Abstract: A curved high intensity focused ultrasound (HIFU) transducer comprising a curved piezoelectric array having opposite convex and concave surfaces, the concave surface being a transmitting surface, and a plurality of acoustic transmission areas, a plurality of electrodes located on the surfaces of the curved piezoelectric array for applying electrical transmit signals to the acoustic transmission areas, and a unitary, continuously formed curved matching layer pre-formed to the desired curvature of the curved transducer array and bonded to the transmitting surface of the curved piezoelectric array which provides acoustic matching and electrical isolation for the transmitting surface of the curved piezoelectric array.

Abstract: A curved high intensity focused ultrasound (HIFU) transducer comprising a curved piezoelectric array having opposite convex and concave back surfaces, the front surface comprising an acoustic transmitting surface, and a plurality of electrodes located on the convex back surface for applying electrical transmit signals to the array, and a printed circuit board spaced apart from and in opposition to the back surface of the curved piezoelectric array which couples electrical signals to the electrodes of the array, the space between the printed circuit board and the curved piezoelectric array comprising an acoustic air backing passageway of the piezoelectric array for air-cooling the curved piezoelectric array and the printed circuit board.

Abstract: A high intensity focused ultrasound (HIFU) transducer comprising a piezoelectric array with a layer of piezoelectric material having a patient-facing front surface and a back surface, the front surface comprising a transmitting surface, and a plurality of electrodes located on the front and back surfaces of the piezoelectric material for applying electrical signals to the piezoelectric array. Electrical connections between an electrode on the back surface to an electrode on the front surface of the piezoelectric array are made through non-magnetic conductive vias extending through the layer of piezoelectric material.

Abstract: A high intensity focused ultrasound (HIFU) transducer comprising a piezoelectric array with a layer of piezoelectric material having a patient-facing front surface and a back surface, the front surface comprising a transmitting surface, and a plurality of electrodes located on the front and back surfaces of the piezoelectric material for applying electrical signals to the piezoelectric array. Electrical connections between an electrode on the back surface to an electrode on the front surface of the piezoelectric array are made through non-magnetic conductive vias extending through the layer of piezoelectric material.

Abstract: A curved high intensity focused ultrasound (HIFU) transducer comprising a curved piezoelectric array having opposite convex and concave surfaces, the concave surface being a transmitting surface, and a plurality of acoustic transmission areas, a plurality of electrodes located on the surfaces of the curved piezoelectric array for applying electrical transmit signals to the acoustic transmission areas, and a unitary, continuously formed curved matching layer pre-formed to the desired curvature of the curved transducer array and bonded to the transmitting surface of the curved piezoelectric array which provides acoustic matching and electrical isolation for the transmitting surface of the curved piezoelectric array.

Abstract: A curved high intensity focused ultrasound (HIFU) transducer comprising a curved piezoelectric array having opposite convex and concave back surfaces, the front surface comprising an acoustic transmitting surface, and a plurality of electrodes located on the convex back surface for applying electrical transmit signals to the array, and a printed circuit board spaced apart from and in opposition to the back surface of the curved piezoelectric array which couples electrical signals to the electrodes of the array, the space between the printed circuit board and the curved piezoelectric array comprising an acoustic air backing passageway of the piezoelectric array for air-cooling the curved piezoelectric array and the printed circuit board.