Abstract: The present invention features a packaging system for two-dimensional optoelectronic arrays. In one embodiment, the packaging includes a heat spreader, a housing with embedded electrical interconnections, a substrate including electrical contacts, an application specific integrated circuit (ASIC) including a hybridized array with vertical cavity surface emitting laser (VCSEL), detectors or both. The waveguide assembly includes a plurality of individual one-dimensional waveguides formed in waveguide sheets, wherein the waveguides match the array footprint on one end and a connector footprint on the other end.

Abstract: The invention in the simplest form is a low-profile optical waveguide assembly for interfacing a two-dimensional optoelectronic array to standard fiber bundles. The present invention serves both to bend light and fan out light-carrying guides and to transition from the optoelectronic array pitch to an industry standard pitch for connectorization. There are several embodiments considered herein, however the preferred embodiments are for an optical waveguide assembly that includes a waveguide housing supporting a plurality of waveguide sheets, each sheet includes an array of waveguides feeding a plurality of industry standard ferrules.

Abstract: The present invention features a packaging system for two-dimensional optoelectronic arrays. In one embodiment, the packaging includes a heat spreader, a housing with embedded electrical interconnections, a substrate including electrical contacts, an application specific integrated circuit (ASIC) including a hybridized array with vertical cavity surface emitting laser (VCSEL), detectors or both. The waveguide assembly includes a plurality of individual one-dimensional waveguides formed in waveguide sheets, wherein the waveguides match the array footprint on one end and a connector footprint on the other end.