Abstract: Embodiments of the present invention are directed to an interlacing boot and methods of using the same to automatically interleave optical fibers in a two-row array, such from a two rows ferrule. In a non-limiting embodiment of the invention, the optical fibers are inserted into a first end of an interlacing boot in a first direction. The interlacing boot can include a guiding structure having one or more channels. Each channel can be adapted to receive a single optical fiber. Each channel can include a first end and a second end, and the second end can be offset with respect to the first end in a second direction orthogonal to the first direction. The interlacing boot can be pushed towards the ferrule to feed the optical fibers through the guiding structure. The first row of fibers can be physically offset from and interlaced with the second row of fibers by the guiding structure.

Abstract: A structural feature of an optical connector assembly in which an optical chip is connectable with a fixed ferrule via a waveguide and is joined onto a section of a substrate. The structural feature includes a structural section disposed on one of the optical chip and the substrate and a ferrule support section that extends from the structural section and comprises a surface for adhesion to the fixed ferrule.

Abstract: A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.

Abstract: A structural feature of an optical connector assembly in which an optical chip is connectable with a fixed ferrule via a waveguide and is joined onto a section of a substrate. The structural feature includes a structural section disposed on one of the optical chip and the substrate and a ferrule support section that extends from the structural section and comprises a surface for adhesion to the fixed ferrule.

Abstract: A magneto-optical waveguide device includes a waveguide coupled with a magneto-optical crystal material. The magneto-optical waveguide device includes a patterned nanostructure within the magneto-optical crystal material that includes an internal optical waveguide through the magneto-optical crystal material. The patterned nanostructure modifies the refractive index of the magneto-optical crystal material below diffraction limit. The patterned nanostructure creates metamaterial effective properties that optimize core-cladding inside the magneto-optical crystal material to create the optical waveguide.

Abstract: Embodiments of the present invention are directed to an interlacing boot and methods of using the same to automatically interleave optical fibers in a two-row array, such from a two rows ferrule. In a non-limiting embodiment of the invention, the optical fibers are inserted into a first end of an interlacing boot in a first direction. The interlacing boot can include a guiding structure having one or more channels. Each channel can be adapted to receive a single optical fiber. Each channel can include a first end and a second end, and the second end can be offset with respect to the first end in a second direction orthogonal to the first direction. The interlacing boot can be pushed towards the ferrule to feed the optical fibers through the guiding structure. The first row of fibers can be physically offset from and interlaced with the second row of fibers by the guiding structure.

Abstract: A magneto-optical waveguide device includes a waveguide coupled with a magneto-optical crystal material. The magneto-optical waveguide device includes a patterned nanostructure within the magneto-optical crystal material that includes an internal optical waveguide through the magneto-optical crystal material. The patterned nanostructure modifies the refractive index of the magneto-optical crystal material below diffraction limit. The patterned nanostructure creates metamaterial effective properties that optimize core-cladding inside the magneto-optical crystal material to create the optical waveguide.

Abstract: Embodiments of the present invention are directed to an interlacing boot and methods of using the same to automatically interleave optical fibers in a two-row array, such from a two rows ferrule. In a non-limiting embodiment of the invention, the optical fibers are inserted into a first end of an interlacing boot in a first direction. The interlacing boot can include a guiding structure having one or more channels. Each channel can be adapted to receive a single optical fiber. Each channel can include a first end and a second end, and the second end can be offset with respect to the first end in a second direction orthogonal to the first direction. The interlacing boot can be pushed towards the ferrule to feed the optical fibers through the guiding structure. The first row of fibers can be physically offset from and interlaced with the second row of fibers by the guiding structure.

Abstract: A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.

Abstract: An approach compatible with high volume manufacturing for assembling a photonic chip with integrated optical fibers involving placing a die on an assembly station, providing one or more optical fibers, placing the one or more optical fibers into corresponding one or more grooves of the die, bonding the one or more optical fibers to the die and performing an optical test of the die using the one or more optical fibers, and severing the one or more optical fibers. The die can be removed from the assembly station while retaining a predetermined length of each severed optical fiber and the one or more optical fibers can be prepared for assembly to a next die.

Abstract: Systems and methods for nanofiller in an optical interface are provided. One system includes a fiber-optic interface for one or more optical fibers that includes a body including one or more grooves defined therein. At least one groove in the one or more grooves is configured to receive a corresponding optical fiber of the one or more optical fibers. The at least one groove of the one or more grooves is further configured to receive an adhesive to attach the body to a portion of the corresponding optical fiber. Further, fiber-optic interface includes a suspended structure associated with the at least one groove configured to couple light between the suspended structure and the corresponding optical fiber. Also, the adhesive comprises nanofiller configured to support an alignment of the suspended structure with the corresponding optical fiber within the at least one groove.

Abstract: A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.

Abstract: A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.

Abstract: An approach compatible with high volume manufacturing for assembling a photonic chip with integrated optical fibers involving placing a die on an assembly station, providing one or more optical fibers, placing the one or more optical fibers into corresponding one or more grooves of the die, bonding the one or more optical fibers to the die and performing an optical test of the die using the one or more optical fibers, and severing the one or more optical fibers. The die can be removed from the assembly station while retaining a predetermined length of each severed optical fiber and the one or more optical fibers can be prepared for assembly to a next die.