Abstract: A system for delivering shape memory alloy prosthesis includes a catheter, a fluid injector and a controller. The catheter includes a fluid lumen coupled to the fluid injector and one or more openings at its distal end which are at least partially disposed beneath the prosthesis. The catheter further includes a thermocouple at its distal end for monitoring the temperature of the prosthesis in situ to minimize thermal damage to fluids and tissue within the body lumen. A fluid is heated to an initial temperature, and then delivered through the openings to the prosthesis, and thermal energy is directly transferred to the prosthesis to expand the prosthesis at a temperature above the body temperature. The temperature and flow rate of the fluid is precisely controlled such that the prosthesis is expanded, and thermal damage to the body lumen is minimized.

Abstract: A stent for implanting in a blood vessel following balloon angioplasty to prevent restenosis. The stent is a helical coil of a shape memory alloy tape or wire. The coil has a diameter less than that of the blood vessel in which it is to be implanted. The tape or wire has previously been wound to form a helical coil having a diameter equal to or slightly greater than the inside diameter of said blood vessel, this coil is than heated to an elevated temperature for a time sufficient to fix the shape of the second mentioned coil in the memory of the tape or wire, cooled to ambient temperature and then rewound to form the first mentioned helical coil.

Abstract: Apparatus and method for breaking a scribed semiconductor wafer and the like. The apparatus includes a wafer support which is movable with respect to a breaker arm having a knife-edge. The breaker arm is actuated pneumatically or by other similar means to impart a shock or impulse to the wafer along each of the wafer scribe lines so as to fracture the wafer. A control mechanism is provided for automatically alternately stepping the wafer position with respect to the breaker arm and actuating the breaker arm. Once the entire wafer has been broken along one axis, the wafer is rotated ninety degrees and the sequence is repeated along the other axis.

Abstract: An improved cutting wheel for dicing semiconductor wafers is described. The cutting blade of the wheel is a thin disc consisting of finely divided abrasive particles embedded in a nickel matrix. The surface of the nickel is overlaid with a thin layer of chromium which is electrolytically deposited on it. The cutting speed and useful life of the wheel are both increased by the presence of the chromium overlay.