Patents by Inventor Barry A. Hochlowski

Barry A. Hochlowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Injection molded solder ball method
    Patent number: 7955966
    Abstract: Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: June 7, 2011
    Assignee: International Business Machines Corporation
    Inventors: Peter A. Gruber, Barry A. Hochlowski, David T. Naugle
  • INJECTION MOLDED SOLDER BALL METHOD
    Publication number: 20090309219
    Abstract: Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
    Type: Application
    Filed: August 19, 2009
    Publication date: December 17, 2009
    Applicant: IBM Corporation
    Inventors: Peter A. Gruber, Barry A. Hochlowski, David T. Naugle
  • INJECTION MOLDED SOLDER BALL METHOD
    Publication number: 20080164609
    Abstract: Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
    Type: Application
    Filed: January 8, 2007
    Publication date: July 10, 2008
    Applicant: International Business Machines Corporation
    Inventors: Peter A. Gruber, Barry A. Hochlowski, David T. Naugle