICAL TRANSCEIVER DESIGN FOR SHORT DISTANCE COMMUNICATION SYSTEMS BASED ON MICROLEDS
    Publication number: 20210211331
    Abstract: MicroLEDs may be used for short-range optical communications. Signal equalization may be used to decrease distortion in transmitted and/or received information, including with the use of multi-level modulation formats.
    Type: Application
    Filed: January 8, 2021
    Publication date: July 8, 2021
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • HIGH SPEED AND MULTI-CONTACT LEDS FOR DATA COMMUNICATION
    Publication number: 20210151623
    Abstract: An LED may include a third contact, for example to increase speed of operation of the LED. The LED with the third contact may be used in an optical communication system, for example a chip-to-chip optical interconnect.
    Type: Application
    Filed: November 18, 2020
    Publication date: May 20, 2021
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • HIGH SPEED AND MULTI-CONTACT LEDS FOR DATA COMMUNICATION
    Publication number: 20210152244
    Abstract: An LED may have structures optimized for speed of operation of the LED. The LED may be a microLED. The LED may have a p? doped region with one or more quantum wells instead of an intrinsic region. The LED may have etched vias therethrough.
    Type: Application
    Filed: November 18, 2020
    Publication date: May 20, 2021
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • OPTICAL INTERCONNECTS USING MICROLEDS
    Publication number: 20210080664
    Abstract: MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.
    Type: Application
    Filed: September 14, 2020
    Publication date: March 18, 2021
    Inventors: Bardia Pezeshki, Robert Kalman
  • Optical interconnect for switch applications
    Patent number: 10890719
    Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: January 12, 2021
    Assignee: T&S Communications Co., Ltd.
    Inventors: John Heanue, Bardia Pezeshki, Charles Amsden, Lucas Soldano
  • CHIP-SCALE OPTICAL INTERCONNECT USING MICROLEDS
    Publication number: 20200411587
    Abstract: In package intra-chip and/or inter-chip optical communications are provided using microLEDs and photodetectors mounted to integrated circuit (IC) chips and/or to transceiver dies associated with the IC chips. Light from the LEDs may pass through waveguides on or in a substrate to which the IC chips are mounted or which couple the IC chips.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Bardia Pezeshki, Robert Kalman
  • STACKED TRANSCEIVER ARCHITECTURE
    Publication number: 20200386956
    Abstract: An optical transceiver may include a circuit board, lasers, and a PLC including optical multiplexers and demultiplexers. The PLC may be coupled to fiber optic lines at a forward edge of the PLC, with a rear edge of the PLC receiving light for transmission generated by the lasers. Light received at the forward edge of the PLC may be demultiplexed into data channels and routed to a top surface of the PLC for optoelectronic conversion by photodetectors. In some embodiments each data channel is routed into a corresponding plurality of waveguides, with each of the corresponding plurality of waveguides providing light to the same photodetector. In some embodiments at least some receive side electronic circuitry, other than photodetectors, is stacked on top of the PLC.
    Type: Application
    Filed: December 20, 2019
    Publication date: December 10, 2020
    Inventors: Bardia Pezeshki, Hendrick Bulthuis, Ramsey Selim, Andrew Grant, Lucas Soldano, Owen Shea, Josef Wendland, Jamie Stokes, Suresh Rangarajan, Josh Oen, Ron Zhang, Rob Kalman, Drew Lundsten
  • OPTICAL INTERCONNECT FOR SWITCH APPLICATIONS
    Publication number: 20200355871
    Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array.
    Type: Application
    Filed: November 26, 2019
    Publication date: November 12, 2020
    Inventors: John Heanue, Bardia Pezeshki, Charles Amsden, Lucas Soldano
  • TRANSCEIVER HIGH DENSITY MODULE
    Publication number: 20200326482
    Abstract: An optical coupler couples light from waveguides of a photonic integrated circuit (PIC) to output waveguides, for example waveguides of a planar lightwave circuit (PLC). The optical coupler includes optical elements having different optical properties. In some embodiments the optical properties vary to account for waveguide angled facets in the PIC, and in some embodiments the optical properties vary to account for the PIC being mounted at an angle compared to the PLC, or optical coupler.
    Type: Application
    Filed: November 19, 2019
    Publication date: October 15, 2020
    Inventors: Bardia Pezeshki, Ramsey Selim, John Heanue, Henk Bulthuis, Susannah Heck
  • Optical module for terabit switch
    Patent number: 10782472
    Abstract: A switch module includes a switch integrated circuit (IC), a photonic integrated circuit (PIC), and a planar lightwave circuit (PLC). The PIC may include a plurality of light sources, an optical splitter, and a plurality of modulators. A dual MEMS may be used to align lens arrays, which may be used to couple light from the PIC to the PLC.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: September 22, 2020
    Assignee: BROADEX TECHNOLOGIES UK LTD.
    Inventors: Bardia Pezeshki, Dinh Ton, Susannah Heck, Gideon Yoffe, Lucas Soldano, Henk Bulthuis, Suresh Rangarajan, Jamie Stokes, Ramsey Selim
  • OPTICAL MODULE FOR TERABIT SWITCH
    Publication number: 20200249395
    Abstract: A switch module includes a switch integrated circuit (IC), a photonic integrated circuit (PIC), and a planar lightwave circuit (PLC). The PIC may include a plurality of light sources, an optical splitter, and a plurality of modulators. A dual MEMS may be used to align lens arrays, which may be used to couple light from the PIC to the PLC.
    Type: Application
    Filed: March 27, 2019
    Publication date: August 6, 2020
    Inventors: Bardia Pezeshki, Dinh Ton, Susannah Heck, Gideon Yoffe, Lucas Soldano, Henk Bulthuis, Suresh Rangarajan, Jamie Stokes, Ramsey Selim